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Boulder

Material Extrusion

Material extrusion can produce three-dimensional structures by building up material layer-by-layer. This technique is commonly used by...

Directed Energy Deposition

Directed energy deposition (DED) builds up material layer-by-layer. A nozzle deposits and melts material onto a target with a directed beam...

Powder Bed Fusion

Powder bed fusion can produce functional parts by melting and fusing layers of powdered material (e.g. metal) with either a high-power laser...

Additive Manufacturing of Ceramics

National Institute of Standards and Technology (NIST) Additive Manufacturing (AM) studies the characteristics, material properties, and...

Additive Manufacturing of Polymers

National Institute of Standards and Technology (NIST) Additive Manufacturing (AM) studies the characteristics, properties, and behaviors of...

Additive Manufacturing of Metals

National Institute of Standards and Technology (NIST) Additive Manufacturing (AM) studies the characteristics, properties, and behaviors of...

Additive Manufacturing Instruments

National Institute of Standards and Technology (NIST) Additive Manufacturing (AM) studies various material properties. If you are interested...

Work With Us

There are several ways to collaborate with our National Institute of Standards and Technology (NIST) Additive Manufacturing (AM) team. While...
Microscopy standard linking critical dimensions of line-space arrays and frustum arrays of varying pitch, for hybrid metrology by optical microscopy, scanning electron microscopy,atomic force microscopy, and the NIST line-scale interferometer

Universal Microscopy Standards

Microscopy methods for semiconductor manufacturing currently lack the traceability and absolute accuracy that is critical for characterizing future processes

Additive Manufacturing Consortia

Summary The National Institute of Standards and Technology (NIST) has and participates in various additive manufacturing (AM) consortia. To...
Spectrum

In-Situ RF Emissions Metrology

We aim to advance and demonstrate state-of-the-art methods for collecting and characterizing received radio frequency (RF) emissions from the perspective and
Diagram showing traditional and open ran topology

Open RAN Interoperability

Manufacturers and operators of Open RAN technology encounter several challenges when deploying the new design. The primary challenge is integrating systems from