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Plasma Etching Uniformity Control for Making Large and Thick Dual-Focus Zone Plates

Published

Author(s)

Lei Chen, Quandou (. Wang, Ulf Griesmann

Abstract

In summary, an optimized plasma etching process has been developed and a Teflon ring has been made to minimize the feature size variation effect and eliminate the thick glass edge effect. Large phase type dual-focus zone plate with good etching profile and better than 2% etching depth uniformity was successfully made, which is acceptable for the error tolerance of the ROC measurement.
Proceedings Title
36th International Conference on Micro and Nano Engineering
Conference Dates
September 19-22, 2010
Conference Location
Genoa

Keywords

reactive ion etching, uniformity, zone plate

Citation

Chen, L. , Wang, Q. and Griesmann, U. (2011), Plasma Etching Uniformity Control for Making Large and Thick Dual-Focus Zone Plates, 36th International Conference on Micro and Nano Engineering, Genoa, -1, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=905958 (Accessed December 10, 2023)
Created January 11, 2011, Updated February 19, 2017