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The NIST Office of Weights and Measures (OWM) has been working with the International Organization of Legal Metrology (OIML) on developing digitalized...
Our everyday life is flooded with photons, the quantum building blocks of light. For cutting-edge technology, from quantum computing to deep-tissue imaging...
The Department of Commerce today announced the signing of 7 letters of intent to provide $874 million in federal incentives under the CHIPS and Science Act.
As a result of the historic deal related to U.S. and Taiwan Trade and Investment announced in January 2026, TSMC has just announced an incremental $100 billion...
The Department of Commerce’s CHIPS Program Office announced today the signing of a Direct Funding Agreement with Robert Bosch Semiconductor LLC (“Bosch”) for up...
The Department of Commerce’s CHIPS Research & Development Office today announced the signing of a definitive agreement with I-Pulse for a $250 million award...
The Department of Commerce’s CHIPS Research & Development Office today announced the signing of a definitive agreement with SandboxAQ for a $500 million award...
The Department of Commerce’s CHIPS Program Office announced the signing of a letter of intent to provide up to $50 million in direct funding to Coherent Corp....
The U.S. Department of Commerce announced today the signing of a Direct Funding Agreement with Powerex to invest $30 million in manufacturing and R&D to...
The Department of Commerce’s CHIPS Program Office announced the signing of a final award for up to $277 million in federal incentives and a loan agreement for...
The U.S. Department of Commerce and the National Institute of Standards and Technology (NIST) announced today the signing of a final award of $150 million in...
The Department of Commerce today announced the signing of 9 letters of intent to provide $2.013 billion in federal incentives under the CHIPS and Science Act.
NIST scientists and collaborators have pioneered a way to make integrated circuits for light by depositing complex patterns of specialized materials onto...
The advance could allow these technologies to operate in deep-space probes, inside nuclear reactors, in ultrahigh vacuum systems, and at temperatures both near...
Since the first computers were developed, their performance has mainly depended on increasing the density of transistors on monolithic chips. However, as we...
The Department of Commerce’s CHIPS Program Office announced the signing of a non-binding letter of intent to provide up to $277 million in direct funding and up...