You, L.
, Okoro, C.
, Ahn, J.
, Kopanski, J.
and Obeng, Y.
(2014),
Microwave-Based Metrology Platform Development: Application of Broad-Band RF Metrology to Integrated Circuit Reliability Analyses, ECS Trasnsaction: Moore-Than-More 2, Orlando, FL, US
(Accessed October 7, 2025)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Microwave-Based Metrology Platform Development: Application of Broad-Band RF Metrology to Integrated Circuit Reliability Analyses
Published
Author(s)
, , , ,
Abstract
In this paper we describe the development of a suite of techniques, based on the application of high frequency electromagnetic waves, to probe material and structural changes in integrated circuits under various external perturbations. We discuss how these techniques has been leveraged to study the impact of thermal cycling on the thermo-mechanical reliability of Cu TSV-based interconnects in 3D-ICs. In addition, we demonstrate, with preliminary data, how Scanning Microwave Spectroscopy can be used to detect buried artifacts and characterize metallic contacts.Proceedings Title
ECS Trasnsaction: Moore-Than-More 2
Conference Dates
May 4-9, 2014
Conference Location
Orlando, FL, US
Conference Title
225th Electrochemical Soceity
Pub Type
Conferences
Keywords
broadband, RF, emerging devices, nanoelectronics, 3D-IC, SMM
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact [email protected].
Created May 11, 2014, Updated October 12, 2021