Projects/Programs

Displaying 1 - 7 of 7

Accurate Cure Kinetics, Stress, Mechanical Properties and Warpage

Ongoing

Advanced packaging involves increasingly challenging requirements for heterogeneous integration and chiplet packaging. Needs such as fine pitch interconnects

CalNet

Ongoing

Electronics engineers use on-wafer calibration die to calibrate measurement equipment before characterizing or modeling semiconductor devices. While NIST pioneered on-wafer calibrations in the 1990’s, most industrial labs use commercial ‘Impedance Standard Substrates’ (ISS) that are manufactured by

Characterization of Nano-to-Microscale Process-Induced Thermo-Mechanical Changes in Heterogeneously Integrated Microelectronics

Ongoing

Across the entire semiconductor industry, issues related to thermomechanical mismatches encountered during packaging are limiting factors in the design and fabrication of 3D modular integrated circuits. This project will develop novel and necessary metrologies for thermomechanical properties of

Metrology for Integration of New Magnetic Materials

Ongoing

Integration of magnetic materials remains a key challenge facing advanced packaging technologies. High power applications require voltage conversion at or near the die, and most practical power converters rely on inductors. Beyond power electronics, integration of magnetic components such as

Metrology of Materials, Surfaces, and Processes for Hybrid Advanced Packaging

Ongoing

The most important part of any bonding process is getting the surfaces to stick. While the physical properties of the films, surfaces, and interfaces in conjunction with the bonding process parameters (pressure, duration, temperature, and post bond anneal) all play important roles, altering the

Nanoscale, Element-Specific X-ray Imaging for Integrated Circuit Metrology

Ongoing

Industry roadmaps identify the characterization of nanoscale subsurface feature shape and composition as a measurement need for the semiconductor industry. However, IC interiors are difficult to probe post-manufacturing due to the presence of many close-packed and nanoscale subsurface features, of

Thermoreflectance Thermal Property Measurements for Heterogeneously Integrated Materials and Power Electronics

Ongoing

Thermal conductivity, heat capacity, and interface conductance are fundamental properties that govern semiconductor microelectronic devices, from materials discovery, to design and modeling, thermal management and device performance, and ultimately device reliability and operational lifespan. These

Advanced communications
-Open Radio Access Network (Open-RAN)
-Quantum communications
-Spectrum sharing
-Wireless (RF)
Bioscience
-Bioimaging
-Bioinformatics
-Biomanufacturing
-Biomaterials
-Cell biology
-Cell-free systems
-Engineering / synthetic biology
-Gene delivery systems
-Genome editing
-Genomics
-Glycomics
-Metabolomics
-Microbial measurements
-Proteomics
-Sequence screening
-Transcriptomics
Buildings and Construction
-Building codes and standards
-Building control systems
-Building damage and repair
-Building economics
-Building materials
-Energy efficiency
-Heating, ventilation and air conditioning equipment
-Indoor air quality
-Structural engineering
-Thermal comfort
Chemistry
-Analytical chemistry
-Chemical engineering and processing
-Chemical thermodynamics and chemical properties
-Molecular characterization
-Theoretical chemistry and modeling
-Thermochemical properties
Electronics
-Electromagnetics
-Flexible electronics
-Magnetoelectronics
-Optoelectronics
-Organic electronics
-Semiconductors
-Sensors
-Superconducting electronics
Energy
-Alternative energy
-Conventional energy
-Electric power / smart grid
-Fuels
Environment
-Air / water / soil quality
-Climate
-Environmental health
-Greenhouse gas measurements
-Marine science
-Sustainability
Fire
-Emergency building evacuation
-Fire detection
-Fire dynamics and science
-Fire fighting
-Fire modeling
-Fire risk reduction
-Materials flammability
-Structural fire resistance
-Wildland urban interface fire
Forensic Science
-Digital evidence
-Drugs and toxicology
-Firearms and toolmarks
-Forensic biometrics
-Forensic genetics
-Trace evidence
Health
-Biopharmaceuticals
-Cell and gene therapy
-Clinical diagnostics
-Dentistry
-Food and nutrition
-Human microbiome
-Medical imaging
-Precision medicine
-Regenerative medicine and advanced therapy
Information technology
-Artificial intelligence
--AI measurement and evaluation
--Applied AI
--Fundamental AI
--Hardware for AI
--Machine learning
--Trustworthy and responsible AI
-Biometrics
-Cloud computing and virtualization
-Complex systems
-Computational science
-Conformance testing
-Cyber-physical systems
--Smart cities
-Cybersecurity
--Cryptography
--Cybersecurity education and workforce development
--Cybersecurity measurement
--Identity and access management
--Privacy engineering
--Risk management
--Securing emerging technologies
--Trustworthy networks
--Trustworthy platforms
-Data and informatics
--Human language technology
--Information retrieval
--Natural language processing
-Federal information processing standards (FIPS)
-Health IT
-Internet of Things (IoT)
-Interoperability testing
-Location based services
-Mobile
-Networking
--Mobile and wireless networking
--Network management and monitoring
--Network modeling and analysis
--Network security and robustness
--Network test and measurement
--Next generation networks
--Protocol design and standardization
--Software defined and virtual networks
-Privacy
-Software research
--Software testing
-Usability and human factors
--Accessibility
-Video analytics
-Virtual / augmented reality
-Visualization research
-Voting systems
Infrastructure
Manufacturing
-Additive manufacturing
-Factory communications
-Factory operations planning and control
-Interoperability in manufacturing
-Machining
-Manufacturing economics
-Manufacturing quality assurance
-Manufacturing systems design and analysis
-Monitoring, diagnostics and prognostics
-Process improvement
-Process measurement and control
-Product data
-Robotics in manufacturing
--Agility and adaptability
--Collaborative robots
--Dexterous grasping
--Manipulation
--Mobility and industrial autonomous vehicles
--Navigation / actuation / control
--Sensing and perception
-Supply chain
-Sustainable manufacturing
-Systems engineering
-Systems integration
-Technology commercialization
Materials
-Ceramics
-Composites
-Concrete / cement
-Materials characterization
--Composition and structure
--Mechanical properties
--Thermal properties
-Metals
-Modeling and computational material science
-Polymers
-Superconductors
Mathematics and statistics
-Experiment design
-Image and signal processing
-Modeling and simulation research
-Numerical methods and software
-Statistical analysis
-Uncertainty quantification
Metrology
-Amount of substance
-Dimensional metrology
-Electrical / electromagnetic metrology
-Flow metrology and rheology
-Force metrology
-Humidity metrology
-Ionizing radiation metrology
-Mass metrology
-Metric
-Optical / photometry / laser metrology
-Pressure and vacuum metrology
-Thermometry metrology
-Time and frequency metrology
-Weights and measures
Nanotechnology
-Nanobiotechnology
-Nanochemistry
-Nanoelectronics
-Nanofabrication / manufacturing
--Lithography
--Self-assembly
-Nanofluidics
-Nanomagnetics
-Nanomaterials
-Nanomechanics
-Nanometrology
-Nanophotonics
-Nanophysics
-Nanoplasmonics
Neutron research
Performance excellence
-Assessment tools and services
-Baldrige award
-Baldrige examiners
-Baldrige Framework and Criteria
-Best practices
-Leadership development
Physics
-Atomic / molecular / quantum
-Biological physics
-Condensed matter
-Electron physics
-Magnetics
-Nuclear physics
-Optical physics and communications
-Quantum information science
-Radiation
-Spectroscopy
-Thermodynamics
-Time and frequency
Public safety
-Chemical / Biological / Radiological / Nuclear / Explosives (CBRNE)
-First responder preparedness
-Law enforcement
-Public safety communications research
-Response robots
Resilience
-Community resilience
-Disaster and failure studies
-Earthquake risk reduction
-Resilience economics
-Resilient materials
-Windstorm impact reduction
Standards
-Accreditation
-Calibration services
-Conformity assessment
-Documentary standards
-Frameworks
-Quality assurance
-Reference data
-Reference instruments
-Reference materials
-Standards education
Technology transfer
Transportation
-Aerospace
-Automotive

NIST Headquarters
-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)
--CHIPS Program Office
---CHIPS Program Headquarters
----CHIPS Program Headquarters - HQ
----Opportunity & Inclusion Group
---External & Government Affairs Division
----External & Government Affairs – HQ
---Investments Division
----Investments Division – HQ
---Operations Office
----Operations Office – HQ
---Risk Management Division
----Risk Management – HQ
---Strategy, Technology & Policy Division
----Strategy, Technology & Policy – HQ
--CHIPS Research & Development Program Office
---CHIPS Research & Development Program Headquarters Division
----CHIPS Research & Development Program Headquarters – HQ
----Integration & Policy Office
----Outreach & Partnerships Office
---External R&D Partnerships Division
----External R&D Partnerships – HQ
----National Advanced Packaging Manufacturing Program Group
----National Semiconductor Technology Center Group
---Industrial Advisory Committee
----Industrial Advisory Committee – HQ
---Semiconductor Manufacturing Institute Division
----Semiconductor Manufacturing Institute – HQ
---Semiconductor Metrology & Characterization Office
----Semiconductor Metrology & Characterization Office – HQ
-Management Resources
--Management Resources
---Associate Director for Management Resources
----Associate Director for Management Resources - HQ
---Business Operations Office
----Business Analytics Group
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----Customer Relationship Management Group
----Process Engineering Office
----Project Management Office
---Emergency Services Office
----Emergency Management, Preparedness and Coordination Group
----Emergency Services - HQ
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---Equal Employment Opportunity and Accessibility Office
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---NIST Research Library and Museum
----Research Library Group
----Digital Services and Publishing Group
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---Fabrication Technology Office
----Fabrication Technology Office - HQ
--Office of Facilities and Property Management
---Boulder Design and Construction Division
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----Facilities Improvement (Boulder) Group
----Reimbursable Work Group
----Facilities Modernization (Boulder) Group
---Gaithersburg Design and Construction Division
----Facilities Improvement (Gaithersburg) Group
----Reimbursable Work (Gaithersburg) Group
----Facilities Library, Archives, and As-Built (Gaithersburg) Group
----Construction Contract Management Group
----Facilities Modernization (Gaithersburg) Group
----Gaithersburg Design and Construction - HQ
---Gaithersburg Facility Maintenance Division
----Building Management (Gaithersburg) Group
----Operations Engineering Group
----Gaithersburg Facility Maintenance - HQ
----Facilities Enhancement Group
----Operations and Maintenance (Gaithersburg) Group
----Planning, Estimating and Materials Group
----Steam and Chilled Water Generation Plant Group
---Facilities Services Division
----Logistics Group
----Materials Management (Gaithersburg) Group
----Site Services Group
----Facilities Services Division - HQ
---Boulder Facilities Maintenance Division
----Engineering and Management Group
----Site Support Group
----Safety and Compliance Group
----Building Management and Maintenance Group
----Boulder Facilities Maintenance- HQ
----Support Services Group
---Emergency Services Division
----Police Services
----Security Systems and Access Control Group
----Fire Protection Group
----Emergency Services - HQ
----Emergency Management, Preparedness and Coordination Group
---Office of Facilities and Property Management
----Capital Asset Management and Facilities Planning Group
----OFPM Program Management Office
----Office of Facilities and Property Management - HQ
----Boulder Site Management Group
----Administrative Operations Group
----Program Office
----Reimbursement Projects Group
----Safety, Health and Compliance Group
--Office of Acquisition and Agreements Management
---Office of Acquisition and Agreements Management
----Administrative Support and Document Control Group
----Office of Acquisition and Agreements Management - HQ
----Policy and Compliance Group
----Reimbursable Agreements Coordination Office
---Financial Assistance Agreements Management Office
----Financial Assistance Agreements Management Office – HQ
---Acquisition Management Division
----Acquisition Management - HQ
----Acquisition Operations
----Acquisition Operations
----Acquisition Policy and Reimbursable Agreements
--Office of Information Systems Management
---Applications Systems Division
----Applications Systems - HQ
---Research Services Office
----Research Services Office - HQ
---Business Systems Division
----Business Systems Division - HQ
---Information Technology Security & Networking Division
----Information Technology Security & Networking - HQ
---Identity, Credential, and Access Management Division
----Identity, Credential, and Access Management - HQ
---Customer Access and Support Division
----Customer Access and Support - HQ
---Infrastructure Services Division
----Infrastructure Services Division - HQ
---Office of Information Systems Management
----Office of Information Systems Management - HQ
---Innovation and Solutions Division
----Innovation and Solutions Division - HQ
---Platform Services Division
----Platform Services Division - HQ
--Office of Human Resources Management
---Learning and Organizational Development Division
----Learning and Organizational Development – HQ
---Talent Acquisition Division
----Talent Acquisition – HQ
---Workforce Analytics and Technology Division
----Workforce Analytics and Technology – HQ
---Human Resources Management Office
----Human Resources Management Office - HQ
---Workforce Programs Division
----Workforce Programs – HQ
--Office of Safety, Health and Environment
---Office of Safety, Health and Environment
----Office of Safety, Health and Environment - HQ
---Gaithersburg Safety, Health and Environment Division
----Safety and Health Group
----Gaithersburg Safety, Health and Environment - HQ
----Fire and Facilities Safety Group
----Environmental Management Group
---Radiation Safety Division
----Radiation Facilities Group
----Program Development and Compliance Group
----Radiation Safety - HQ
---Boulder Safety, Health and Environment Division
----Boulder Safety, Health and Environment - HQ
--Office of Financial Resource Management
---Financial Systems and Reporting Division
----CBS Core Support Group
----CBS Feeder System Support Group
----Financial Systems and Reporting Division - HQ
----Financial Statements Group
----Data Control Group
----Reconciliations Group
---Office of Financial Resource Management
----Office of Financial Resource Management - HQ
----Internal Controls Management & Evaluation Office
----Enterprise Risk Management Office
---Finance Division
----Finance - HQ
----Financial Statements Group
----Data Control and Cost Execution Group
----Accounts Payable Purchase Orders, Grants & Foreign Payments
----Accounts Payable Contracts and Government Group
----Receivables Group
----Reconciliations Group
----Travel Group
---Financial Operations Division
----Travel Group
----Agreements Group
----Accounts Receivable Group
----Accounts Payable II Group
----Financial Operations - HQ
----Accounts Payable Group
---Budget Division
----Technical and Extramural Programs Group
----Institutional Support and Facilities Group
----Budget - HQ
----Formulation and Financial Management Group
-Laboratory Programs
--Communications Technology Laboratory
---RF Technology Division
----High-Speed Waveform Metrology Group
----Superconductive Electronics Group
----Metrology for Wireless Systems Group
----Guided Wave Electromagnetics Group
----Electromagnetic Fields Group
----RF Technology Division - HQ
---Smart Connected Systems Division
----IoT Devices and Infrastructures Group
----Networked Control Systems Group
----Smart Connected Manufacturing Systems Group
----Smart Grid Group
----Transformational Networks and Services Group
---Spectrum Technology and Research Division
----Applied Systems Metrology Group
----Fiber Sources and Applications Group
----Shared Spectrum Metrology Group
----Spectrum Technology and Research – HQ
---Wireless Networks Division
----Internet Technologies Research Group
----Radio Access and Propagation Metrology Group
----Wireless Networks Division - HQ
----Wireless Systems Innovation and Performance Group
---Public Safety Communications Research Division
----Public Safety Communications Research Division - HQ
----Advanced Communications Research Group
----Network Operations Group
---Communications Technology Laboratory HQ
----Communications Technology Laboratory HQ Gp
----Boulder Laboratory Director Office
----Communication Test Coordination Office
--Engineering Laboratory
---Building Energy and Environment Division
----Building Energy and Environment - HQ
----Mechanical Systems and Controls Group
----Indoor Air Quality and Ventilation Group
----HVAC&R Equipment Performance Group
----Heat Transfer and Alternative Energy Systems Group
---Intelligent Systems Division
----Intelligent Systems - HQ
----Manipulation and Mobility Systems Group
----Cognition and Collaboration Systems Group
----Production Systems Group
----Sensing and Perception Systems Group
---Materials and Structural Systems Division
----Earthquake Engineering Group
----Engineering Research Support Group
----Infrastructure Materials Group
----Inorganic Materials Group
----Community Resilience Group
----Materials and Structural Systems - HQ
----Polymeric Materials Group
----Structures Group
---Engineering Laboratory Office
----Applied Economics Office
----Disaster Impact Reduction Office
----Engineering Laboratory - HQ
----Engineering Laboratory Data, Security, Technology Group
---Fire Research Division
----National Fire Research Laboratory Group
----Wildland Urban Interface Fire Group
----Flammability Reduction Group
----Fire Research - HQ
----Engineered Fire Safety Group
----Fire Fighting Technology Group
---Systems Integration Division
----Life Cycle Engineering Group
----Process Engineering Group
----Information Modeling and Testing Group
----Systems Integration - HQ
--Information Technology Laboratory
---Applied Cybersecurity Division
----Applied Cybersecurity - HQ
----Cybersecurity and Privacy Applications Group
----National Cybersecurity Center of Excellence
----Trusted Identity Initiative Group
----NICE
---Computer Security Division
----Computer Security - HQ
----Cryptographic Technology Group
----Secure Systems and Applications Group
----Security Components and Mechanisms Group
----Security Test, Validation and Measurement Group
----Security Engineering and Risk Management Group
---Applied and Computational Mathematics Division
----Mathematical Software Group
----Mathematical Analysis and Modeling Group
----Computing and Communications Theory Group
----High Performance Computing and Visualization Group
----Applied and Computational Mathematics - HQ
---Statistical Engineering Division
----Applied and Computational Statistics Group
----Statistical Design, Analysis, and Modeling Group
----Statistical Engineering - HQ
---Software and Systems Division
----Systems Interoperability Group
----Software Quality Group
----Software and Systems - HQ
----Cyber Infrastructure Group
----Information Systems Group
---Information Access Division
----Information Access - HQ
----Image Group
----Multimodal Information Group
----Retrieval Group
----Visualization and Usability Group
---Information Technology Laboratory Office
----Office of Computational Science for Metrology
----Office of Emerging Technologies
----Office of IT Standardization
----Office of Government and Industrial Liaison
----Information Technology Laboratory Office - HQ
----Office of Chief Cybersecurity Advisor
--Laboratory Programs
---Research Data and Computing Office
----Research Data and Computing Office – HQ
---Research Protections Office
----Research Protections Office - HQ
---Research Security and Safeguarding Science Office
----Research Security and Safeguarding Science - HQ
---Standards Coordination Office
----International Standards Policy and Coordination Group
----Standards and Conformity Assessment Services Group
----Standards Coordination Office - HQ
----National Voluntary Laboratory Accreditation Program (NVLAP)
---Special Programs Office
----Special Programs Office-HQ
----Law Enforcement Standards Office
---Associate Director for Laboratory Programs
----Associate Director for Laboratory Programs - HQ
--Material Measurement Laboratory
---Office of Reference Materials
----Business and Quality Management Group
----Business Application Development, Support, and Security Group
----Sales and Customer Services Group
----Publication and Web Services Group
----Office of Reference Materials - HQ
----Materials and Physical Services Group
---Office of Data and Informatics
----Office of Data and Informatics - HQ
----Data Services Group
----Data Sciences Group
---Biosystems and Biomaterials Division
----Biomarker and Genomic Sciences Group
----Cellular Engineering Group
----Biomaterials Group
----Genome-Scale Measurements Group
----Complex Microbial Systems Group
----Cell Systems Science Group
----Biosystems and Biomaterials Division - HQ
---Chemical Sciences Division
----Biochemical and Exposure Science Group
----Chemical Informatics Group
----Optical Measurements Group
----Chemical Process and Nuclear Measurements Group
----Gas Sensing Metrology Group
----Inorganic Chemical Metrology Group
----Biospecimen Science Group
----Environmental Chemical Sciences Group
----Chemical Sciences Division - HQ
----Marine Biochemical Sciences Group
----Organic Chemical Metrology Group
---Biomolecular Measurement Division
----Biomolecular Structure and Function Group
----Mass Spectrometry Data Center Group
----Bioprocess Measurements Group
----Bioanalytical Science Group
----Biomolecular Measurement Division - HQ
----Applied Genetics Group
---Applied Chemicals and Materials Division
----Applied Chemicals and Materials Division - HQ
----Thermodynamics Research Center Group
----Thermophysical Properties of Fluids Group
----Nanoscale Reliability Group
----Fluid Characterization Group
----Fatigue and Fracture Group
---Materials Science and Engineering Division
----Thermodynamics and Kinetics Group
----Polymers Processing Group
----Mechanical Performance Group
----Polymers and Complex Fluids Group
----Materials Science and Engineering Division - HQ
----Functional Polymers Group
----Functional Nanostructured Materials Group
---Materials Measurement Science Division
----Security Technologies Group
----Surface and Trace Chemical Analysis Group
----Nanomechanical Properties Group
----Nano Materials Research Group
----Materials Structure and Data Group
----Microscopy and Microanalysis Research Group
----Synchrotron Science Group
----Materials Measurement Science Division - HQ
----Data and AI-Driven Materials Science Group
---Material Measurement Laboratory Office
----The Material Measurement Laboratory Office of Operations Group
----Material Measurement Laboratory - HQ
----Genome-Scale Measurement Group
--NIST Center for Neutron Research
---NIST Center for Neutron Research
----Research Facility Operations Group
----NIST Center for Neutron Research - HQ
----Reactor Operations and Engineering Group
----Neutron-Condensed Matter Science Group
--Physical Measurement Laboratory
---Microsystems and Nanotechnology Division
----Biophysical and Biomedical Measurement Group
----Microsystems and Nanotechnology - HQ
----Nanostructure Fabrication and Measurement Group
----Photonics and Optomechanics Group
---Time and Frequency Division
----Atomic Devices & Instrumentation Group
----Precision Photonic Synthesis Group
----Quantum & Nonlinear Nanophotonics Group
----Atomic Standards Group
----Ion Storage Group
----Neutral Atom Optical Clocks Group
----Time Realization and Distribution Group
----Phase Noise Metrology Group
----Time and Frequency - HQ
---Quantum Physics Division
----Quantum Physics - HQ
---Radiation Physics Division
----Dosimetry Group
----Radioactivity Group
----Radiation Physics - HQ
----Neutron Physics Group
---Sensor Science Division
----Fundamental Thermodynamics Group
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----Sensor Science - HQ
----Dimensional Metrology Group
----Temperature & Humidity Group
----Remote Sensing Group
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----Fluid Metrology Group
----Surface and Interface Metrology Group
---Applied Physics Division
----Advanced Microwave Photonics Group
----Spin Electronics Group
----Applied Physics - HQ
----Faint Photonics Group
----Quantitative Nanostructure Characterization Group
----Quantum Devices Group
----Molecular and Bio-Photonics Group
----Optoelectronic Manufacturing Group
----Magnetic Imaging Group
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----Sources and Detectors Group
---Quantum Measurement Division
----Quantum Optics Group
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----Quantum Measurement - HQ
----Laser Cooling and Trapping Group
----Fundamental Electrical Measurements Group
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---Quantum Sensors Division
----Device Fabrication Group
----Long Wavelength Sensors and Applications Group
----Quantum Calorimeters Group
----Quantum Electronics Group
----Quantum Processing Group
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----Quantum Sensors – HQ
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----Microfabrication Group
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---Nanoscale Device Characterization Division
----Atom Scale Device Group
----Nanoscale Device Characterization Division - HQ
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---Physical Measurement Laboratory Office
----Boulder Microfabrication Facility
----Physical Measurement Laboratory- HQ
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----Boulder Laboratory Director Office
-Innovation & Industry Services
--Office of Advanced Manufacturing
---Microelectronics Manufacturing Division
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----Office of Advanced Manufacturing - HQ
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--Baldrige Performance Excellence Program
---Baldrige Performance Excellence Program Office
----Award Process Group
----Director's Office, Baldrige Performance Excellence Program
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----Outreach and Communications Group
----Publications Management Group
----Workforce Development Group
--Innovation & Industry Services
---Associate Director for Innovation & Industry Services
----Associate Director for Innovation & Industry Services - HQ
---Advanced Manufacturing Office
----Advanced Manufacturing Office - HQ
---Economic Analysis Office
----Economic Analysis Office - HQ
---Technology Partnerships Office
----Technology Partnerships Office - HQ
---Technology Innovation Program Office
----Technology Innovation Program Office - HQ
--Hollings Manufacturing Extension Partnership Program
---National Platforms Division
----National Platforms – HQ
----Network Knowledge Management Group
----Supply Chain Group
---National Programs Division
----National Programs- HQ
---Network Learning and Strategic Competitions Division
----Network Learning and Strategic Competitions - HQ
---Outreach and External Affairs Division
----Outreach and External Affairs – HQ
---Performance Evaluation and Economic Impacts Division
----Performance Evaluation and Economic Impacts - HQ
----Performance Metrics and Evaluation Group
---Regional and State Partnerships Division
----Regional Management Group
----Regional and State Partnerships - HQ
---Network Agreements Management Division
----Network Agreements Management - HQ
----Node B Group
----Node A Group
---Internal Operations Division
----Internal Operations – HQ
----Center Operations and Financial Management Group
---Extension Services Division
----Extension Services - HQ
---Hollings Manufacturing Extension Partnership Program Office
----Hollings Manufacturing Extension Partnership Program - HQ
-Director's Office
--Director's Office
---Ombuds Office
----Ombuds Office - HQ
---Public Affairs Office
----Media Liaison Group
----Video and Digital Media Production Group
----Public Affairs Office - HQ
----Internal Communications and Inquiries Group
----Conference Program and Audiovisual Services Group
----Boulder Meetings Support and Services Group
----Web Content Development Group
---Program Coordination Office
----Program Coordination Office - HQ
---Director's Office
----Director's Office - HQ
----Onboarding Group
---Congressional and Legislative Affairs Office
----Congressional and Legislative Affairs Office - HQ
---Human Subjects Protection Office
----Human Subjects Protection Office - HQ
---Management and Organization Office
----Management and Organization Office- HQ
---International and Academic Affairs Office
----International and Academic Affairs Office - HQ

Projects/Programs: Grand Challenge 3: Enabling Metrology for Integrating Components in Advanced Packaging