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Andras Vladar, Michael T. Postek, John S. Villarrubia
This study of SEM resolution is occasioned by concerns that it is no longer adequate for lithography process control in integrated circuit manufacturing. For example, according to the most recent International Technology Roadmap for Semiconductors, the in
Xuezeng Zhao, Theodore V. Vorburger, Joseph Fu, Jun-Feng Song, C Nguyen
Nano-scale linewidth measurements are performed in semiconductor manufacturing and in the data storage industry and will become increasingly important in micro-mechanical engineering. With the development of manufacturing technology in recent years, the
The application of high pressure or environmental microscopy techniques is not new to scanning electron microscopy. However, application of this methodology to semiconductor metrology is new because of the combined need for implementation of high
Dark matter, according to a model of strong, weak, and electromagnetic interactions of elementary particles called the SWEEP model, is composed of beauty baryons and neutrions. In this model, all particles are composed of only three basic particle: the
Jun-Feng Song, Li Ma, Eric P. Whitenton, Theodore V. Vorburger
The RM (Reference Material) 8240 standard bullets are currently under development at the National Institute of Standards and Technology 9NIST) to support the coming National Integrated Ballistics Information Network (NIBIN). A bullet signature measurement
Accurate computed optical images of lines and trenches placed on semiconductors are of great interest to the manufacturers of computer components, especially in the overlay process for different layers. These images do not accurately reflect the form of
Tony L. Schmitz, Christopher J. Evans, Angela Davies, William T. Estler
Interferometric radius measurements may be completed using a radius bench, where radius is defined as the displacement between the confocal and cat?s eye nulls (identified using a figure measuring interferometer). Measurements of a Zerodur sphere have been
The scanning electron microscope (SEM) produces images with signals generated through the interaction of the primary electrons and the sample material. The proper choice of electron beam forming and imaging parameters is essential to collect relevant
An alternative technique for semiconductor metrology and inspection that minimizes, if not eliminates the sample charging is environmental or high pressure scanning electron microscopy. It offers the advantage and possible application of higher landing
The present study demonstrates the feasibility of the h 5-cyclopentadienylcobalt ion (CpCo +) as a suitable cationization reagent for saturated hydrocarbons analysis by mass spectrometry. Ion/molecule reactions of CpCo + and three medium chain-length n
Jun-Feng Song, Theodore V. Vorburger, Robert A. Clary, Li Ma, M Ols, Eric P. Whitenton
Standard bullets and casings are currently under development to support the National Integrated Ballistics Information System (NIBIN) in the U.S. Based on a numerically controlled diamond turning technique, 20 RM 8240 standard bullets were fabricated in
A general discussion of the scattering of plane monochromatic waves by dielectric wedges precedes this paper. Numerical solutions of the problem of scattering by a dielectric wedge of finite cross section, with special emphasis on the divergent behavior of
Michael T. Postek, Andras Vladar, Marylyn H. Bennett
Photomask dimensional metrology in the scanning electron microscope (SEM) has not evolved as rapidly as the metrology of resists and integrated circuit features on wafers. This has been due partly to the 4x (or 5x) reduction in the optical steppers and
Ndubuisi G. Orji, Theodore V. Vorburger, Xiaohong Gu, Jayaraman Raja
Line edge roughness (LER) is a potential showstopper for the semiconductor industry. As the width of patterned line structures decreases, LER is becoming a non-negligible contributor to resist critical dimension (CD) variation. The International Technology
Some of the components of the fields produced by an incident plane monochromatic wave scattered by a wedge diverge near the edge of the wedge. Rigorous solutions for the fields scattered by a perfectly conducting infinite wedge have been obtained, but this
Theodore V. Vorburger, Ndubuisi George Orji, Li Piin Sung, T Rodriguez
Surface finsih affects the performance of a wide variety of manufactured products ranging from road surfaces and ships to mechanical parts, microelectronics, and optics. Accordingly roughness values can vary over many orders of magnitude. A variety of
Ndubuisi G. Orji, Theodore V. Vorburger, Xiaohong Gu, Jayaraman Raja
A range of surface texture measurement instruments is available in the market place. Most of the measurement instruments are microcomputer-based systems that contain their own surface analysis software to evaluate measured roughness profiles. After a
Steven D. Phillips, Bruce R. Borchardt, A Abackerli, Craig M. Shakarji, Daniel S. Sawyer, P Murray, B Rasnick, K Summerhays, J M. Baldwin, M P. Henke
Task specific CMM measurement uncertainty statements can be generated using computer (Monte Carlo) simulation. Recently, commercial products using this powerful technique have become available; however they typically involve megabytes of code inaccessible
NIST is preparing to issue the next generation in its line of binary photomask linewidth standards. Called SRM 2059, it was developed for calibrating microscopes used to measure linewidths on photomasks, and consists of antireflecting chrome line and space
A workshop on Scanning Probe Microscope (SPM)-based Nanolithography was held at NIST Gaithersburg on November 24-25, 2003. The meeting was sponsored by the Precision Engineering Division, Manufacturing Engineering Laboratory, NIST, under a Research
J He, Martin Y. Chiang, Donald L. Hunston, Charles C. Han
The v-notch (losipescu) shear test was investigated as a mean for determining the in-plane shear modulus and strength of unidirectional hybrid composites. Two types of hybrid systems having different fiber tow volume fractions composed of carbon and glass
The last twenty five years have seen significant advances in the technology and theoretical models associated with the use of piston gauges for the measurement of both pneumatic and hydraulic pressure. Most notably, the incorporation of computers and
NIST is preparing to issue the next generation in its line of binary photomask linewidth standards. Called SRM 2059, it was developed for calibrating microscopes used to measure linewidths on photomasks, and consists of antireflecting chrome line and space