Plasma Etching Uniformity Control for Making Large and Thick Dual-Focus Zone Plates
Lei Chen, Quandou (. Wang, Ulf Griesmann
In summary, an optimized plasma etching process has been developed and a Teflon ring has been made to minimize the feature size variation effect and eliminate the thick glass edge effect. Large phase type dual-focus zone plate with good etching profile and better than 2% etching depth uniformity was successfully made, which is acceptable for the error tolerance of the ROC measurement.
36th International Conference on Micro and Nano Engineering
, Wang, Q.
and Griesmann, U.
Plasma Etching Uniformity Control for Making Large and Thick Dual-Focus Zone Plates, 36th International Conference on Micro and Nano Engineering, Genoa, -1, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=905958
(Accessed December 10, 2023)