A round robin, to provide precision and bias data for SEMI standard MS5-1107, Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures, in underway. The precision and bias data, combined with experience in applying the test instructions included in MS5-1107, will provide the basis for an updated version of MS5. Measurements at the pilot lab have been completed and the round robin is on-going at six additional laboratories.
Conference Dates: October 12-18, 2008
Conference Location: Honolulu, HI
Conference Title: Proc. ECS: E11 - Semiconductor Wafer Bonding 10: Science, Technology, and Applications
Pub Type: Conferences
micro-chevron, wafer bond strength measurement, SEMI MS5