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Wafer Level EDMR with Spatial Resolution Capabilities: Magnetic Resonance in a Probing

Published

Author(s)

Duane J. McCrory, Mark A. Anders, Jason Ryan, Pragya Shrestha, Kin (Charles) Cheung, Patrick M. Lenahan, Jason Campbell
Proceedings Title
2017 IEEE International Integrated Reliability Workshop Final Report
Conference Dates
October 8-12, 2017
Conference Location
Fallen Leaf, CA, US
Conference Title
2017 IEEE International Integrated Reliability Workshop

Citation

McCrory, D. , Anders, M. , Ryan, J. , Shrestha, P. , Cheung, K. , Lenahan, P. and Campbell, J. (2018), Wafer Level EDMR with Spatial Resolution Capabilities: Magnetic Resonance in a Probing, 2017 IEEE International Integrated Reliability Workshop Final Report, Fallen Leaf, CA, US, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=924750 (Accessed July 6, 2022)
Created January 31, 2018, Updated April 19, 2022