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Displaying 50926 - 50950 of 73994

Gray calibration of digital cameras to meet NIST mugshot best practice:

January 1, 1999

Author(s)

Mike Rubinfeld, Charles Wilson

Group Delay Errors Due to Coherent Interference

January 1, 1999

Author(s)

F G. Ascarrunz, Tom Parker, Steven R. Jefferts

GSA guide to specifying interoperable building automation and control systems using ANSIASHRAE Standard 135-1995, BACnet:

January 1, 1999

Author(s)

Steven T Bushby, H Michael Newman, Martin A Applebaum

Guidance to Users of Nycomed-Amersham and North American Scientific 125 I Interstitial Sources: Dosimetry and Calibration Changes: Recommendations of the American Association of Physicists in Medicine Radiation Therapy Committee Ad Hoc Subcommit

January 1, 1999

Author(s)

J F. Williamson, Bert M. Coursey, Larry A. DeWerd, W F. Hanson, Ravinder Nath, Geoffrey S. Ibbott

Guideline for implementing cryptography in the federal government:

January 1, 1999

Author(s)

Annabelle Lee

H out-diffusion and device performance in n-i-p solar cells utilizing high temperature hot wire a-Si:H i-layers, ed. by R. Schropp et al.

January 1, 1999

Author(s)

A H. Mahan, A C. Gallagher

Heat flux transducer calibration::summary of the 2nd workshop

January 1, 1999

Author(s)

William L Grosshandler

HG + Optical frequency Standard: Recent Progress

January 1, 1999

Author(s)

B C. Young, R J. Rafac, J A. Beall, F C. Cruz, Wayne M. Itano, David J. Wineland, James C. Bergquist

High Heat Flux Sensors Calibration in a Cooled Enclosure

January 1, 1999

Author(s)

A V. Murthy, Benjamin K. Tsai, Robert D. Saunders

High Speed Grinding of Silicon Nitride with Electroplated Diamond Wheels, II. Wheel Topography and Grinding Mechanisms

January 1, 1999

Author(s)

T W. Hwang, S Malkin, Christopher J. Evans

This is the second in a series of two papers concerned with high speed grinding of silicon nitride with electroplated diamond wheels. In a companion paper, it was shown that grinding of silicon nitride is accompanied by dulling of the abrasive grains and a

High-Accuracy Aperture-Area Measurement Facilities at the National Institute of Standards and Technology

January 1, 1999

Author(s)

J B. Fowler, R S. Durvaula, Albert C. Parr

High-Density Polyethylene Dosimetry by Transvinylene FTIR Analysis

January 1, 1999

Author(s)

W L. Mclaughlin, J Silverman, M Al-sheikhly, W J. Chappas, Z -. Liu, A Miller, W Batsberg-pedersen

Hydrodynamic Excitations of Trapped Fermi Gases

January 1, 1999

Author(s)

G M. Bruun, Charles W. Clark

Identification of Materials in Integrated Circuit Interconnects Using X-Ray Absorption Near Edge Spectroscopy

January 1, 1999

Author(s)

Zachary H. Levine, Bruce D. Ravel

Most integrated circuit interconnects are principally composed of a few metals, including aluminum alloyed with copper, tungsten, titanium, A1 3 Ti, and A1 2Cu, in a silica matrix. Integrated circuit interconnects have recently been proposed as a candidate

Identification of Materials in Integrated Circuit Interconnects Using X-Ray Absorption Near-Edge Spectroscopy

January 1, 1999

Author(s)

Zachary H. Levine, B D. Ravel

Imaging of Surface Wave Slowness

January 1, 1999

Author(s)

D Xiang, Gerald V. Blessing, Nelson N. Hsu

An experimental method has been devised for imaging the acoustic surface wave slowness (inverse of the phase velocity) in anisotropic solids. This technique utilizes a specially designed broadband, line-focus ultrasonic transducer to sense the leaky

Impact of Variable Pulse Pressure and Nonlinear Propagation on Industrial Ultrasonic NDE Measurement Interpretation and Uncertainty

January 1, 1999

Author(s)

John A. Slotwinski

Nominally identical ceramic-element ultrasonic transducers of the type used in the aerospace and metals industries for nondestructive evaluation (NDE) often have large variability in the peak pressure of the generated ultrasonic pulses. The generated

Implementing a Standards-Based Distributed Measurement and Control Application on the Internet

January 1, 1999

Author(s)

Richard D. Schneeman

The distributed measurement and control (DMC) industry is migrating away from proprietary hardware and software platforms in favor of open and standardized approaches. High-level programming languages, object-oriented platforms, Internet technology, and

Implementing a standards-based distribution measurement and control application on the internet:

January 1, 1999

Author(s)

Richard D Schneeman

Improved VO 2 Microbolometers for Infrared Imaging: Operation on the Semiconducting-Metallic Phase Transition with Negative Electrothermal Feedback

January 1, 1999

Author(s)

Carl D. Reintsema, Erich N. Grossman, Jonathan A. Koch

We have investigated the performance of VO 2 microbolometers biased on the semiconducting-metal phase transition with negative electrothermal feedback. We deposited crystalline thin films of phase-pure VO 2, patterned these films into useful test

Improved-accuracy Tristimulus Colorimeters Calibrated with Standard Detectors

January 1, 1999

Author(s)

George P. Eppeldauer

In Line Study of Droplet Deformation in Polymer Blends in Channel Flow

January 1, 1999

Author(s)

Kalman D. Migler, Erik K. Hobbie, F Qiao

In-Line Dielectric Sensor for Chemical Composition Measurements in Molten Polymers

January 1, 1999

Author(s)

M M. McBrearty, Anthony J. Bur, S Perusich

We describe a dielectric sensor that incorporates a flow-through design so that it can be placed in-line on an extruder. Dielectric measurements have been successfully applied for measuring additive concentrations in polymer melts during extrusion

In-Line Investigation of Shear-Induced Morphology Transition in Liquid Crystalline Polymer/PET Blends

January 1, 1999

Author(s)

F Qiao, Kalman D. Migler, Charles C. Han

In-Situ Monitoring of Product Shrinkage During Injection Molding Using an Optical Sensor

January 1, 1999

Author(s)

C L. Thomas, Anthony J. Bur

We have used an optical fiber sensor for in-situ monitoring of product shrinkage during injection molding. The sensor, consisting of a bundle of optical fibers with a sapphire window at its end, is positioned in the ejector pin channel of the mold so that

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