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Dimensional Metrology of Millimeter- and Sub-millimeter-scale Components



Theodore V. Vorburger, Jun-Feng Song, Joseph Fu, M Tundermann, Thomas Brian Renegar, Theodore D. Doiron, N G. Orji


Decreasing sizes and tolerances of engineering components bring a demand for decreasing uncertainty in the dimensional measurements of these parts. Hence there is increasing need for measuring machines capable of performing dimensional and geometrical measurements at high resolution and high accuracy. We aim to develop the technique of interferometric microscopy into a tool for dimensional and geometrical measurements of component features ranging in size from a few millimeters to 5 ¿m with uncertainties as small as 1 ¿m or less. We will also integrate recently developed probe technology into a coordinate measuring machine (CMM) to produce measurements of holes with diameters as small as 0.7 mm approximately. Preliminary measurements with the interferometric microscope of the diameters and spacings of optical fibers in an optical connector show measurement reproducibility less than 1 ¿m.
Proceedings Title
Proceedings of SPIE, SPIE Meeting - ICALEO 2000 Conference on Laser Microfabrication
Conference Dates
October 3-4, 2000
Conference Location
Orlando, FL, USA
Conference Title
SPIE Meeting


dimensional measurement, interferometry, metrology, microscopy, Mirau, optical, scanning, standard, white light


Vorburger, T. , Song, J. , Fu, J. , Tundermann, M. , Renegar, T. , Doiron, T. and Orji, N. (2000), Dimensional Metrology of Millimeter- and Sub-millimeter-scale Components, Proceedings of SPIE, SPIE Meeting - ICALEO 2000 Conference on Laser Microfabrication, Orlando, FL, USA (Accessed April 24, 2024)
Created September 30, 2000, Updated October 12, 2021