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Journals

Magnetic Properties of Zr_(9)Ni_(11)Intermetallic Compound

Author(s)
Virgil Provenzano, Robert D. Shull, Richard M. Waterstrat, Lawrence H. Bennett, Edward Della Torre, H. Seyoum
We report on a very interesting magnetic behavior in the intermetallic compound Zr_(9)Ni_(11), namely, (i) spin-glass behavior and (ii) fluctuations in

Comparison of Large-Signal-Network-Analyzer Calibrations

Author(s)
Dylan F. Williams, Catherine A. Remley, Joe Gering, Grand Aivazian
We develop a procedure and metrics for comparing large-signal-network-analyzer calibrations. The metrics we develop provide a bound on differences between

Whisker Formation in Pb-Free Surface Finishes

Author(s)
Gery R. Stafford, Maureen E. Williams, Jae W. Shin, Kil-Won Moon, William J. Boettinger, Carlos R. Beauchamp
Tin(Sn)-lead(Pb) alloys have been used extensively for surface finishing of electronic components in part because Pb was found to be effective in retarding Sn

Characterization of SiGe Films for use as a National Institute of Standards and Technology (NIST) Microanalysis Reference material (RM 8905)

Author(s)
Ryna B. Marinenko, Shirley Turner, David S. Simons, Savelas A. Rabb, Rolf L. Zeisler, Lee L. Yu, Dale E. Newbury, Rick L. Paul, Nicholas W. Ritchie, Stefan D. Leigh, Michael R. Winchester, Lee J. Richter, Douglas C. Meier, Keana C. Scott, D Klinedinst, John A. Small
Bulk SiGe wafers cut from single-crystal boules and two SiGe thick films (4 m and 5 m thick) on Si wafers were evaluated with the electron probe microanalyzer
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