Skip to main content

NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Investigation of N2 Plasma Effects on the Depth Profile of Hydrogen Silsesquioxane Thin Films Using High Resolution Specular X-Ray Reflectivity

Published

Author(s)

V. J. Lee, Eric K. Lin, J K. Lan, Y L. Cheng, H C. Liou, Wen-Li Wu, Y L. Wang, M S. Feng, C G. Chao
Conference Location
Gaithersburg, MD
Conference Title
Characterization and Metrology for ULSI Technology: 2000 International Conference

Keywords

density profile, electronic materials, exposure time, hydrogen silsesquioxane, low-k dielectric, plasma effect, plasma power, reflectivity, specular x-ray reflectivity, thin films

Citation

Lee, V. , Lin, E. , Lan, J. , Cheng, Y. , Liou, H. , Wu, W. , Wang, Y. , Feng, M. and Chao, C. (2000), Investigation of N2 Plasma Effects on the Depth Profile of Hydrogen Silsesquioxane Thin Films Using High Resolution Specular X-Ray Reflectivity, Characterization and Metrology for ULSI Technology: 2000 International Conference, Gaithersburg, MD, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853664 (Accessed October 10, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created December 31, 1999, Updated October 12, 2021
Was this page helpful?