TY  - CONF
AU  - Allen, Richard
AU  - Cassard, Janet
AU  - Baylies, Winthrop
AU  - Read, David
AU  - Quinn, George
AU  - DelRio, Frank
AU  - Turner, Kevin
AU  - Bernasch, Michael
AU  - Bagdahn, Joerg
C2  - Proc. ECS: E11 - Semiconductor Wafer Bonding 10: Science, Technology, and Applications, Honolulu, HI
DA  - 2008-12-23
LA  - en
M1  - 16
PB  - Proc. ECS: E11 - Semiconductor Wafer Bonding 10: Science, Technology, and Applications, Honolulu, HI
PY  - 2008
TI  - A Standard Method for Measuring Wafer Bond Strength for MEMS Applications
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=33132
ER  -