NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.
Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.
An official website of the United States government
Here’s how you know
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Microwave Characterization of Flip-Chip MMIC Interconnections
Published
Author(s)
Roger Marks, Jeffrey A. Jargon, C. K. Pao, C. P. Wen
Abstract
Abstract: We report accurate on-wafer measurements of transmission lines on flip-chip coplanar-waveguide MMICs. The effects are difficult to predict theoretically, and, without custom standards and unique calibration software, measurements would be intractable. The results are applicable to the development of an accurate CAD database. We also repolt and apply a new technique for the measurement of transmission line capacitance.
Marks, R.
, Jargon, J.
, Pao, C.
and Wen, C.
(1995),
Microwave Characterization of Flip-Chip MMIC Interconnections, Proc., 1995 IEEE MMT-S Intl. Microwave Symp., Orlando, FL, [online], https://doi.org/10.1109/MWSYM.1995.406249
(Accessed October 9, 2025)