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Displaying 2001 - 2025 of 2361

Resistivity Dominated by Surface Scattering in Sub-50 nm Cu Wires

January 25, 2010
Author(s)
Rebekah L. Graham, Glenn Alers, Thomas Mountsier, N. Shamma, S. Dhuey, R. H. Cabrini, Roy H. Geiss, David T. Read, S. Peddeti
The electron scattering mechanisms in sub-50nm copper lines were investigated to understand the extendibility of copper interconnects when the line width or thickness is less than the mean free path. Electron-beam lithography and a dual hardmask approach

Bending of a Bimetallic Beam due to the Kirkendall Effect

January 1, 2010
Author(s)
William J. Boettinger, Geoffrey B. McFadden
The time dependent bending of single phase and two phase bimetal strips due to interdiffusion is computed. The model couples simple beam theory and diffusion, the bending being due to the creation and /annihilation of vacancies necessitated by unequal

IMMOBILIZED ENZYME CATALYZED POLYMERIZATION REACTIONS IN MICROREACTORS

January 1, 2010
Author(s)
Santanu S. Kundu, Atul Bhangale, William E. Wallace, Kathleen M. Flynn, Richard Gross, Kathryn L. Beers
Application of microreactor technologies enable improved safety, selectivity and yield in a range of chemical reactions in addition to new measurement methods that are often faster, cheaper and more accurate than traditional methods. In this study we have

On Lamb Modes as a Function of Acoustic Emission Source Rise Time

January 1, 2010
Author(s)
Marvin A. Hamstad
A study was carried out to examine Lamb-wave modal content as a function of the acoustic emission (AE) source rise time. The study used a validated finite element code to model the source operation and subsequent wave propagation up to a distance of 480 mm

RECENT INVESTIGATIONS OF Sr-Ca-Co-O THERMOELECTRIC MATERIALS

December 21, 2009
Author(s)
Winnie K. Wong-Ng, Guangyao Liu, Makoto Otani, Evan L. Thomas, Nathan Lowhorn, Martin L. Green, James A. Kaduk
Three low-dimension cobaltites in the Sr-Ca-Co-O system have been studied for their structure and thermoelectric properties. Using x-ray pole figure construction technique, a Ca3Co4O9 thin film showed excellent fiber texture but no ab in-plane texture. The

A METHODOLOGY FOR DETECTING RESIDUAL PHOSPHORIC ACID IN POLYBENZOXAZOLE FIBERS

November 24, 2009
Author(s)
Eun S. Park, John R. Sieber, Charles M. Guttman, Kirk D. Rice, Kathleen M. Flynn, Stephanie S. Watson, Gale A. Holmes
There is great interest in the degradation of ballistic fibers from exposure to sunlight and high humidity, because it directly affects the lives of people who use protective ballistic armor. However, to date, no mechanism has been found to explain how

Composing complex EXAFS problems with severe information constraints

November 1, 2009
Author(s)
Bruce D. Ravel
In recent work, a model for the structural environment of Hg bound to a catalytic DNA sensor was proposed on the basis of EXAFS data analysis. Although severely constrained by limited data quality and scant supporting structural data, a compelling

Mineralogical and Microstructural Evolution Review

November 1, 2009
Author(s)
Kenneth A. Snyder
The mineralogical and microstructural changes that occur in cementitious systems during hydration are summarized. The discussion concentrates on changes that may occur in iso-thermal systems that do not interact with the environment. The discussion

A Fast, Simple Wafer-level Hall-Mobility Measurement Technique

October 21, 2009
Author(s)
Liangchun (. Yu, Kin P. Cheung, Vinayak Tilak, Greg Dunne, Kevin Matocha, Jason P. Campbell, Kuang Sheng
Mobility is a good indicator of device reliability. High channel mobility is one of the biggest challenges especially in novel devices such as high-k based MOSFET, III-V devices and SiC power MOSFET etc. Accurate measurement of channel mobility is required

Adhesion, Copper Voiding, and Debonding Kinetics of Copper/Dielectric Diffusion Barrier Films

October 13, 2009
Author(s)
Ryan P. Birringer, Roey Shaviv, Thomas Mountsier, Jon Reid, Jian Zhou, Roy H. Geiss, David T. Read, Reinhold Dauskardt
Effects of the chemistry of electroplated copper films on stress-induced voiding and adhesion between the films and a SiN barrier layer are reported. The void density as observed by scanning electron microscopy decreased markedly with increasing Cu purity
Displaying 2001 - 2025 of 2361
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