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Displaying 48676 - 48700 of 73830

H. H. Ku, 1918-1999

January 1, 2000
Author(s)
C M. Croarkin, Joan R. Rosenblatt
A short obituary article on Hsien Hsiang (Harry) Ku, former Chief of the Statistical Engineering Division at the National Institute of Standards and Technology (NIST), who died of cancer on June 4, 1999, at his home in Kensington, MD.

High Resolution g-Ray Spectroscopy: the First 85 Years

January 1, 2000
Author(s)
R Deslattes
This opening review attempts to follow the main trends in crystal diffraction spectrometry of nuclear γ-rays from its 1914 beginning in Rutherford's laboratory to the ultra-high resolution instrumentation realized in the current generation of spectrometers

High-Speed Machining Frequency Response Prediction for Process Optimization

January 1, 2000
Author(s)
Tony L. Schmitz, Matthew A. Davies, Michael Kennedy
As interest in high-speed machining techniques grows among world manufacturers, efficient methods for obtaining the tool point frequency response (used as input to analytic or numerical chatter prediction/avoidance models) become more important. We

Hsien Hsiang Ku - Obituary

January 1, 2000
Author(s)
C M. Croarkin, Joan R. Rosenblatt
A short obituary article on Hsien Hsiang (Harry) Ku, former Chief of the Statistical Engineering Division at the National Institute of Standards and Technology (NIST), who died of cancer on June 4, 1999, at his home in Kensington, MD.

Human Mitochondrial Genetics

January 1, 2000
Author(s)
L A. Tully, Barbara C. Levin
The field of human mitochondrial genetics has advanced way beyond where the Human Genome Project hopes to be by the year 2003, the projected year for completing the sequence of the entire human nuclear DNA genome. Not only has the mitochondrial DNA (mtDNA)

IC Test Structures for Multi-Layer Interconnect Stress Determination

January 1, 2000
Author(s)
S. A. Smee, Michael Gaitan, Donald B. Novotny, Yogendra K. Joshi, David L. Blackburn
A new method for measuring strain in multi-layer IC interconnects is presented. This method utilizes process compatible micromachined test structures and is applied to the determination of longitudinal interconnect stress in a standard dual-metal-layer

IEEE 1451: A Standard in Support of Smart Transducer Networking

January 1, 2000
Author(s)
Kang B. Lee
The IEEE (Institute of Electrical and Electronics Engineers) 1451 smart transducer interface standards provide the common interface and enabling technology forr the connectivity of transducers to microprocessors, control and field networks, and data

Immobilizing a Fluorescent Dye Offers Potential to Investigate the Glass/Resin Interface

January 1, 2000
Author(s)
Joseph~undefined~undefined~undefined~undefined~undefined Lenhart, J H. VanZanten, Joy Dunkers, C G. Zimba, C A. James, S K. Pollack, Richard~undefined~undefined~undefined~undefined~undefined Parnas
Silane coupling agents are commonly applied to glass fibers to promote fiber/resin adhesion and enhance durability in composite parts. In this study, a coupling agent layer on glass was doped with trace levels of the dimethylaminonitrostilbene (DMANS)
Displaying 48676 - 48700 of 73830
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