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Search Publications

NIST Authors in Bold

Displaying 33651 - 33675 of 73697

RFID-Assisted Indoor Localization and Communication for First Responders

October 1, 2006
Author(s)
Jeffrey R. Guerrieri, Michael H. Francis, Perry F. Wilson, Leonard E. Miller, Nelson Bryner, David Stroup, Luke Klien-Berndt
An indoor localization and communication project is described that proposes to use RFID (radio-frequency identification) tags, placed in the building beforehand, as navigation waypoints for an inertial navigation system carried by a first responder. RFID

Simulation Prototypes for Incident Management Training

October 1, 2006
Author(s)
Guodong Shao, Charles R. McLean
First responders and incident management personnel need better training resources to prepare for future disasters. Live training exercises while valuable are often very expensive to organize and conduct. Training using modeling, simulation, and gaming

Spectrally Tunable Sources for Advanced Radiometric Applications

October 1, 2006
Author(s)
Steven W. Brown, Joseph P. Rice, J D. Jackson, Jorge E. Neira, Bettye C. Johnson
A common radiometric platform for the development of application-specific metrics to quantify the performance of sensors and systems is described. Using this platform, systems may be quantified in terms of the accuracy of measurements of standardized sets

Study of BGP Peering Session Attacks and Their Impacts on Routing Performance

October 1, 2006
Author(s)
Kotikalapudi Sriram, Douglas C. Montgomery, Oliver Borchert, Okhee Kim, David R. Kuhn
We present a detailed study of the potential impact of BGP peering session attacks and the resulting exploitation of Route Flap Damping (RFD) that cause network-wide routing disruptions. We consider canonical grid as well as down-sampled realistic

The Interface Development for Machine Shop Simulation

October 1, 2006
Author(s)
Yan Luo, Yung-Tsun T. Lee
Modeling and simulation technology is recognized for facilitating training, reducing production cost, improving product quality, and shortening development time. However, this technology remains largely underutilized by industry today. This is because

Three-Antenna Extrapolation Gain Measurement System at Millimeter Wave Frequencies

October 1, 2006
Author(s)
Katherine MacReynolds, Jeffrey R. Guerrieri, Michael H. Francis, Douglas T. Tamura
This paper describes the new tabletop millimeter wave extrapolation range which will provide on-axis gain services up to 110GHz. A discussion of the extrapolation measurement method [1], as presented at the Antenna Measurements Techniques Association (AMTA

Time-correlated single-photon counting with superconducting single-photon detectors

October 1, 2006
Author(s)
Martin Stevens, Robert Hadfield, Robert E. Schwall, Sae Woo Nam, Richard Mirin
We report use of a niobium nitride superconducting single-photon detector in a time-correlated single-photon counting experiment. The detector has a timing jitter of 68 +/- 3 ps full-width at half-maximum with a Gaussian temporal profile. The detector's

Unsupervised Anomaly Detection System Using Next-Generation Router Architecture

October 1, 2006
Author(s)
Richard A. Rouil, Nicolas Chevrollier, Nada T. Golmie
Unlike many intrusion detection systems that rely mostly on labeled training data, we propose a novel technique for anomaly detection based on unsupervised learning and we apply it to counter denial-of-service attacks. Initial simulation results suggest

Advancing Towards Factory-Wide Data Quality for APC Applications

September 30, 2006
Author(s)
Harvey Wohlwend, Gino Crispieri, Ya-Shian Li-Baboud
Advancing to the next levels of Advanced Process Control (APC) requires the ability to intelligently merge existing and new data sources in order to refine semiconductor manufacturing. To fully exploit the acquired data points for analyses in APC

Underpotential Co-Deposition of Cu_subscript(1-x)Pt_subscript(x) Alloys

September 30, 2006
Author(s)
J Mallett, Ugo Bertocci, Erik B. Svedberg, John E. Bonevich, Alexander J. Shapiro, William F. Egelhoff Jr., Thomas P. Moffat
The electrodeposition of Cu_subscript (1-x)Pt_subscript(x) alloys by underpotential co-deposition of Cu with Pt is demonstrated using an H_subscript(2)SO_subscript(4)-CuSO_subscript(4-)PtCl_subscript(4)_superscript(2-) electrolyte. The composition and

Assessment of Access Control Systems

September 29, 2006
Author(s)
Chung Tong Hu, David F. Ferraiolo, David R. Kuhn
Access control is perhaps the most basic aspect of computer security. Nearly all applications that deal with financial, privacy, safety, or defense include some form of access control. In many systems access control takes the form of a simple password

Using Semantic Web Methods to Improve Information Resource Quality

September 29, 2006
Author(s)
John Barkley
The quality of information resources can be improved using Semantic Web methods instead of, or in conjunction with XML and relational database systems. With Semantic Web methods, more of the semantics of an information resource can be made explicit in a

Focus 3D Telemodeling Tool: GUI Design for Iteration 1

September 28, 2006
Author(s)
Matthew L. Aronoff, John V. Messina, Eric D. Simmon
The Focus 3D Telemodeling Tool was designed as a novel graphical interface to data modeling for standards development. This paper describes the design intent for the proposed Graphical User Interface (GUI) of Focus -- how users interact with the system and

NIST Recommended Practice Guide: Fractography of Ceramics and Glasses

September 26, 2006
Author(s)
George D. Quinn
Fractography is a powerful but underutilized tool for the analysis of fractured glasses and ceramics. Fractography can identify the cause of failure and can even provide quantitative information about the loading conditions. The goal of this Guide is to

Role of Core Support Material in Veneer Failure of Brittle Layer Structures

September 26, 2006
Author(s)
Ilja Hermann, Sanjit Bhowmick, Brian R. Lawn
A study is made of veneer failure by cracking in all-ceramic crown-like layer structures. Model trilayers consisting of a 1 mm thick external glass layer (veneer) joined to a 0.5 mm thick inner stiff and hard ceramic support layer (core) by epoxy bonding
Displaying 33651 - 33675 of 73697
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