Boulder

The Big Quantum Chill: NIST Scientists Modify Common Lab Refrigerator to Cool Faster With Less Energy

April 23, 2024

By modifying a refrigerator commonly used in both research and industry, researchers at the National Institute of Standards and Technology (NIST) have

Josephson Voltage Standard Workshop (JVS Workshop)

Mon, Jul 15 - Tue, Jul 16 2024

The scope of the 2024 Josephson voltage standard workshop is focused on the Josephson arbitrary waveform synthesizer

Square with rounded edges. Fill of square looks like American flag. Coming off the sides of the square are lines with unfilled circles at end. Words underneath: CHIPS for AMERICA

CHIPS Metrology NOFO on Small Business Innovation Research (SBIR)

Thu, Apr 18 2024, 3:30pm EDT

CHIPS for America recently released a notice of funding opportunity (NOFO) for the FY24 Small Business Innovation

RF Metrology for High-Frequency Transistor Models

Advanced semiconductor technology has led to continuous performance improvements in transistors. However, many iterations are needed to obtain optimal

RF Channel Propagation Measurements and Models for Communications Circuits

An accurate characterization of how the wireless signal propagates through different environments and frequency bands, is key to developing radio frequency (RF)

Quantitative Assessment of Defects and Related Modeling Parameters in GaN Semiconductor Devices

The power electronics and radio frequency (RF) communications industries increasingly rely on semiconductors in the GaN/AlGaN family, where performance is

Nanocalorimetry for Semiconductors and Semiconductor Process Metrology

Advanced methods to measure the thermal properties of thin films and interfaces are required to understand and improve microelectronic device fabrication

Multiscale Modeling and Validation of Semiconductor Materials and Devices

A comprehensive understanding of how current and next-generation materials impact the performance of semiconductor devices is critical to U.S. Semiconductor

2024 Time and Frequency Seminar

Tue, Aug 13 - Thu, Aug 15 2024

NIST Time and Frequency Division's annual seminar covers precision clocks and oscillators, atomic frequency standards

Molecular Dynamics Simulation of Heat Transport in Gate-All-Around Transistors

Heat management in semiconductor devices is a crucial problem currently limiting device performance and essentially all progress involving reduction of device

Dynamic EUV Metrology of Nanoscopic Thermal Transport in Active Devices

An urgent objective of the microelectronics industry is to mitigate the extreme heat densities generated within devices that are limiting the performance of

Today, device performance needs to be evaluated to determine success of materials development. This project will advance metrology for magnetic materials and develop models to predict device performance.

High Speed Metrology for Magnetoelectronic Devices and Models

Ferromagnet-based microelectronic devices play an increasingly important role within the semiconductor ecosystem. Magnetic RAM (MRAM) is already replacing

EUV Scatterometry

The state of the art for measurement and inspection of the smallest printed features on an integrated circuits (IC) chip is a combination of electron scanning

Electro-acoustic Metrology of Piezoelectric Materials for Wireless Communications

Microwave acoustic resonators are widely used to filter signals on multiple frequency bands for mobile communications. To predict filter performance, industry

a conceptual diagram of a gate-all-around (GAA) field-effect transistor

Causal Green's function simulations of phonons for multiscale/multiphysics modeling of thermal transport in gate-allaround transistors

This project employs a causal Green’s function (CGF) method to model thermal transport in nanoscale semiconductors, overcoming limitations posed by the Fourier

Standardizing New Materials, Processes, and Equipment for Microelectronics

Semiconductor measurement labs struggle to measure Scattering (S-) parameters—how electrical signals travels through and reflect off—of integrated circuits

Metrology of Materials, Surfaces, and Processes for Hybrid Advanced Packaging

Advanced bonding and integration physically bring together components, devices, and materials that are produced separately. There are strong economic and

Metrology for Integration of New Magnetic Materials

Electromagnetic (EM) systems use magnetic components such as inductors, isolators, and adaptive filters, but these are currently bulky and difficult to

Characterization of Nano-to-Microscale Process-Induced Thermo-Mechanical Changes in Heterogeneously Integrated Microelectronics

Some of the manufacturing difficulties encountered by the heterogeneous integration of modular chips in system-in-package are due to thermal management and

Advancing Power Electronics with Defect Metrology

The exponential growth in the power electronics market requires efficient devices based on wide bandgap (WBG) semiconductors. The yield of power devices is

Nanoscale, Element-Specific X-ray Imaging for Integrated Circuit Metrology

A current lack of 3D characterization tools that meet semiconductor industry needs is hampering manufacturing fidelity and supply chain security. Developing new

Non-Destructive Semiconductor Structure Function and Process Optimization for future Microelectronics Manufacturing at the NIST NSLS-II Beamline for XAFS and Diffraction

NIST Synchrotron beamline characterization of advanced semiconductor materials structure, chemical, electronic, and strain properties has been an ongoing

Shrinking Technology, Expanding Horizons: Compact Chips Advance Precision Timing for Communications, Navigation and Other Applications

March 6, 2024

This technology shrinks a tabletop system into a chip-sized format, reducing power usage and making it more applicable for use in everyday devices.