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Biden-Harris Administration Announces CHIPS Incentives Award with TSMC Arizona to Secure U.S. Leadership in Advanced Semiconductor Technology

November 15, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded TSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan...

Square with rounded edges. Fill of square looks like American flag. Coming off the sides of the square are lines with unfilled circles at end. Words underneath: CHIPS for AMERICA

Biden-Harris Administration Announces Preliminary Terms with Akash Systems to Support Development and Production of Emerging Semiconductor Technology

November 13, 2024

Today, the Biden-Harris Administration announced that the Department of Commerce and Akash Systems have signed a non-binding preliminary memorandum of terms...

Biden-Harris Administration Announces Preliminary Terms with Corning and Powerex to Support U.S. Supply Chain Resiliency

November 8, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed two separate preliminary memoranda of terms (PMT) under the CHIPS...

Biden-Harris Administration Announces Sunnyvale, CA as Expected Location for Second CHIPS for America R&D Flagship Facility

November 1, 2024

Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced Sunnyvale, California as the...

Biden-Harris Administration Announces NY CREATES’ Albany NanoTech Complex as the first CHIPS for America R&D Flagship Facility and Planned Site for the estimated $825 Million CHIPS for America EUV Accelerator

October 31, 2024

Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the...

Biden-Harris Administration Opens $100 million Competition to Accelerate R&D and AI Technologies for Sustainable Semiconductor Materials

October 30, 2024

Today, the Biden-Harris Administration announced a Notice of Funding Opportunity (NOFO) for activities that will use cutting-edge artificial intelligence (AI)...

Biden-Harris Administration Announces Preliminary Terms with Hemlock Semiconductor to Significantly Expand U.S. Production Capacity of Semiconductor-Grade Polysilicon

October 21, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Hemlock Semiconductor (HSC) have signed a non-binding preliminary...

Biden-Harris Administration Opens Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging Technologies

October 18, 2024

Today, the Biden-Harris Administration issued a Notice of Funding Opportunity (NOFO) funded by the CHIPS and Science Act to enable the United States...

Biden-Harris Administration Announces Preliminary Terms with Infinera to Support Development of Semiconductor Technology Important for Communications and National Security

October 17, 2024

Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to...

Biden-Harris Administration Announces Preliminary Terms with Wolfspeed to Solidify U.S. Technological Leadership in Silicon Carbide Manufacturing

October 15, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Wolfspeed, Inc. have signed a non-binding preliminary memorandum of...

Biden-Harris Administration Announces Preliminary Terms with Edwards Vacuum to Bring Specialized Dry Vacuum Pump Manufacturing to the U.S. for the First Time

October 10, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Edwards Vacuum have signed a non-binding preliminary memorandum of...

CHIPS for America Welcomes New Chair and Vice Chair to Industrial Advisory Committee (IAC)

October 8, 2024

Today, CHIPS for America announced a new Chair and Vice Chair to the Industrial Advisory Committee (IAC). The IAC and its three working groups – which focus on...

CHIPS for America Welcomes New and Returning Members to the Industrial Advisory Committee

October 4, 2024

Today, CHIPS for America announced five new members to the Industrial Advisory Committee (IAC). The IAC and its three working groups – which focus on...

CHIPS for America Announces Entrepreneurial Fellowships Pilot Program

October 4, 2024

Today, CHIPS for America announced a new $5 million Entrepreneurial Fellowship Pilot Program, funded by the Biden-Harris Administration's CHIPS and Science Act...

Biden-Harris Administration to Invest up to $100 Million to Accelerate R&D and AI Technologies for Sustainable Semiconductor Materials

October 2, 2024

Today, the U.S. Department of Commerce issued a Notice of Intent (NOI) to announce an open competition demonstrating how AI can assist in developing new...

U.S. National Science Foundation and Department of Commerce Announce a New $30M Funding Opportunity, Funded by the CHIPS & Science Act, to Prepare Talent for Semiconductor Jobs Nationwide

September 27, 2024

Today, the U.S. National Science Foundation (NSF) and Department of Commerce (DOC) announced a $30 million funding opportunity, as part of the bipartisan CHIPS...

CHIPS for America Releases METIS Data Exchange Ecosystem for Supporting Metrology Innovation

September 26, 2024

Today, CHIPS for America released a beta version of the Metrology Exchange to Innovate in Semiconductors (METIS) . A major milestone for the CHIPS Metrology...

Biden-Harris Administration Launches NSTC Workforce Center of Excellence with Expected $250 Million Investment

September 25, 2024

Today, the Biden-Harris Administration announced the launch of the National Semiconductor Technology Center’s (NSTC) Workforce Center of Excellence (WCoE)...

Biden-Harris Administration Announces First CHIPS Commercial Fabrication Facilities Award with Polar Semiconductor, Establishing Independent American Foundry

September 24, 2024

Today, as part of the Biden-Harris Administration’s Investing in America agenda, the U.S. Department of Commerce announced its first award under the CHIPS...

Biden-Harris Administration Awards nearly $5 million to Small Businesses to Bring New CHIPS Technology to the Commercial Market

September 19, 2024

Media Contact: Hannah Robinson, hannah.robinson [at] chips.gov (hannah[dot]robinson[at]chips[dot]gov) . Today, the Biden-Harris Administration awarded nearly $5 million to 17 small businesses across nine...

CHIPS for America Metrology Community in blue text with a blue to red gradient line

CHIPS for America Announces New CHIPS Metrology Community of Practice

August 28, 2024

Media Contact: Hannah Robinson, hannah.robinson [at] chips.gov (hannah[dot]robinson[at]chips[dot]gov) . Today, CHIPS for America announced the establishment of a new community of practice, the CHIPS...

Biden-Harris Administration Announces Preliminary Terms with HP to Support Development and Commercialization of Cutting-Edge Semiconductor Technologies

August 27, 2024

Media Contact: Hannah (Robinson) Hartranft, hannah.hartranft [at] chips.gov (hannah[dot]hartranft[at]chips[dot]gov) Today, the Biden-Harris Administration announced that the Department of Commerce and HP...

Biden-Harris Administration Announces Preliminary Terms with Texas Instruments to Expand U.S. Current-Generation and Mature-Node Chip Capacity

August 16, 2024

U.S. Department of Commerce Announces Preliminary Terms with SK hynix to Advance U.S. AI Supply Chain Security

August 6, 2024

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and SK hynix have signed a non-binding preliminary memorandum of terms...

Biden-Harris Administration Announces Preliminary Terms with Amkor Technology to Bring Cutting-Edge Advanced Packaging Technology to the U.S. for Leading-Edge Semiconductors

July 26, 2024

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----Performance Evaluation and Economic Impacts - HQ
----Performance Metrics and Evaluation Group
---Network Agreements Management Division
----Network Agreements Management - HQ
----Node B Group
----Node A Group
---Internal Operations Division
----Internal Operations – HQ
---Hollings Manufacturing Extension Partnership Program Office
----Hollings Manufacturing Extension Partnership Program - HQ
-Director's Office
--Director's Office
---Ombuds Office
----Ombuds Office - HQ
---Public Affairs Office
----Media Liaison Group
----Video and Digital Media Production Group
----Public Affairs Office - HQ
----Internal Communications and Inquiries Group
----Conference Program and Audiovisual Services Group
----Boulder Meetings Support and Services Group
----Web Content Development Group
---Program Coordination Office
----Program Coordination Office - HQ
---Director's Office
----Director's Office - HQ
---Congressional and Legislative Affairs Office
----Congressional and Legislative Affairs Office - HQ
---Management and Organization Office
----Management and Organization Office- HQ
---International and Academic Affairs Office
----International and Academic Affairs Office - HQ