News and Updates

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Square with rounded edges. Fill of square looks like American flag. Coming off the sides of the square are lines with unfilled circles at end. Words underneath: CHIPS for AMERICA

Biden-Harris Administration Announce Preliminary Terms with Coherent, SkyWater, and X-Fab to Advance U.S. Supply Chain Security

December 6, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed three separate preliminary memoranda of terms (PMT) under the CHIPS

Biden-Harris Administration Announces CHIPS Incentives Awards with Absolics and Entegris to Support Development of Advanced Packaging Technology and Onshore Material for Leading-Edge Chip Production

December 5, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program's

Biden-Harris Administration Announces CHIPS Incentives Award with Intel to Advance U.S. Leading-Edge Chip Capacity and Create Tens of Thousands of Jobs

November 26, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Intel Corporation up to $7.865 billion in direct funding under the

Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Inc., and Rocket Lab to Expand Production of Chips Critical for U.S. National Security and Space Industry

November 25, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s

CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging

November 21, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced

Biden-Harris Administration Announces CHIPS Incentives Award with GlobalFoundries to Strengthen Essential Chip Supply for Key U.S. Industries Including Auto and Defense

November 20, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded GlobalFoundries (GF) up to $1.5 billion in direct funding under

CHIPS for America Announces New Proposed $285 Million Award for CHIPS Manufacturing USA Institute for Digital Twins, Headquartered in North Carolina

November 19, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium

Biden-Harris Administration Announces CHIPS Incentives Award with TSMC Arizona to Secure U.S. Leadership in Advanced Semiconductor Technology

November 15, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded TSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan

Biden-Harris Administration Announces Preliminary Terms with Akash Systems to Support Development and Production of Emerging Semiconductor Technology

November 13, 2024

Today, the Biden-Harris Administration announced that the Department of Commerce and Akash Systems have signed a non-binding preliminary memorandum of terms

Biden-Harris Administration Announces Preliminary Terms with Corning and Powerex to Support U.S. Supply Chain Resiliency

November 8, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed two separate preliminary memoranda of terms (PMT) under the CHIPS

Biden-Harris Administration Announces Sunnyvale, CA as Expected Location for Second CHIPS for America R&D Flagship Facility

November 1, 2024

Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced Sunnyvale, California as the

Biden-Harris Administration Announces NY CREATES’ Albany NanoTech Complex as the first CHIPS for America R&D Flagship Facility and Planned Site for the estimated $825 Million CHIPS for America EUV Accelerator

October 31, 2024

Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the

Biden-Harris Administration Opens $100 million Competition to Accelerate R&D and AI Technologies for Sustainable Semiconductor Materials

October 30, 2024

Today, the Biden-Harris Administration announced a Notice of Funding Opportunity (NOFO) for activities that will use cutting-edge artificial intelligence (AI)

Biden-Harris Administration Announces Preliminary Terms with Hemlock Semiconductor to Significantly Expand U.S. Production Capacity of Semiconductor-Grade Polysilicon

October 21, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Hemlock Semiconductor (HSC) have signed a non-binding preliminary

Biden-Harris Administration Opens Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging Technologies

October 18, 2024

Today, the Biden-Harris Administration issued a Notice of Funding Opportunity (NOFO) funded by the CHIPS and Science Act to enable the United States

Biden-Harris Administration Announces Preliminary Terms with Infinera to Support Development of Semiconductor Technology Important for Communications and National Security

October 17, 2024

Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to

Biden-Harris Administration Announces Preliminary Terms with Wolfspeed to Solidify U.S. Technological Leadership in Silicon Carbide Manufacturing

October 15, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Wolfspeed, Inc. have signed a non-binding preliminary memorandum of

Biden-Harris Administration Announces Preliminary Terms with Edwards Vacuum to Bring Specialized Dry Vacuum Pump Manufacturing to the U.S. for the First Time

October 10, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Edwards Vacuum have signed a non-binding preliminary memorandum of

CHIPS for America Welcomes New Chair and Vice Chair to Industrial Advisory Committee (IAC)

October 8, 2024

Today, CHIPS for America announced a new Chair and Vice Chair to the Industrial Advisory Committee (IAC). The IAC and its three working groups – which focus on

CHIPS for America Welcomes New and Returning Members to the Industrial Advisory Committee

October 4, 2024

Today, CHIPS for America announced five new members to the Industrial Advisory Committee (IAC). The IAC and its three working groups – which focus on

CHIPS for America Announces Entrepreneurial Fellowships Pilot Program

October 4, 2024

Today, CHIPS for America announced a new $5 million Entrepreneurial Fellowship Pilot Program, funded by the Biden-Harris Administration's CHIPS and Science Act

Biden-Harris Administration to Invest up to $100 Million to Accelerate R&D and AI Technologies for Sustainable Semiconductor Materials

October 2, 2024

Today, the U.S. Department of Commerce issued a Notice of Intent (NOI) to announce an open competition demonstrating how AI can assist in developing new

U.S. National Science Foundation and Department of Commerce Announce a New $30M Funding Opportunity, Funded by the CHIPS & Science Act, to Prepare Talent for Semiconductor Jobs Nationwide

September 27, 2024

The Network Coordination Hub for the National Network for Microelectronics Education will establish and operate regional nodes to offer consistent, rigorous

CHIPS for America Releases METIS Data Exchange Ecosystem for Supporting Metrology Innovation

September 26, 2024

Media Contact: Hannah Robinson, hannah.robinson [at] chips.gov (hannah[dot]robinson[at]chips[dot]gov) Today, CHIPS for America released a beta version of the Metrology Exchange to Innovate in

Biden-Harris Administration Launches NSTC Workforce Center of Excellence with Expected $250 Million Investment

September 25, 2024

Today, the Biden-Harris Administration announced the launch of the National Semiconductor Technology Center’s (NSTC) Workforce Center of Excellence (WCoE)

NIST Headquarters
-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)
--CHIPS Program Office
---CHIPS Program Headquarters
----CHIPS Program Headquarters - HQ
----Opportunity & Inclusion Group
---External & Government Affairs Division
----External & Government Affairs – HQ
---Investments Division
----Investments Division – HQ
---Operations Office
----Operations Office – HQ
---Risk Management Division
----Risk Management – HQ
---Strategy, Technology & Policy Division
----Strategy, Technology & Policy – HQ
--CHIPS Research & Development Program Office
---CHIPS Research & Development Program Headquarters Division
----CHIPS Research & Development Program Headquarters – HQ
----Integration & Policy Office
----Outreach & Partnerships Office
---External R&D Partnerships Division
----External R&D Partnerships – HQ
----National Advanced Packaging Manufacturing Program Group
----National Semiconductor Technology Center Group
---Industrial Advisory Committee
----Industrial Advisory Committee – HQ
---Semiconductor Manufacturing Institute Division
----Semiconductor Manufacturing Institute – HQ
---Semiconductor Metrology & Characterization Office
----Semiconductor Metrology & Characterization Office – HQ
-Management Resources
--Management Resources
---Associate Director for Management Resources
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---Business Operations Office
----Business Analytics Group
----Business Operations Office - HQ
----Customer Relationship Management Group
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----Project Management Office
---Emergency Services Office
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---Equal Employment Opportunity and Accessibility Office
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---NIST Research Library and Museum
----Research Library Group
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----NIST Research Library and Museum - HQ
---Fabrication Technology Office
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--Office of Facilities and Property Management
---Boulder Design and Construction Division
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----Facilities Improvement (Boulder) Group
----Reimbursable Work Group
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---Gaithersburg Design and Construction Division
----Facilities Improvement (Gaithersburg) Group
----Reimbursable Work (Gaithersburg) Group
----Facilities Library, Archives, and As-Built (Gaithersburg) Group
----Construction Contract Management Group
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----Gaithersburg Design and Construction - HQ
---Gaithersburg Facility Maintenance Division
----Building Management (Gaithersburg) Group
----Operations Engineering Group
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--Office of Acquisition and Agreements Management
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----Office of Acquisition and Agreements Management - HQ
----Policy and Compliance Group
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---Financial Assistance Agreements Management Office
----Financial Assistance Agreements Management Office – HQ
---Acquisition Management Division
----Acquisition Management - HQ
----Acquisition Operations
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--Office of Information Systems Management
---Applications Systems Division
----Applications Systems - HQ
---Research Services Office
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---Business Systems Division
----Business Systems Division - HQ
---Information Technology Security & Networking Division
----Information Technology Security & Networking - HQ
---Identity, Credential, and Access Management Division
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---Customer Access and Support Division
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---Infrastructure Services Division
----Infrastructure Services Division - HQ
---Office of Information Systems Management
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---Innovation and Solutions Division
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---Platform Services Division
----Platform Services Division - HQ
--Office of Human Resources Management
---Learning and Organizational Development Division
----Learning and Organizational Development – HQ
---Talent Acquisition Division
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---Workforce Analytics and Technology Division
----Workforce Analytics and Technology – HQ
---Human Resources Management Office
----Human Resources Management Office - HQ
---Workforce Programs Division
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--Office of Safety, Health and Environment
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----Office of Safety, Health and Environment - HQ
---Gaithersburg Safety, Health and Environment Division
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----Fire and Facilities Safety Group
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---Radiation Safety Division
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----Radiation Safety - HQ
---Boulder Safety, Health and Environment Division
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---Financial Systems and Reporting Division
----CBS Core Support Group
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----Financial Systems and Reporting Division - HQ
----Financial Statements Group
----Data Control Group
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---Office of Financial Resource Management
----Office of Financial Resource Management - HQ
----Internal Controls Management & Evaluation Office
----Enterprise Risk Management Office
---Finance Division
----Finance - HQ
----Financial Statements Group
----Data Control and Cost Execution Group
----Accounts Payable Purchase Orders, Grants & Foreign Payments
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----Travel Group
---Financial Operations Division
----Travel Group
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---Budget Division
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--Communications Technology Laboratory
---RF Technology Division
----High-Speed Waveform Metrology Group
----Superconductive Electronics Group
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----RF Technology Division - HQ
---Smart Connected Systems Division
----IoT Devices and Infrastructures Group
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---Spectrum Technology and Research Division
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----Fiber Sources and Applications Group
----Shared Spectrum Metrology Group
----Spectrum Technology and Research – HQ
---Wireless Networks Division
----Internet Technologies Research Group
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----Wireless Networks Division - HQ
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---Public Safety Communications Research Division
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----Advanced Communications Research Group
----Network Operations Group
---Communications Technology Laboratory HQ
----Communications Technology Laboratory HQ Gp
----Boulder Laboratory Director Office
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--Engineering Laboratory
---Building Energy and Environment Division
----Building Energy and Environment - HQ
----Mechanical Systems and Controls Group
----Indoor Air Quality and Ventilation Group
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---Intelligent Systems Division
----Intelligent Systems - HQ
----Manipulation and Mobility Systems Group
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---Materials and Structural Systems Division
----Earthquake Engineering Group
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----Infrastructure Materials Group
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----Materials and Structural Systems - HQ
----Polymeric Materials Group
----Structures Group
---Engineering Laboratory Office
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----Engineering Laboratory - HQ
----Engineering Laboratory Data, Security, Technology Group
---Fire Research Division
----National Fire Research Laboratory Group
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----Fire Research - HQ
----Engineered Fire Safety Group
----Fire Fighting Technology Group
---Systems Integration Division
----Life Cycle Engineering Group
----Process Engineering Group
----Information Modeling and Testing Group
----Systems Integration - HQ
--Information Technology Laboratory
---Applied Cybersecurity Division
----Applied Cybersecurity - HQ
----Cybersecurity and Privacy Applications Group
----National Cybersecurity Center of Excellence
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----NICE
---Computer Security Division
----Computer Security - HQ
----Cryptographic Technology Group
----Secure Systems and Applications Group
----Security Components and Mechanisms Group
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----Security Engineering and Risk Management Group
---Applied and Computational Mathematics Division
----Mathematical Software Group
----Mathematical Analysis and Modeling Group
----Computing and Communications Theory Group
----High Performance Computing and Visualization Group
----Applied and Computational Mathematics - HQ
---Statistical Engineering Division
----Applied and Computational Statistics Group
----Statistical Design, Analysis, and Modeling Group
----Statistical Engineering - HQ
---Software and Systems Division
----Systems Interoperability Group
----Software Quality Group
----Software and Systems - HQ
----Cyber Infrastructure Group
----Information Systems Group
---Information Access Division
----Information Access - HQ
----Image Group
----Multimodal Information Group
----Retrieval Group
----Visualization and Usability Group
---Information Technology Laboratory Office
----Office of Computational Science for Metrology
----Office of Emerging Technologies
----Office of IT Standardization
----Office of Government and Industrial Liaison
----Information Technology Laboratory Office - HQ
----Office of Chief Cybersecurity Advisor
--Laboratory Programs
---Research Data and Computing Office
----Research Data and Computing Office – HQ
---Research Protections Office
----Research Protections Office - HQ
---Research Security and Safeguarding Science Office
----Research Security and Safeguarding Science - HQ
---Standards Coordination Office
----International Standards Policy and Coordination Group
----Standards and Conformity Assessment Services Group
----Standards Coordination Office - HQ
----National Voluntary Laboratory Accreditation Program (NVLAP)
---Special Programs Office
----Special Programs Office-HQ
----Law Enforcement Standards Office
---Associate Director for Laboratory Programs
----Associate Director for Laboratory Programs - HQ
--Material Measurement Laboratory
---Office of Reference Materials
----Business and Quality Management Group
----Business Application Development, Support, and Security Group
----Sales and Customer Services Group
----Publication and Web Services Group
----Office of Reference Materials - HQ
----Materials and Physical Services Group
---Office of Data and Informatics
----Office of Data and Informatics - HQ
----Data Services Group
----Data Sciences Group
---Biosystems and Biomaterials Division
----Biomarker and Genomic Sciences Group
----Cellular Engineering Group
----Biomaterials Group
----Genome-Scale Measurements Group
----Complex Microbial Systems Group
----Cell Systems Science Group
----Biosystems and Biomaterials Division - HQ
---Chemical Sciences Division
----Biochemical and Exposure Science Group
----Chemical Informatics Group
----Optical Measurements Group
----Chemical Process and Nuclear Measurements Group
----Gas Sensing Metrology Group
----Inorganic Chemical Metrology Group
----Biospecimen Science Group
----Environmental Chemical Sciences Group
----Chemical Sciences Division - HQ
----Marine Biochemical Sciences Group
----Organic Chemical Metrology Group
---Biomolecular Measurement Division
----Biomolecular Structure and Function Group
----Mass Spectrometry Data Center Group
----Bioprocess Measurements Group
----Bioanalytical Science Group
----Biomolecular Measurement Division - HQ
----Applied Genetics Group
---Applied Chemicals and Materials Division
----Applied Chemicals and Materials Division - HQ
----Thermodynamics Research Center Group
----Thermophysical Properties of Fluids Group
----Nanoscale Reliability Group
----Fluid Characterization Group
----Fatigue and Fracture Group
---Materials Science and Engineering Division
----Thermodynamics and Kinetics Group
----Polymers Processing Group
----Mechanical Performance Group
----Polymers and Complex Fluids Group
----Materials Science and Engineering Division - HQ
----Functional Polymers Group
----Functional Nanostructured Materials Group
---Materials Measurement Science Division
----Security Technologies Group
----Surface and Trace Chemical Analysis Group
----Nanomechanical Properties Group
----Nano Materials Research Group
----Materials Structure and Data Group
----Microscopy and Microanalysis Research Group
----Synchrotron Science Group
----Materials Measurement Science Division - HQ
----Data and AI-Driven Materials Science Group
---Material Measurement Laboratory Office
----The Material Measurement Laboratory Office of Operations Group
----Material Measurement Laboratory - HQ
----Genome-Scale Measurement Group
--NIST Center for Neutron Research
---NIST Center for Neutron Research
----Research Facility Operations Group
----NIST Center for Neutron Research - HQ
----Reactor Operations and Engineering Group
----Neutron-Condensed Matter Science Group
--Physical Measurement Laboratory
---Microsystems and Nanotechnology Division
----Biophysical and Biomedical Measurement Group
----Microsystems and Nanotechnology - HQ
----Nanostructure Fabrication and Measurement Group
----Photonics and Optomechanics Group
---Time and Frequency Division
----Atomic Devices & Instrumentation Group
----Precision Photonic Synthesis Group
----Quantum & Nonlinear Nanophotonics Group
----Atomic Standards Group
----Ion Storage Group
----Neutral Atom Optical Clocks Group
----Time Realization and Distribution Group
----Phase Noise Metrology Group
----Time and Frequency - HQ
---Quantum Physics Division
----Quantum Physics - HQ
---Radiation Physics Division
----Dosimetry Group
----Radioactivity Group
----Radiation Physics - HQ
----Neutron Physics Group
---Sensor Science Division
----Fundamental Thermodynamics Group
----Ultraviolet Radiation Group
----Sensor Science - HQ
----Dimensional Metrology Group
----Temperature & Humidity Group
----Remote Sensing Group
----Optical Radiation Group
----Fluid Metrology Group
----Surface and Interface Metrology Group
---Applied Physics Division
----Advanced Microwave Photonics Group
----Spin Electronics Group
----Applied Physics - HQ
----Faint Photonics Group
----Quantitative Nanostructure Characterization Group
----Quantum Devices Group
----Molecular and Bio-Photonics Group
----Optoelectronic Manufacturing Group
----Magnetic Imaging Group
----Quantum Nanophotonics Group
----Sources and Detectors Group
---Quantum Measurement Division
----Quantum Optics Group
----Mass and Force Group
----Quantum Measurement - HQ
----Laser Cooling and Trapping Group
----Fundamental Electrical Measurements Group
----Applied Electrical Metrology Group
----Atomic Spectroscopy Group
---Quantum Sensors Division
----Device Fabrication Group
----Long Wavelength Sensors and Applications Group
----Quantum Calorimeters Group
----Quantum Electronics Group
----Quantum Processing Group
----Quantum Sensors Group
----Quantum Sensors – HQ
----Nanoscale Spin Dynamics Group
----Microfabrication Group
----Spin Electronics Group
----Magnetics Group
---Nanoscale Device Characterization Division
----Atom Scale Device Group
----Nanoscale Device Characterization Division - HQ
----Alternative Computing Group
----Nanoscale Spectroscopy Group
----Advanced Electronics Group
----Nanoscale Processes and Measurements Group
---Physical Measurement Laboratory Office
----Boulder Microfabrication Facility
----Physical Measurement Laboratory- HQ
----PML Information Office
----Center for Nanoscale Science and Technology
----Office of Weights and Measures
----Boulder Laboratory Director Office
-Innovation & Industry Services
--Office of Advanced Manufacturing
---Microelectronics Manufacturing Division
----Microelectronics Manufacturing – HQ
----Microelectronics Strategy and Enterprise Group
----Semiconductor Coordination Group
----Semiconductor Operations Group
----Workforce and Equity Development Group
---Office of Advanced Manufacturing
----Office of Advanced Manufacturing - HQ
---Partnerships and Outreach Division
----Communications and Marketing Group
----Education and Workforce Development Group
----Partnership Engagement Group
----Partnerships and Outreach – HQ
----Technology Hubs Development Group
---Program Operations Division
----Competitions Group
----Institute and Program Management Group
----Performance Management Group
----Program Operations - HQ
---Strategy and Planning Division
----Analysis and Benchmarking Group
----Strategic Planning Group
----Strategy and Planning – HQ
--Baldrige Performance Excellence Program
---Baldrige Performance Excellence Program Office
----Award Process Group
----Director's Office, Baldrige Performance Excellence Program
----Administrative Support/Electronic Information Group
----Outreach and Communications Group
----Publications Management Group
----Workforce Development Group
--Innovation & Industry Services
---Associate Director for Innovation & Industry Services
----Associate Director for Innovation & Industry Services - HQ
---Advanced Manufacturing Office
----Advanced Manufacturing Office - HQ
---Economic Analysis Office
----Economic Analysis Office - HQ
---Technology Partnerships Office
----Technology Partnerships Office - HQ
---Technology Innovation Program Office
----Technology Innovation Program Office - HQ
--Hollings Manufacturing Extension Partnership Program
---National Platforms Division
----National Platforms – HQ
----Network Knowledge Management Group
----Supply Chain Group
---National Programs Division
----National Programs- HQ
---Network Learning and Strategic Competitions Division
----Network Learning and Strategic Competitions - HQ
---Outreach and External Affairs Division
----Outreach and External Affairs – HQ
---Performance Evaluation and Economic Impacts Division
----Performance Evaluation and Economic Impacts - HQ
----Performance Metrics and Evaluation Group
---Regional and State Partnerships Division
----Regional Management Group
----Regional and State Partnerships - HQ
---Network Agreements Management Division
----Network Agreements Management - HQ
----Node B Group
----Node A Group
---Internal Operations Division
----Internal Operations – HQ
----Center Operations and Financial Management Group
---Extension Services Division
----Extension Services - HQ
---Hollings Manufacturing Extension Partnership Program Office
----Hollings Manufacturing Extension Partnership Program - HQ
-Director's Office
--Director's Office
---Ombuds Office
----Ombuds Office - HQ
---Public Affairs Office
----Media Liaison Group
----Video and Digital Media Production Group
----Public Affairs Office - HQ
----Internal Communications and Inquiries Group
----Conference Program and Audiovisual Services Group
----Boulder Meetings Support and Services Group
----Web Content Development Group
---Program Coordination Office
----Program Coordination Office - HQ
---Director's Office
----Director's Office - HQ
----Onboarding Group
---Congressional and Legislative Affairs Office
----Congressional and Legislative Affairs Office - HQ
---Human Subjects Protection Office
----Human Subjects Protection Office - HQ
---Management and Organization Office
----Management and Organization Office- HQ
---International and Academic Affairs Office
----International and Academic Affairs Office - HQ