METIS is the home for digital products produced by the CHIPS Metrology Program. The following are common digital product types you will find:
Data, or datasets are the typical digitized outputs of either an experimental or computation procedure.
Code is an arbitrary unit of instruction written in a computer language that executes a particular task(s). Examples are segmentation codes and data reduction algorithms.
Model is a collection of codes that mimics a physical entity or process.
Software is a collection of codes that can include one or more models, packaged in such a way that can be executed by people with varying levels of expertise.
Database is a collection of related data.
Repository (or repo) is a collection of databases.
Please note: the following categories of scientific product are managed outside of METIS, but are listed for informational purposes.
Documentary output such as journal publications, white papers, and best-practice guides.
Service, specifically in this case, refers to a web-based interaction platform where a prospective recipient can request an action (for example: calibration, evaluation), and the requested service is rendered by a service provided through a web portal.
Standard and reference products (denoted by *) are governed by strict definitions (for standard data and for standard materials and instruments) and are quality assessed.
In addition to the direct outputs from the Seven Grand Challenges outlined in Strategic Opportunities for U.S. Semiconductor Manufacturing (summary table below), the CHIPS Metrology METIS Collection also includes datasets that predate Strategic Opportunities for U.S. Semiconductor Manufacturing (summary table below), the CHIPS Metrology METIS Collection also includes datasets that predates the 2022 CHIPS Act but are nonetheless relevant to the semiconductor industry. Contributed data products from NIST partners and collaborators will appear here as they become available.
CHIPS Metrology Program Areas:
Grand Challenge 1: Metrology for Materials Purity, Properties and Provenance
| Product Name | Type | Access |
| Radiation Hardness, failure mechanism, reliability, and provenance of 2D materials and wide-bandgap semiconductors. | Data, Model | Contact metis [at] nist.gov (METIS) |
| Measurements and computational data on heat capacity, density, and viscosity related to hazardous gas flow. | Data, SRD* | Contact metis [at] nist.gov (METIS) |
| Impurity analysis of semiconductor process gases. | Measurement Service, Data, SRM* | Contact metis [at] nist.gov (METIS) |
| Spectroscopy, mass-spectrometry, microscopy, and chromatography datasets on organic contaminants, native particles, and precursors in semiconductor cleaning chemicals. | Data | Contact metis [at] nist.gov (METIS) |
| High-purity solid reference materials (Si, Ge, Cu, Au, Ag, GeSi, AlGaN); mass-spectrometry, neutron, and gamma-activation datasets. | RGTM*, RM*, SRM*, Data | Contact metis [at] nist.gov (METIS) |
Grand Challenge 2: Advanced Metrology for Future Microelectronics Manufacturing
| Product Name | Type | Access |
| Thermalization maps, infrared spectra, highly-localized thermal expansion, interfacial conductance, and thermal conductivity datasets. | Data | Contact metis [at] nist.gov (METIS) |
| Nanoscale electron tomograms of GAA and CFET structures; AI/Machine Learning algorithm for automation. | Data, Code | Contact metis [at] nist.gov (METIS) |
| X-ray absorption, absorbance, and reflection spectra, and images of EUV photoresists. | Data | Contact metis [at] nist.gov (METIS) |
| Electrostatic data and modeling parameters for Atom Probe Tomography (APT); APT white paper, and best practices. | Data, Guide | Contact metis [at] nist.gov (METIS) |
| Small-angle x-ray scattering (CD-SAXS) test structures; X-ray scattering images of shape dimensions and dimension distributions. | RM*, RGTM*, Data | Contact metis [at] nist.gov (METIS) |
| Electron yield and mean-free-path models | Model | Contact metis [at] nist.gov (METIS) |
| SCATMECH - Model for light scattering | Software | SCATMECH: Polarized Light Scattering C++ Class Library |
| Python wrapper for SCATMECH | Software | GitHub - usnistgov/pySCATMECH: pySCATMECH is a Python interface to SCATMECH: Polarized Light Scattering C++ Class Library |
| Lab-based multi-wavelength EUV diffractometry for critical dimension metrology. | (Data) Scattering Intensity vs. Angle of Incidence | https://data.nist.gov/od/id/mds2-3843 |
| Data reduction algorithm for energy absorption spectroscopy (XAFS) and diffraction. | Code | Contact metis [at] nist.gov (METIS) |
| Simulation software for electric field in the nanoscale. | Software | Contact metis [at] nist.gov (METIS) |
| Open-source software package for strain mapping via precession 4D-STEM; strain reference materials. | Software, RM*, RGTM*, | - Contact srminfo [at] nist.gov (srminfo[at]nist[dot]gov)
- Contact metis [at] nist.gov (METIS) about software distribution
|
Grand Challenge 3: Integrating Components in Advanced Packaging
| Product Name | Type | Access |
Data linking residual stress to
properties of thermoset packaging Materials | (Data) Differential Scanning Calorimetry (DSC), Digital Image Correlation (DIC), rheology, and residual stress data. DSC data: temperature (°C), conversion ratio (unitless), chemical conversion rate (%/min), time (min), heat Flow (W/mg) DIC data: Images represented in csv format. Rheology data: oscillation strain (%), oscillation stress (Pa), temperature (°C), time (s) axial force (N), Gap height (mm), angular frequency (rad/s), tangent loss delta (unitless), storage modulus (Pa), loss modulus (Pa), complex viscosity (Pa.s), oscillation torque (μN.m), oscillation displacement (rad), phase angle (°) | https://doi.org/10.18434/mds2-3698 |
| Data on cure kinetics of liquid encapsulant. | (Data) Conversion rate data: Conversion rate (%/min) as a function of temperature(°C) at different heating rates (°C/min) Time-resolved FT-IR spectra: wavenumber (1/cm) absorbance (unitless), time (min) Time-resolved Raman spectra: Raman shift (1/cm), intensity (a.u), time (min) | https://doi.org/10.18434/mds2-3702 |
| Dual Mode Brillouin/Low-Frequency Raman spectroscopy images of local mechanical properties for packaging materials. | (Data) Low-Frequency Raman Spectra: Raman Shift (1/cm), intensity (a. u.), fit, Boson Peak contribution to the fit, normal mode contribution to the fit, fit sum. Images represented as intensities in csv format. Brillouin Light Scattering (BLS) spectra: Brillouin shift (GHz), intensity (a. u.), time (min). Images represented as intensities in csv format. | https://doi.org/10.18434/mds2-3725 |
| AFM indentations performed on hybrid-bonding copper patterns at room temperature. | (Data) AFM single-step and multi-step indentations performed on hybrid-
bonding copper patterns at room temperature. AFM Amplitude (V) vs. Frequency (Hz), Piezo displacement (m) vs. Time (s) and Force (N). | https://doi.org/10.18434/mds2-3867 |
| Magnetometry for Micropatterned magnetic nanoparticle composites | (Data) Magnetic flux density (T), magnetic moment (measured, corrected in Am2) or normalized (unitless), sample orientation (a-axis, b-axis, c-axis) | https://doi.org/10.18434/mds2-3869 |
| Electrical and mechanical measurement data for bond strength with different materials. | Data | Contact metis [at] nist.gov (METIS) |
| Element-specific x-ray computed tomography (XCT) images for advanced packaging components. | Data | Contact metis [at] nist.gov (METIS) |
| S-parameter calibration kit measurement data | (Data) Scattering parameter calibration data for on-
wafer measurements from 10 MHz to 110 GHz. Frequency (GHz), S-parameters (complex), Permittivity. | https://doi.org/10.18434/mds2-3404 |
| Calnet calibration service | Service | https://calnet.nist.gov/ |
| Permittivity standard reference material. | SRM* | Contact srminfo [at] nist.gov (srminfo[at]nist[dot]gov) |
| System performance metrics for x-ray computed tomography instrumentation. | Model | Contact metis [at] nist.gov (METIS) |
| Mechanical measurement data of hybrid bonds and solder materials. | Data | Contact metis [at] nist.gov (METIS) |
| Thermal-mechanical property datasets of interfaces in advanced packaging components. | Data | Contact metis [at] nist.gov (METIS) |
| Optical properties measurement for silicon photonics. | Data | Contact metis [at] nist.gov (METIS) |
| Thermal 3D images of advanced packaging. | Data | Contact metis [at] nist.gov (METIS) |
Grand Challenge 4: Modeling and Simulating Semiconductor Materials, Designs and Components
| Product Name | Type | Access |
| Characterization of defects using photoemission and luminescence techniques. | Data | Contact metis [at] nist.gov (METIS) |
| Open-source causal Green's function (CGF) tool for modeling thermal transport in nanoscale device components, 1-million-atom input dataset for the CGF tool. | Code, Data | Contact metis [at] nist.gov (METIS) |
| Thermo-mechanical, element-sensitive EUV imaging data from different modalities (coherent diffractive imaging, holography, ptchography) | Data | Contact metis [at] nist.gov (METIS) |
| Finite element model of piezoelectric materials for wireless communications; datasets of electromechanical properties of piezoelectric materials up to 30 GHz | Model, Data | Contact metis [at] nist.gov (METIS) |
| Ferromagnetic resonance (FMR) data of static and dynamic magnetic properties of a CoFeB thickness series, with the external magnetic field pointing out of the film plane. | (Data) FMR thickness series of CoFeB samples. Scattering parameter (S21 - complex) vs. magnetic field (Oe) | https://doi.org/10.18434/mds2-3408 |
| Thermal conductance, heat transfer, and heat capacitance data from molecular dynamics simulations. | Data | Contact metis [at] nist.gov (METIS) |
| Joint Automated Repository for Various Integrated Simulations (JARVIS) - Main collection | Data, Model, and Code Repository | https://doi.org/10.18434/M3HQ1W |
| JARVIS-Leaderboard: Large Scale Benchmark of Materials Design Methods | Data, Model, and Code Platform | |
| ALIGNN: Atomistic Line Graph Neural Network | Model | |
| JARVIS-Tools: an open-source software package for data-driven atomistic materials design | Software | |
| ThreeBodyTB.jl code for fast and accurate tight binding band structure and total energy calculations across the periodic table. | Code | |
| TB3Py: three-body tight-binding calculations for materials (Python wrapper) | Software | https://github.com/usnistgov/tb3py |
| NIST Interatomic Potentials Repository | Repository | |
| Dataset for Construction of Amorphous Structure Models via Relaxation of Random Arrangements of Molecules" dataset | Data | https://data.nist.gov/od/id/mds2-3831 |
| AtomGPT: Atomistic Generative Pretrained Transformer for Forward and Inverse Materials Design | Model | |
| CHIPS-FF: Evaluating Universal Machine Learning Force Fields for Material Properties | Data, Model | |
| Yabadaba: Yay, a base database | Software | |
| Intermat: A multiscale interface materials design package | Software | https://github.com/usnistgov/intermat |
| NFFLr - Neural Force Field Learning toolkit | Software | https://github.com/usnistgov/nfflr |
| Time-resolved TEM image analysis tool | Software | https://github.com/usnistgov/tem_analysis |
| Thermo-chemical data and model related to the atomic layer deposition (ALD) process; research-grade testing material | Data, Model, RGTM* | - Coming to METIS
- Contact srminfo [at] nist.gov (srminfo[at]nist[dot]gov)
|
| Data and images (from scanning probe, atom probe, optical spectroscopy, and electron microscopy) about electrical and carrier transport properties of GaN devices. | Data | Contact metis [at] nist.gov (METIS) |
| NextG Channel Model Alliance, AI/ML algorithm to perform live data reduction for channel sounding measurements; libraries of wireless propagation models; RF propagation models; multi-path component extraction algorithms; data challenge for wireless propagation problems. | (Repo) Contributed datasets | https://nextg.nist.gov/ |
| Transistor circuit models, statistical models for chip-level process variations | Model | Contact metis [at] nist.gov (METIS) |
| Thermal conductivity material test suite; protocol and best practices for thermoreflectance measurements. | RGTM*, Guide | Contact metis [at] nist.gov (METIS) |
| Data and images on die-level circuit evaluation and failure analysis | Data | Contact metis [at] nist.gov (METIS) |
Grand Challenge 5: Modeling and Simulating Semiconductor Manufacturing Processes
| Product Name | Type | Access |
| U-net AI predictive models and scanning electron microscopy (SEM) images for overlay. | (3838 = Data + Code) Six collections of SEM images, three trained U-net AI models, metrics on image quality and AI model accuracy. | https://doi.org/10.18434/mds2-3838 |
| Electrodeposition model, measurement, and simulation data for interconnects. | Model, Data | Contact metis [at] nist.gov (METIS) |
| Long-term reliability data on semiconductor devices. | Data | Contact metis [at] nist.gov (METIS) |
| RF-power uncertainty analysis; plasma-etching diagnostic data. | (3825 = Software) Creates digital records of metrological traceability, including calibration chains that contribute to measurement uncertainty in a microwave network. | https://github.com/usnistgov/rmellipse |
| Digital twin for atomic-layer deposition (ALD) | Code, Data | Contact metis [at] nist.gov (METIS) |
| Operando x-ray photoemission spectroscopy (XPS) data as a plasma diagnostic. | Data | Contact metis [at] nist.gov (METIS) |
| Computational mass and infrared (IR) spectra, and AI/machine-learning model, to aid Per- and Polyfluoroalkyl substance (PFAS) replacement. | Model, Data | Contact metis [at] nist.gov (METIS) |
Grand Challenge 6: Standardizing New Materials, Processes and Equipment for Microelectronics
| Product Name | Type | Access |
| Research grade and standard microscopy calibration materials; 2D and 3D map of uncertainty related to parameters resulting from periodic structures. | RGTM*, SRM*, Data | - Contact srminfo [at] nist.gov (srminfo[at]nist[dot]gov)
- Contact metis [at] nist.gov (METIS) about data distribution
|
| Wafer-scale planarization data of hafnia on silicon deposited by atomic-layer deposition (ALD) ,reference materials for nanoscale dimensional and materials characterization | - (Data = 3930) X-ray reflectometry (XRR) and variable wavelength spectroscopic ellipsometry (SE) from 200mm wafers with atomic-layer deposited (ALD) hafnia.
- RM*
| |
| 3D atom map from atom probe tomography (APT); research grade testing material for APT. | Data, RGTM* | - Contact metis [at] nist.gov (METIS) about data distribution
- Contact srminfo [at] nist.gov (srminfo[at]nist[dot]gov)
|
| CALPHAD and x-ray diffraction data of thermal properties of multi-phase and multi-component materials. | Data | Contact metis [at] nist.gov (METIS) |
| Design of an open-source hardware test platform; measurement data on device linearity, precision, accuracy, noise, and reproducibility from memory devices using this open-source hardware test platform. | Data | Contact metis [at] nist.gov (METIS) |
| Magnetic properties data on Pt and YIG; Pt and YIG Standard reference material. | Data, SRM* | - Contact metis [at] nist.gov (METIS) about data distribution
- Contact srminfo [at] nist.gov (srminfo[at]nist[dot]gov)
|
| X-ray fluorescence data on elements used in semiconductor manufacturing. | Data | Contact metis [at] nist.gov (METIS) |
Grand Challenge 7: Enhance Security and Provenance of Microelectronic-based Components and Products
| Product Name | Type | Access |
| X-ray computed tomography (XCT) datasets with defect shapes, dimensions, and size distribution; defect classification ML code and software. | Data, Code, Software | Contact metis [at] nist.gov (METIS) |
| NIST Vulnerability Data Ontology | Semantic Asset | |
| National Vulnerability Database with vulnerability ID, publication date, Common Vulnerability and Exposures (CVE ) Numbering Authorities (CNA), description | Database | https://nvd.nist.gov/ |
