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METIS

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METIS is the home for digital products produced by the CHIPS Metrology Program. The following are common digital product types you will find:

Data, or datasets are the typical digitized outputs of either an experimental or computation procedure.

Code is an arbitrary unit of instruction written in a computer language that executes a particular task(s). Examples are segmentation codes and data reduction algorithms.

Model is a collection of codes that mimics a physical entity or process.

Software is a collection of codes that can include one or more models, packaged in such a way that can be executed by people with varying levels of expertise.

Database is a collection of related data.

Repository (or repo) is a collection of databases.

Please note: the following categories of scientific product are managed outside of METIS, but are listed for informational purposes.

Documentary output such as journal publications, white papers, and best-practice guides.

Service, specifically in this case, refers to a web-based interaction platform where a prospective recipient can request an action (for example: calibration, evaluation), and the requested service is rendered by a service provided through a web portal.

Standard and reference products (denoted by *) are governed by strict definitions (for standard data and for standard materials and instruments) and are quality assessed.

In addition to the direct outputs from the Seven Grand Challenges outlined in Strategic Opportunities for U.S. Semiconductor Manufacturing (summary table below), the CHIPS Metrology METIS Collection also includes datasets that predate Strategic Opportunities for U.S. Semiconductor Manufacturing (summary table below), the CHIPS Metrology METIS Collection also includes datasets that predates the 2022 CHIPS Act but are nonetheless relevant to the semiconductor industry. Contributed data products from NIST partners and collaborators will appear here as they become available.

CHIPS Metrology Program Areas:

Product NameTypeAccess
Radiation Hardness, failure mechanism, reliability, and provenance of 2D materials and wide-bandgap semiconductors.Data, ModelContact metis [at] nist.gov (METIS)
Measurements and computational data on heat capacity, density, and viscosity related to hazardous gas flow.Data, SRD*Contact metis [at] nist.gov (METIS)
Impurity analysis of semiconductor process gases.Measurement Service, Data, SRM*Contact metis [at] nist.gov (METIS)
Spectroscopy, mass-spectrometry, microscopy, and chromatography datasets on organic contaminants, native particles, and precursors in semiconductor cleaning chemicals.DataContact metis [at] nist.gov (METIS)
High-purity solid reference materials (Si, Ge, Cu, Au, Ag, GeSi, AlGaN); mass-spectrometry, neutron, and gamma-activation datasets. RGTM*, RM*, SRM*, DataContact metis [at] nist.gov (METIS)
 

Product NameTypeAccess
Thermalization maps, infrared spectra, highly-localized thermal expansion, interfacial conductance, and thermal conductivity datasets.DataContact metis [at] nist.gov (METIS)
Nanoscale electron tomograms of GAA and CFET structures; AI/Machine Learning algorithm for automation.Data, CodeContact metis [at] nist.gov (METIS)
X-ray absorption, absorbance, and reflection spectra, and images of EUV photoresists.DataContact metis [at] nist.gov (METIS)
Electrostatic data and modeling parameters for Atom Probe Tomography (APT); APT white paper, and best practices.Data, GuideContact metis [at] nist.gov (METIS)
Small-angle x-ray scattering (CD-SAXS) test structures; X-ray scattering images of shape dimensions and dimension distributions.RM*, RGTM*, DataContact metis [at] nist.gov (METIS)
Electron yield and mean-free-path modelsModelContact metis [at] nist.gov (METIS)
SCATMECH - Model for light scatteringSoftwareSCATMECH: Polarized Light Scattering C++ Class Library
Python wrapper for SCATMECHSoftwareGitHub - usnistgov/pySCATMECH: pySCATMECH is a Python interface to SCATMECH: Polarized Light Scattering C++ Class Library
Lab-based multi-wavelength EUV diffractometry for critical dimension metrology.(Data) Scattering Intensity vs. Angle of Incidencehttps://data.nist.gov/od/id/mds2-3843
Data reduction algorithm for energy absorption spectroscopy (XAFS) and diffraction.CodeContact metis [at] nist.gov (METIS)
Simulation software for electric field in the nanoscale.SoftwareContact metis [at] nist.gov (METIS)
Open-source software package for strain mapping via precession 4D-STEM; strain reference materials.Software, RM*, RGTM*, 
  • Contact srminfo [at] nist.gov (srminfo[at]nist[dot]gov)
  • Contact metis [at] nist.gov (METIS) about software distribution

Product NameTypeAccess
Data linking residual stress to 
properties of thermoset packaging Materials

(Data) Differential Scanning Calorimetry (DSC), Digital Image Correlation (DIC), rheology, and residual stress data.

DSC data: temperature (°C), conversion ratio (unitless), chemical conversion rate (%/min), time (min), heat Flow (W/mg)

DIC data: Images represented in csv format.

Rheology data: oscillation strain (%), oscillation stress (Pa), temperature (°C), time (s) axial force (N), Gap height (mm), angular frequency (rad/s), tangent loss delta (unitless), storage modulus (Pa), loss modulus (Pa), complex viscosity (Pa.s), oscillation torque (μN.m), oscillation displacement (rad), phase angle (°)

https://doi.org/10.18434/mds2-3698
Data on cure kinetics of liquid encapsulant.

(Data)

Conversion rate data: Conversion rate (%/min) as a function of temperature(°C) at different heating rates (°C/min)

Time-resolved FT-IR spectra: wavenumber (1/cm) absorbance (unitless), time (min)

Time-resolved Raman spectra: Raman shift (1/cm), intensity (a.u), time (min)

 

https://doi.org/10.18434/mds2-3702
Dual Mode Brillouin/Low-Frequency Raman spectroscopy images of local mechanical properties for packaging materials.

(Data)

Low-Frequency Raman Spectra: Raman Shift (1/cm), intensity (a. u.), fit, Boson Peak contribution to the fit, normal mode contribution to the fit, fit sum. Images represented as intensities in csv format.

Brillouin Light Scattering (BLS) spectra: Brillouin shift (GHz), intensity (a. u.), time (min). Images represented as intensities in csv format.

https://doi.org/10.18434/mds2-3725
AFM indentations performed on hybrid-bonding copper patterns at room temperature.(Data) AFM single-step and multi-step indentations performed on hybrid-
bonding copper patterns at room temperature. AFM Amplitude (V) vs. Frequency (Hz), Piezo displacement (m) vs. Time (s) and Force (N).		https://doi.org/10.18434/mds2-3867
Magnetometry for Micropatterned magnetic nanoparticle composites(Data) Magnetic flux density (T), magnetic moment (measured, corrected in Am2) or normalized (unitless), sample orientation (a-axis, b-axis, c-axis)https://doi.org/10.18434/mds2-3869
Electrical and mechanical measurement data for bond strength with different materials.DataContact metis [at] nist.gov (METIS)
Element-specific x-ray computed tomography (XCT) images for advanced packaging components.DataContact metis [at] nist.gov (METIS)
S-parameter calibration kit measurement data(Data) Scattering parameter calibration data for on-
wafer measurements from 10 MHz to 110 GHz. Frequency (GHz), S-parameters (complex), Permittivity.		https://doi.org/10.18434/mds2-3404
Calnet calibration serviceServicehttps://calnet.nist.gov/
Permittivity standard reference material.SRM*Contact srminfo [at] nist.gov (srminfo[at]nist[dot]gov)
System performance metrics for x-ray computed tomography instrumentation.ModelContact metis [at] nist.gov (METIS)
Mechanical measurement data of hybrid bonds and solder materials.DataContact metis [at] nist.gov (METIS)
Thermal-mechanical property datasets of interfaces in advanced packaging components.DataContact metis [at] nist.gov (METIS)
Optical properties measurement for silicon photonics.DataContact metis [at] nist.gov (METIS)
Thermal 3D images of advanced packaging.DataContact metis [at] nist.gov (METIS)

Product NameTypeAccess
Characterization of defects using photoemission and luminescence techniques.DataContact metis [at] nist.gov (METIS)
Open-source causal Green's function (CGF) tool for modeling thermal transport in nanoscale device components, 1-million-atom input dataset for the CGF tool.Code, DataContact metis [at] nist.gov (METIS)
Thermo-mechanical, element-sensitive EUV imaging data from different modalities (coherent diffractive imaging, holography, ptchography)DataContact metis [at] nist.gov (METIS)
Finite element model of piezoelectric materials for wireless communications; datasets of electromechanical properties of piezoelectric materials up to 30 GHzModel, DataContact metis [at] nist.gov (METIS)
Ferromagnetic resonance (FMR) data of static and dynamic magnetic properties of a CoFeB thickness series, with the external magnetic field pointing out of the film plane.(Data) FMR thickness series of CoFeB samples. Scattering parameter (S21 - complex) vs. magnetic field (Oe)https://doi.org/10.18434/mds2-3408
Thermal conductance, heat transfer, and heat capacitance data from molecular dynamics simulations.DataContact metis [at] nist.gov (METIS)
Joint Automated Repository for Various Integrated Simulations (JARVIS) - Main collectionData, Model, and Code Repositoryhttps://doi.org/10.18434/M3HQ1W
JARVIS-Leaderboard: Large Scale Benchmark of Materials Design MethodsData, Model, and Code Platform
ALIGNN: Atomistic Line Graph Neural NetworkModel
JARVIS-Tools: an open-source software package for data-driven atomistic materials designSoftware
ThreeBodyTB.jl code for fast and accurate tight binding band structure and total energy calculations across the periodic table.Code
TB3Py: three-body tight-binding calculations for materials (Python wrapper)Softwarehttps://github.com/usnistgov/tb3py
NIST Interatomic Potentials RepositoryRepository
Dataset for Construction of Amorphous Structure Models via Relaxation of Random Arrangements of Molecules" datasetDatahttps://data.nist.gov/od/id/mds2-3831
AtomGPT: Atomistic Generative Pretrained Transformer for Forward and Inverse Materials DesignModel
CHIPS-FF: Evaluating Universal Machine Learning Force Fields for Material PropertiesData, Model
Yabadaba: Yay, a base databaseSoftware
Intermat: A multiscale interface materials design packageSoftwarehttps://github.com/usnistgov/intermat
NFFLr - Neural Force Field Learning toolkitSoftwarehttps://github.com/usnistgov/nfflr
Time-resolved TEM image analysis toolSoftwarehttps://github.com/usnistgov/tem_analysis
Thermo-chemical data and model related to the atomic layer deposition (ALD) process; research-grade testing materialData, Model, RGTM*
  • Coming to METIS
  • Contact srminfo [at] nist.gov (srminfo[at]nist[dot]gov)
Data and images (from scanning probe, atom probe, optical spectroscopy, and electron microscopy) about electrical and carrier transport properties of GaN devices.DataContact metis [at] nist.gov (METIS)
NextG Channel Model Alliance, AI/ML algorithm to perform live data reduction for channel sounding measurements; libraries of wireless propagation models; RF propagation models; multi-path component extraction algorithms; data challenge for wireless propagation problems.(Repo) Contributed datasetshttps://nextg.nist.gov/
Transistor circuit models, statistical models for chip-level process variationsModelContact metis [at] nist.gov (METIS)
Thermal conductivity material test suite; protocol and best practices for thermoreflectance measurements.RGTM*, GuideContact metis [at] nist.gov (METIS)
Data and images on die-level circuit evaluation and failure analysisDataContact metis [at] nist.gov (METIS)

Product NameTypeAccess
U-net AI predictive models and scanning electron microscopy (SEM) images for overlay.(3838 = Data + Code) Six collections of SEM images, three trained U-net AI models, metrics on image quality and AI model accuracy.https://doi.org/10.18434/mds2-3838
Electrodeposition model, measurement, and simulation data for interconnects.Model, DataContact metis [at] nist.gov (METIS)
Long-term reliability data on semiconductor devices.DataContact metis [at] nist.gov (METIS)
RF-power uncertainty analysis; plasma-etching diagnostic data.(3825 = Software) Creates digital records of metrological traceability, including calibration chains that contribute to measurement uncertainty in a microwave network.https://github.com/usnistgov/rmellipse
Digital twin for atomic-layer deposition (ALD)Code, DataContact metis [at] nist.gov (METIS)
Operando x-ray photoemission spectroscopy (XPS) data as a plasma diagnostic.DataContact metis [at] nist.gov (METIS)
Computational mass and infrared (IR) spectra, and AI/machine-learning model, to aid Per- and Polyfluoroalkyl substance (PFAS) replacement.Model, DataContact metis [at] nist.gov (METIS)

Product NameTypeAccess
Research grade and standard microscopy calibration materials; 2D and 3D map of uncertainty related to parameters resulting from periodic structures.RGTM*, SRM*, Data
  • Contact srminfo [at] nist.gov (srminfo[at]nist[dot]gov)
  • Contact metis [at] nist.gov (METIS) about data distribution
Wafer-scale planarization data of hafnia on silicon deposited by atomic-layer deposition (ALD) ,reference materials for nanoscale dimensional and materials characterization
  • (Data = 3930) X-ray reflectometry (XRR) and variable wavelength spectroscopic ellipsometry (SE) from 200mm wafers with atomic-layer deposited (ALD) hafnia.
  • RM*
3D atom map from atom probe tomography (APT); research grade testing material for APT.Data, RGTM*
  • Contact metis [at] nist.gov (METIS) about data distribution
  • Contact srminfo [at] nist.gov (srminfo[at]nist[dot]gov)
CALPHAD and x-ray diffraction data of thermal properties of multi-phase and multi-component materials.DataContact metis [at] nist.gov (METIS)
Design of an open-source hardware test platform; measurement data on device linearity, precision, accuracy, noise, and reproducibility from memory devices using this open-source hardware test platform.DataContact metis [at] nist.gov (METIS)
Magnetic properties data on Pt and YIG; Pt and YIG Standard reference material.Data, SRM*
  • Contact metis [at] nist.gov (METIS) about data distribution
  • Contact srminfo [at] nist.gov (srminfo[at]nist[dot]gov)
X-ray fluorescence data on elements used in semiconductor manufacturing.DataContact metis [at] nist.gov (METIS)

Product NameTypeAccess
X-ray computed tomography (XCT) datasets with defect shapes, dimensions, and size distribution; defect classification ML code and software.Data, Code, SoftwareContact metis [at] nist.gov (METIS)
NIST Vulnerability Data OntologySemantic Asset
National Vulnerability Database with vulnerability ID, publication date, Common Vulnerability and Exposures (CVE ) Numbering Authorities (CNA), descriptionDatabase

https://nvd.nist.gov/

 

This is the METIS Beta release; changes to pages and content are expected.
Created September 10, 2024, Updated February 9, 2026
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