Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Impact of Thermal Stability of Isolation Liner on the Electrical Characteristics of TSVs

Published

Author(s)

Chukwudi A. Okoro, Yaw S. Obeng

Abstract

This study is focused on understanding the effect of thermal cycling on the signal integrity characteristics of TSV isolation liner (SiO2). The use of radio frequency (RF) signals is found to be a good metrology tool for the detection of discontinuities in the SiO2 isolation liner. Signal losses are found to scale with the attained number of thermal cycles. Atomic force microscopy (AFM) analysis revealed that void formation and growth in the SiO2 isolation liner is the root cause for this observed trend. Therefore the life time of TSVs will be significantly affected by the SiO2 isolation liner, thus, their understanding, engineering and optimization will be essential for prolonged high performance TSVs.
Citation
ECS Transactions (ECST)
Volume
45
Issue
3
Publisher Info
The Electrochemical Society, Pennington, NJ

Keywords

3D-IC, TSV, Isolation, liner, voids, SiO2, AFM

Citation

Okoro, C. and Obeng, Y. (2013), Impact of Thermal Stability of Isolation Liner on the Electrical Characteristics of TSVs, ECS Transactions (ECST), The Electrochemical Society, Pennington, NJ, [online], https://doi.org/10.1149/1.3700887 (Accessed November 12, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created July 30, 2013, Updated November 10, 2018