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We present results for uncertainties in noise-parameter measurements, obtained using a Monte Carlo simulation of the measurements. Sets of data were generated to simulate measurements on a low-noise amplifier, with given uncertainties in the underlying
I address the issue of the definition and measurement of noise figure and parameters to characterize multiport devices, particularly differential amplifiers. A parameterization in terms of the noise matrix appears to be the most practical. the noise figure
Alpesh Bhobe, Christopher L. Holloway, Melinda Piket-May
Full wave finite-difference time-domain (FDTD) and a simplified 1D- finite-difference time-domain technique using the multi-conductor transmission line equations are applied to a delay line to determine its propagation characteristics. The output volatge
X Huang, H. Yu, Jih-Sheng Lai, Allen R. Hefner Jr., David W. Berning
The super junction (SJ) MOSFET exhibits conduction and switching properties similar to those of conventional power MOSFETs. In this paper we investigate possible benefits and problems associated with connecting SJ MOSFET in parallel for high-power
Ty R. McNutt, Allen R. Hefner Jr., A. Montooth, J L. Duliere, David W. Berning, Ranbir Singh
Dynamic compact electrothermal models are developed for Silicon Carbide Power diodes. Model parameters are extracted and model results are presented for both 1500 V SiC Merged PiN diodes. The models are verified for on-state characteristics? temperature
Ranbir Singh, Allen R. Hefner Jr., David W. Berning, M. Palmer
This paper reports in detail, the design, a manufactuable fabrication process, and high temperature characteristics of a 4H-SiC rectifier with a 5 kV, 20 A rating. A highly doped p-type epitaxial Anode layer and junction termination extension (JTE) were
An oscillation-based built in self-test (BIST) method is presented for functional testing of mixed signal devices. An integral component of this method of on-chip testing involves transforming an oscillating analog signal into a digital clock-like signal
Amanda N. Goyettes, G. de Hann, Yicheng Wang, Loucas G. Christophorou, James K. Olthoff
This is a summary report of the paper to be published in the Journal of Chemical Physics. Measurements of electron transport, effective ionization, and attachment coefficients are reported for C 2F 4. In addition, measurements of the electron drift
Allen R. Hefner Jr., David W. Berning, David L. Blackburn, Christophe C. Chapuy, Sebastien Bouche
A new high-speed transient thermal imaging system is presented that provides the capability to measure the transient temperature distributions on the surface of a silicon chip with 1 υs time, and 15 υm spatial resolution. The system uses virtual instrument
Techniques are described for validating the performance of Insulated-Gate Bipolar Transistor (IGBT) circuit simulator models for soft-switching circuit conditions. The circuits used for the validation include a soft-switched boost converter similar to that
Allen R. Hefner Jr., Ranbir Singh, Jih-Sheng Lai, David W. Berning, Sebastien Bouche, Christophe C. Chapuy
The electrical performance of Silicon Carbide (SiC) diodes are evaluated and compared to commercially available Silicon (Si) diodes in the voltage range from 600 V through 5000 V. The comparisons include the on-state characteristics, the reverse recovery
This is a summary of recent exploratory efforts conducted by the American National Standards Institute (ANSI) Accredited Standards Committee C63, Sub-Committee 1,working group 1-13.2 on site requirements for radiated measurements above 1GHz. The main
The techniques for EMC measurements used with antennas above 1 GHz have been gleaned from methods used at lower frequencies. The assumptions made in applying these techniques have not been completely validated. This analysis will compare antennas for use
Curt A. Richter, Allen R. Hefner Jr., Eric M. Vogel
We have systematically compared the results of an extensive ensemble of the most advanced available quantum-mechanical capacitance-voltage simulation and analysis packages for a range of metal-oxide-semiconductor device parameters. While all have similar
Amanda N. Goyettes, Yicheng Wang, James K. Olthoff
Positive ion bombardment plays an essential role in plasma processing, influencing etch rates, materials selectivity and etching profiles. Experimental determination of ion identities and energies in processing plasmas provides complementary data necessary
A comprehensive and critical assessment of published data on the total, dissociative, and nondissociative electron attachment cross sections for SF 6 allowed us to recommend or suggest room temperature values for these cross sections over an energy range
The limited electron collision cross-section and transport-coefficient data for the plasma processing gas perfluorocyclobutane (c-C 4F 8) are synthesized, assessed, and discussed. These include cross sections for total electron scattering, differential
Allen R. Hefner Jr., David W. Berning, Jih-Sheng Lai, C Liu, Ranbir Singh
A newly developed Silicon Carbide (SiC) Merged PiN Schottky (MPS) diode combines the best features of both Schottky and PiN diodes to obtain low on-state voltage drop, low leakage in the off-state, fast switching, and good high temperature characteristics