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Microwave Characterization of Flip-Chip MMIC Interconnections

Published

Author(s)

Roger Marks, Jeffrey A. Jargon, C. K. Pao, C. P. Wen

Abstract

Abstract: We report accurate on-wafer measurements of transmission lines on flip-chip coplanar-waveguide MMICs. The effects are difficult to predict theoretically, and, without custom standards and unique calibration software, measurements would be intractable. The results are applicable to the development of an accurate CAD database. We also repolt and apply a new technique for the measurement of transmission line capacitance.
Proceedings Title
Proc., 1995 IEEE MMT-S Intl. Microwave Symp.
Volume
3
Conference Dates
May 15-16, 1995
Conference Location
Orlando, FL

Citation

Marks, R. , Jargon, J. , Pao, C. and Wen, C. (1995), Microwave Characterization of Flip-Chip MMIC Interconnections, Proc., 1995 IEEE MMT-S Intl. Microwave Symp., Orlando, FL, [online], https://doi.org/10.1109/MWSYM.1995.406249 (Accessed April 17, 2024)
Created May 1, 1995, Updated November 10, 2018