Chen, L.
, Wang, Q.
and Griesmann, U.
(2011),
Plasma Etching Uniformity Control for Making Large and Thick Dual-Focus Zone Plates, 36th International Conference on Micro and Nano Engineering, Genoa, -1, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=905958
(Accessed September 14, 2024)
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Plasma Etching Uniformity Control for Making Large and Thick Dual-Focus Zone Plates
Published
Author(s)
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Abstract
In summary, an optimized plasma etching process has been developed and a Teflon ring has been made to minimize the feature size variation effect and eliminate the thick glass edge effect. Large phase type dual-focus zone plate with good etching profile and better than 2% etching depth uniformity was successfully made, which is acceptable for the error tolerance of the ROC measurement.Proceedings Title
36th International Conference on Micro and Nano Engineering
Conference Dates
September 19-22, 2010
Conference Location
Genoa
Pub Type
Conferences
Download Paper
Keywords
reactive ion etching, uniformity, zone plate
Citation
Issues
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Created January 11, 2011, Updated February 19, 2017