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Nearly every modern cellphone has a built-in compass, or magnetometer, that detects the direction of Earth’s magnetic field, providing critical information for
As devices become smaller, more complex, and more highly integrated, interfaces are increasingly important and limiting. The ability to accurately predict
Mechanical strain impacts the performance of semiconductor devices. Manufacturing processes must be carefully controlled for strain to achieve high-yield and
Fundamental understanding of electron-solid interactions is key to interpreting electron microscopy images for quantitative metrology. Scanning electron
Precise measurements of thermal properties at the nanoscale are needed to engineer advanced and heterogeneously integrated devices, but measurements at this
The semiconductor industry continues to push for smaller features, more integration, and increased yield. New photoresist chemistries and advances in extreme
The semiconductor industry is in need of new, high throughput in-line dimensional metrology methods to characterize next generation 3D nanostructures. The
The Sensor Readout Project within the Quantum Electronics Group leverages the sensitivity of superconducting quantum interference devices (SQUIDs), low-noise
On January 29, 2024, representatives of NIST and the Republic of Korea's government metrology agency – the Korea Research Institute of Standards and Science
Perched atop a high plateau in Chile’s Atacama Desert, a long-awaited observatory is beginning to take shape: the largest suite of ground-based telescopes
Advanced packaging involves increasingly challenging requirements for heterogeneous integration and chiplet packaging. Needs such as fine pitch interconnects (
Time-resolved-emission microscopy (TREM) is a workhorse of semiconductor circuit evaluation. However, as transistor dimensions and power-supply voltages have
The semiconductor industry requires sub-nanometer, 3-dimensional quantitative elemental mapping of materials, nanoscale structures, and devices with high