TY  - CONF
AU  - Richard Allen
AU  - Janet Cassard
AU  - Winthrop Baylies
AU  - David Read
AU  - George Quinn
AU  - Frank DelRio
AU  - Kevin Turner
AU  - Michael Bernasch
AU  - Joerg Bagdahn
C2  - Proc. ECS: E11 - Semiconductor Wafer Bonding 10: Science, Technology, and Applications, Honolulu, HI
DA  - 2008-12-23
LA  - en
M1  - 16
PB  - Proc. ECS: E11 - Semiconductor Wafer Bonding 10: Science, Technology, and Applications, Honolulu, HI
PY  - 2008
TI  - A Standard Method for Measuring Wafer Bond Strength for MEMS Applications
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=33132
ER  -