Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Search Publications

NIST Authors in Bold

Displaying 45751 - 45775 of 74084

Contact Fracture of Brittle Bilayer Coatings on Soft Substrates

January 1, 2001
Author(s)
P Miranda, Antonia Pajares, F Guiberteau, F Cumbrera, Brian R. Lawn
Contact-induced fracture modes in trilayers consisting of a brittle bilayer coating on a soft substrate was investigated. Experiments are performed on model transparent glass/sapphire/polycarbonate structures bonded with epoxy adhesive, to enable in situ

Continuous Parallel Fiber Composites: Fracture

January 1, 2001
Author(s)
B S. Majumdar, Donald L. Hunston
The objective in this chapter is to briefly review the fracture behavior of unidirectional composites with special attention to mechanisms that have been developed to improve toughness. The focus is on failure involving the propagation of cracks for

Corrosion Behavior of Weldable Fe-Al Alloys in Oxidizing-Sulfidizing Environments

January 1, 2001
Author(s)
Stephen W. Banovic, J N. DuPont, A R. Marder
Weld overlay coatings are typically used to protect existing low alloy steel water-wall panels from accelerated sulfidation attack in fossil-fired boilers with advanced low NO x burners. A material system presently under consideration for use as a cladding

Crystallization of Isotactic Polystyrene in Thin Films: A High Throughput Approach

January 1, 2001
Author(s)
Kathryn L. Beers, Jack F. Douglas, Eric J. Amis, Alamgir Karim
Very thin films of semi-crystalline polymers are increasingly being employed in coatings applications and there is a need to better understand how film thickness and crystallization conditions influence the crystalline morphology and resultingfilm

Cu Electrodeposition for On-Chip Interconnections

January 1, 2001
Author(s)
Gery R. Stafford, Thomas P. Moffat, V D. Jovic, David R. Kelley, John E. Bonevich, Daniel Josell, Mark D. Vaudin, N G. Armstrong, W H. Huber, A Stanishevsky
The electrochemical behavior of copper in copper sulfate - sulfuric acid, containing various combinations of NaCl, sodium 3 mercapto-1 propanesulfonate (MPSA), and polyethylene glycol (PEG) is examined. The i-E deposition characteristics of the

Damage Evolution During Microcracking of Brittle Solids

January 1, 2001
Author(s)
A Zimmermann, W Carter, Lin-Sien H. Lum
Microcracking due to thermal expansion anisotropy is considered based on a finite element model. A polycrystalline microstructure is generated via Monte Carlo simulation. Microcrack formation is investigated using a Griffith-type failure criterion. The
Displaying 45751 - 45775 of 74084