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Displaying 16701 - 16725 of 74253

Frequency shift mitigation in a cold-atom CPT clock

May 8, 2016
Author(s)
Xiaochi Liu, John Kitching, Elizabeth Donley, Eugene N. Ivanov
An upgrade in the laser interrogation system for our cold-atom clock based on coherent population trapping has resulted in a reduced light shift. The new approach makes use of an electro-optic modulator to significantly reduce the phase coherence of the

A Simulation Framework for Industrial Wireless Networks and Process Control Systems

May 6, 2016
Author(s)
Yongkang Liu, Richard Candell, Nader Moayeri, Kang B. Lee
Factory and process automation systems are increasingly employing information and communications technologies to facilitate data sharing and analysis in integrated control operations. Wireless connections provide flexible access to a variety of field

Detecting leaks in gas-filled pressure vessels using acoustic resonances

May 6, 2016
Author(s)
Keith A. Gillis, Michael R. Moldover, James B. Mehl
We demonstrate that a leak from a large, unthermostatted pressure vessel into ambient air can be detected an order of magnitude more effectively by measuring the time dependence of the ratio p/f 2 than by measuring the ratio p/T. Here f is the resonance

Realizing Exactly Solvable SU(N) Magnets with Thermal Atoms

May 6, 2016
Author(s)
Michael Beverland, Gorjan Alagic, Michael Martin, Andrew Koller, Ana Maria Rey, Alexey Gorshkov
We show that n thermal fermionic alkaline-earth atoms in a flat-bottom trap allow one to robustly implement a spin model displaying two symmetries: the Sn symmetry that swaps atoms occupying different vibrational levels of the trap and the SU(N) symmetry

Angularly-Selective Transmission Imaging in a Scanning Electron Microscope

May 5, 2016
Author(s)
Jason D. Holm, Robert R. Keller
This contribution presents recent advances in imaging control conditions for transmission scanning electron microscopy (t-SEM) by means of angularly-selective electron collection with a commercial scanning transmission electron microscopy-in-scanning

Understanding and Control of Bipolar Doping in Copper Nitride

May 5, 2016
Author(s)
Angela N. Fioretti, Craig P. Schwartz, John Vinson, Dennis Nordlund, David Prendergast, Adele C. Tamboli, Filip Tuomisto, Stephan Lany, Eric S. Toberer, Andriy Zakutayev
Semiconductor materials that can be doped both n-type and p-type are desirable for diode-based applications and transistor technology. Copper nitride (Cu3N) is a metastable semiconductor with a solar-relevant bandgap that has been reported to exhibit

Coherent cavity-enhanced dual-comb spectroscopy

May 4, 2016
Author(s)
Adam J. Fleisher, David A. Long, Zachary D. Reed, David F. Plusquellic, Joseph T. Hodges
Multiheterodyne spectroscopy performed with two stabilized optical frequency combs (OFCs) has shown great potential as a fast, accurate, and high-resolution substitute for existing interferometry methods that require lengthy integration times and precision

UTSA-74: A MOF-74 Isomer with Two Accessible Binding Sites per Metal Center for Highly Selective Gas Separation

May 4, 2016
Author(s)
Feng Luo, Changsheng Yan, Lilong Dang, Rajamani Krishna, Wei Zhou, Hui Wu, Xinglong Dong, Yu Han, Tong-Liang Hu, Michael O'Keeffe, Lingling Wang, Mingbiao Luo, Rui-Biao Lin, Banglin Chen
A new metal-organic framework Zn 2(H 2O)(dobdc)¿0.5(H 2O) (UTSA-74, H 4dobdc=2,5-dioxido-1,4- benzenedicarboxylic acid), Zn-MOF-74/CPO-27-Zn isomer, has been synthesized and structurally characterized. It has a novel four coordinated fgl topology with one

Addressing Perception Uncertainty Induced Failure Modes in Robotic Bin-Picking

May 3, 2016
Author(s)
Krishnanand N. Kaipa, Akshaya S. Kankanhalli-Nag, Nithyananda B. Kumbla, Shaurya Shriyam, Srudeep Somnaath Thevendria-Karthic, Jeremy Marvel, Satyandra K. Gupta
We present a comprehensive approach to handle perception uncertainty to reduce failure rates in robotic bin-picking. Our focus is on mixed-bins. We identify the main failure modes at various stages of the bin-picking task and present methods to recover

Laser-induced particle adsorption on atomically thin MoS2

May 3, 2016
Author(s)
Bien Cuong Tran Khac, Ki-Joon Jeon, Seung Tae Choi, Yong Soo Kim, Frank W. DelRio, Koo-Hyun Chung
Atomically thin molybdenum disulfide (MoS2) shows great potential for use in nano-devices due to its remarkable electronic, optoelectronic, and mechanical properties. These material properties are often dependent on the thickness or the number of layers

High Levels of Gadolinium Deposition in the Skin of a Patient with Normal Renal Function

May 2, 2016
Author(s)
William C. Davis, Donna R. Roberts, Scott M. Lindhorst, Cynthia T. Welsh, Mary N. Herring, Adam Braun, Bruce H. Thiers
Objective: The aim of this study was to assess gadolinium deposition in the skin of a patient with normal renal function, based on estimated glomerular filtration rate (eGFR) values greater than 59 ml/min/1.73 m2, following exposure to large cumulative

In-Situ Metrology to Characterize Water Vapor Delivery during Atomic Layer Deposition

May 2, 2016
Author(s)
Tariq Ahmido, William A. Kimes, Brent A. Sperling, Joseph T. Hodges, James E. Maslar
Water is often employed as the oxygen source in metal oxide atomic layer deposition (ALD) processes. It has been reported that variations in the amount of water delivered during metal oxide ALD can impact the oxide film properties. Hence, one contribution

Rashba realization: Raman with RF

May 2, 2016
Author(s)
Ian B. Spielman, Daniel Campbell
We theoretically explore a Rashba spin-orbit coupling scheme which operates entirely in the absolute ground state manifold of an alkali atom, thereby minimizing all inelastic processes. An energy gap between ground eigenstates of the proposed coupling can

A ROUND ROBIN EXPERIMENT TO SUPPORT BOND VOID MEASUREMENT STANDARDS

May 1, 2016
Author(s)
Richard A. Allen, David T. Read, Victor H. Vartanian, Winthrop A. Baylies, William Kerr, Mark Plemmons, Kevin T. Turner
A round robin experiment to compare the sensitivities of various metrology tools to small voids between bonded wafers such as are used in three-dimensional stacked integrated circuits (3DS-ICs) and MEMS packaging. Participants received a set of four bonded
Displaying 16701 - 16725 of 74253
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