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CHIPS for America Releases Vision for Approximately $3 Billion National Advanced Packaging Manufacturing Program

November 20, 2023

Biden-Harris administration outlines how the program will boost U.S. advanced packaging capabilities for semiconductors.

Square with rounded edges. Fill of square looks like American flag. Coming off the sides of the square are lines with unfilled circles at end. Words underneath: CHIPS for AMERICA

Department of Commerce Reaches Agreement with New Organization, SemiUS, to Operate National Semiconductor Technology Center (NSTC) Once Established

November 9, 2023

SemiUS is now known as the National Center for the Advancement of Semiconductor Technology, or Natcast, to better reflect their activities and focus. Learn more

Selection Committee Announces Leaders to Operate the CHIPS for America National Semiconductor Technology Center

October 11, 2023

The NSTC is the core research and development (R&D) component of the Department of Commerce’s CHIPS for America program.

map showing growth of manufacturing and small-scale supply chain businesses in the US

Biden-Harris Administration Announces CHIPS for America Funding Opportunity to Strengthen Semiconductor Supply Chains

September 29, 2023

WASHINGTON—Today, the U.S. Department of Commerce announced a funding opportunity for smaller supply chain projects and businesses to access CHIPS for America

Semiconductor chip with USA flag overlaid on top

Biden-Harris Administration Announces Final National Security Guardrails for CHIPS for America Incentives Program

September 22, 2023

WASHINGTON — The U.S. Department of Commerce today released the final rule implementing the national security guardrails of the bipartisan CHIPS and Science Act

Joint Statement on the National Semiconductor Technology Center (NSTC)

August 9, 2023

Today, CHIPS for America released the following statement on the status of establishing the National Semiconductor Technology Center: “Discussions are underway

CHIPS for America Announces Selection Committee for the Board of Trustees of the National Semiconductor Technology Center

June 20, 2023

The new center will be a key pillar of the bipartisan CHIPS and Science Act’s research and development (R&D) program.

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Archived News

CHIPS for America Releases Vision for Approximately $3 Billion National Advanced Packaging Manufacturing Program

Department of Commerce Reaches Agreement with New Organization, SemiUS, to Operate National Semiconductor Technology Center (NSTC) Once Established

Selection Committee Announces Leaders to Operate the CHIPS for America National Semiconductor Technology Center

Biden-Harris Administration Announces CHIPS for America Funding Opportunity to Strengthen Semiconductor Supply Chains

Biden-Harris Administration Announces Final National Security Guardrails for CHIPS for America Incentives Program

Joint Statement on the National Semiconductor Technology Center (NSTC)

CHIPS for America Announces Selection Committee for the Board of Trustees of the National Semiconductor Technology Center

NIST Seeks Nominations for the Industrial Advisory Committee

Commerce Department Outlines Proposed National Security Guardrails for CHIPS for America Incentives Program

U.S. Department of Commerce Announces CHIPS for America Leaders and Staff

News from CHIPS Incentives and R&D

Advanced communications
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Artificial intelligence
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Buildings and Construction
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Chemistry
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Electronics
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Energy
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Environment
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Fire
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Forensic Science
-Digital evidence
-Drugs and toxicology
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Health
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Information technology
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-Data and informatics
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-Digital twins
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--Mobile and wireless networking
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Infrastructure
Manufacturing
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-Factory communications
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-Interoperability in manufacturing
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-Process improvement
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-Product data
-Robotics
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Materials
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Mathematics and statistics
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Metrology
-Amount of substance
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Nanotechnology
-Nanobiotechnology
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-Nanofabrication / manufacturing
--Lithography
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Neutron research
Performance excellence
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Physics
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-Nuclear physics
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Public safety
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-First responder preparedness
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-Response robots
Resilience
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Standards
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Technology transfer
Transportation
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NIST Headquarters
-Creating Helpful Incentives to Produce Semiconductors for America (CHIPS)
--CHIPS Program Office
---CHIPS Program Headquarters
----CHIPS Program Headquarters - HQ
----Opportunity & Inclusion Group
---External & Government Affairs Division
----External & Government Affairs – HQ
---Investments Division
----Investments Division – HQ
---Operations Office
----Operations Office – HQ
---Risk Management Division
----Risk Management – HQ
---Strategy, Technology & Policy Division
----Strategy, Technology & Policy – HQ
--CHIPS Research & Development Program Office
---CHIPS Research & Development Program Headquarters Division
----CHIPS Research & Development Program Headquarters – HQ
----Integration & Policy Office
----Outreach & Partnerships Office
---External R&D Partnerships Division
----External R&D Partnerships – HQ
----National Advanced Packaging Manufacturing Program Group
----National Semiconductor Technology Center Group
---Industrial Advisory Committee
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---Semiconductor Manufacturing Institute Division
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---Semiconductor Metrology & Characterization Office
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-Management Resources
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---Associate Director for Management Resources
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---Business Operations Office
----Business Analytics Group
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---Emergency Services Office
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--Office of Facilities and Property Management
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----Facilities Improvement (Gaithersburg) Group
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----Gaithersburg Design and Construction - HQ
---Gaithersburg Facility Maintenance Division
----Building Management (Gaithersburg) Group
----Operations Engineering Group
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----Operations and Maintenance (Gaithersburg) Group
---Facilities Services Division
----Logistics Group
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----Site Services Group
----Facilities Services Division - HQ
---Boulder Facilities Maintenance Division
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---Office of Facilities and Property Management
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----Administrative Operations Group
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--Office of Acquisition and Agreements Management
---Office of Acquisition and Agreements Management
----Office of Acquisition and Agreements Management - HQ
---Financial Assistance Agreements Management Office
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---Acquisition Management Division
----Acquisition Management - HQ
----Acquisition Operations
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--Office of Information Systems Management
---Applications Systems Division
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----Business Systems Group
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---Information Technology Security & Networking Division
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---Customer Access and Support Division
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----Embedded Support Group A
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---Infrastructure Services Division
----Compute & Storage Group
----Computer Facilities Group
----Infrastructure Services Division - HQ
----Security & Monitoring Group
----Unix Hosting Group
----Windows Hosting Group
---Office of Information Systems Management
----Office of Information Systems Management - HQ
----Service & Project Management Group
---Platform Services Division
----Authentication & Directory Services Group
----Collaboration Services Group
----Enterprise Cloud Communications Group
----Enterprise Continuous Diagnostics and Monitoring Group
----Platform Management Group
----Platform Services Division - HQ
--Office of Human Resources Management
---Learning and Organizational Development Division
----Learning and Organizational Development – HQ
---Talent Acquisition Division
----Talent Acquisition – HQ
---Workforce Analytics and Technology Division
----Workforce Analytics and Technology – HQ
---Human Resources Management Office
----Human Resources Management Office - HQ
---Workforce Programs Division
----Workforce Programs – HQ
--Office of Safety, Health and Environment
---Office of Safety, Health and Environment
----Office of Safety, Health and Environment - HQ
---Gaithersburg Safety, Health and Environment Division
----Safety and Health Group
----Gaithersburg Safety, Health and Environment - HQ
----Fire and Facilities Safety Group
----Environmental Management Group
---Radiation Safety Division
----Radiation Facilities Group
----Program Development and Compliance Group
----Radiation Safety - HQ
---Boulder Safety, Health and Environment Division
----Boulder Safety, Health and Environment - HQ
--Office of Financial Resource Management
---Financial Systems and Reporting Division
----CBS Core Support Group
----CBS Feeder System Support Group
----Financial Systems and Reporting Division - HQ
----Financial Statements Group
----Data Control Group
----Reconciliations Group
---Office of Financial Resource Management
----Office of Financial Resource Management - HQ
----Internal Controls Management & Evaluation Office
----Enterprise Risk Management Office
---Financial Operations Division
----Travel Group
----Agreements Group
----Accounts Receivable Group
----Financial Operations - HQ
----Accounts Payable Group
---Budget Division
----Technical and Extramural Programs Group
----Institutional Support and Facilities Group
----Budget - HQ
----Formulation and Financial Management Group
-Laboratory Programs
--Communications Technology Laboratory
---RF Technology Division
----High-Speed Waveform Metrology Group
----Superconductive Electronics Group
----Guided Wave Electromagnetics Group
----Electromagnetic Fields Group
----RF Technology Division - HQ
---Smart Connected Systems Division
----IoT Devices and Infrastructures Group
----Networked Control Systems Group
----Smart Connected Manufacturing Systems Group
----Smart Grid Group
----Transformational Networks and Services Group
---Spectrum Technology and Research Division
----Applied Systems Metrology Group
----Fiber Sources and Applications Group
----Shared Spectrum Metrology Group
----Spectrum Technology and Research – HQ
---Wireless Networks Division
----Internet Technologies Research Group
----Radio Access and Propagation Metrology Group
----Wireless Networks Division - HQ
----Wireless Systems Innovation and Performance Group
---Public Safety Communications Research Division
----Public Safety Communications Research Division - HQ
----Advanced Communications Research Group
----Network Operations Group
---Communications Technology Laboratory HQ
----Communications Technology Laboratory HQ Gp
----Boulder Laboratory Director Office
--Engineering Laboratory
---Building Energy and Environment Division
----Building Energy and Environment - HQ
----Mechanical Systems and Controls Group
----Indoor Air Quality and Ventilation Group
----HVAC&R Equipment Performance Group
----Heat Transfer and Alternative Energy Systems Group
---Intelligent Systems Division
----Intelligent Systems - HQ
----Manipulation and Mobility Systems Group
----Cognition and Collaboration Systems Group
----Production Systems Group
----Sensing and Perception Systems Group
---Materials and Structural Systems Division
----Earthquake Engineering Group
----Engineering Research Support Group
----Infrastructure Materials Group
----Community Resilience Group
----Materials and Structural Systems - HQ
----Structures Group
---Engineering Laboratory Office
----Applied Economics Office
----Disaster Impact Reduction Office
----Engineering Laboratory - HQ
----Engineering Laboratory Data, Security, Technology Group
---Fire Research Division
----National Fire Research Laboratory Group
----Wildland Urban Interface Fire Group
----Flammability Reduction Group
----Fire Research - HQ
----Engineered Fire Safety Group
----Fire Fighting Technology Group
---Systems Integration Division
----Life Cycle Engineering Group
----Process Engineering Group
----Information Modeling and Testing Group
----Systems Integration - HQ
--Information Technology Laboratory
---Applied Cybersecurity Division
----Applied Cybersecurity - HQ
----Cybersecurity and Privacy Applications Group
----National Cybersecurity Center of Excellence
----NICE
---Computer Security Division
----Computer Security - HQ
----Cryptographic Technology Group
----Secure Systems and Applications Group
----Security Components and Mechanisms Group
----Security Test, Validation and Measurement Group
----Security Engineering and Risk Management Group
---Applied and Computational Mathematics Division
----Mathematical Software Group
----Mathematical Analysis and Modeling Group
----Quantum Information Group
----High Performance Computing and Visualization Group
----Applied and Computational Mathematics - HQ
---Statistical Engineering Division
----Applied and Computational Statistics Group
----Statistical Design, Analysis, and Modeling Group
----Statistical Engineering - HQ
---Software and Systems Division
----Systems Interoperability Group
----Software Quality Group
----Software and Systems - HQ
----Cyber Infrastructure Group
----Information Systems Group
---Information Access Division
----Information Access - HQ
----Image Group
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----Visualization and Usability Group
---Information Technology Laboratory Office
----Office of Computational Science for Metrology
----Office of Emerging Technologies
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----Office of Government and Industrial Liaison
----Information Technology Laboratory Office - HQ
----Office of Chief Cybersecurity Advisor
--Laboratory Programs
---Research Data and Computing Office
----Research Data and Computing Office – HQ
---Research Protections Office
----Research Protections Office - HQ
---Research Security and Safeguarding Science Office
----Research Security and Safeguarding Science - HQ
---Standards Coordination Office
----International Standards Policy and Coordination Group
----Standards and Conformity Assessment Services Group
----Standards Coordination Office - HQ
----National Voluntary Laboratory Accreditation Program (NVLAP)
---Special Programs Office
----Special Programs Office-HQ
---Associate Director for Laboratory Programs
----Associate Director for Laboratory Programs - HQ
--Material Measurement Laboratory
---Office of Reference Materials
----Business and Quality Management Group
----Business Application Development, Support, and Security Group
----Sales and Customer Services Group
----Publication and Web Services Group
----Office of Reference Materials - HQ
----Materials and Physical Services Group
---Office of Data and Informatics
----Office of Data and Informatics - HQ
----Data Services Group
----Data Sciences Group
---Biosystems and Biomaterials Division
----Biomarker and Genomic Sciences Group
----Cellular Engineering Group
----Biomaterials Group
----Complex Microbial Systems Group
----Cell Systems Science Group
----Biosystems and Biomaterials Division - HQ
---Chemical Sciences Division
----Biochemical and Exposure Science Group
----Chemical Informatics Group
----Optical Measurements Group
----Chemical Process and Nuclear Measurements Group
----Gas Sensing Metrology Group
----Inorganic Chemical Metrology Group
----Biospecimen Science Group
----Chemical Sciences Division - HQ
----Organic Chemical Metrology Group
---Biomolecular Measurement Division
----Biomolecular Structure and Function Group
----Mass Spectrometry Data Center Group
----Bioprocess Measurements Group
----Bioanalytical Science Group
----Biomolecular Measurement Division - HQ
----Applied Genetics Group
---Applied Chemicals and Materials Division
----Applied Chemicals and Materials Division - HQ
----Thermodynamics Research Center Group
----Thermophysical Properties of Fluids Group
----Nanoscale Reliability Group
----Fluid Characterization Group
----Fatigue and Fracture Group
---Materials Science and Engineering Division
----Thermodynamics and Kinetics Group
----Polymers Processing Group
----Mechanical Performance Group
----Polymers and Complex Fluids Group
----Materials Science and Engineering Division - HQ
----Functional Polymers Group
----Functional Nanostructured Materials Group
---Materials Measurement Science Division
----Security Technologies Group
----Surface and Trace Chemical Analysis Group
----Nanomechanical Properties Group
----Nano Materials Research Group
----Materials Structure and Data Group
----Microscopy and Microanalysis Research Group
----Synchrotron Science Group
----Materials Measurement Science Division - HQ
----Data and AI-Driven Materials Science Group
---Material Measurement Laboratory Office
----The Material Measurement Laboratory Office of Operations Group
----Material Measurement Laboratory - HQ
----Genome-Scale Measurement Group
--NIST Center for Neutron Research
---NIST Center for Neutron Research
----Research Facility Operations Group
----NIST Center for Neutron Research - HQ
----Reactor Operations and Engineering Group
----Neutron-Condensed Matter Science Group
--Physical Measurement Laboratory
---Microsystems and Nanotechnology Division
----Biophysical and Biomedical Measurement Group
----Microsystems and Nanotechnology - HQ
----Nanostructure Fabrication and Measurement Group
----Photonics and Optomechanics Group
---Time and Frequency Division
----Atomic Devices & Instrumentation Group
----Precision Photonic Synthesis Group
----Quantum & Nonlinear Nanophotonics Group
----Ion Storage Group
----Neutral Atom Optical Clocks Group
----Time Realization and Distribution Group
----Phase Noise Metrology Group
----Time and Frequency - HQ
---Quantum Physics Division
----Quantum Physics - HQ
---Radiation Physics Division
----Dosimetry Group
----Radioactivity Group
----Radiation Physics - HQ
----Neutron Physics Group
---Sensor Science Division
----Fundamental Thermodynamics Group
----Sensor Science - HQ
----Temperature & Humidity Group
----Remote Sensing Group
----Optical Radiation Group
----Fluid Metrology Group
----Surface and Interface Metrology Group
---Applied Physics Division
----Advanced Microwave Photonics Group
----Spin Electronics Group
----Applied Physics - HQ
----Faint Photonics Group
----Quantitative Nanostructure Characterization Group
----Molecular and Bio-Photonics Group
----Magnetic Imaging Group
----Quantum Nanophotonics Group
----Sources and Detectors Group
---Quantum Measurement Division
----Quantum Optics Group
----Mass and Force Group
----Quantum Measurement - HQ
----Laser Cooling and Trapping Group
----Fundamental Electrical Measurements Group
----Applied Electrical Metrology Group
----Atomic Spectroscopy Group
---Quantum Sensors Division
----Device Fabrication Group
----Long Wavelength Sensors and Applications Group
----Quantum Calorimeters Group
----Quantum Electronics Group
----Quantum Sensors – HQ
---Nanoscale Device Characterization Division
----Nanoscale Device Characterization Division - HQ
----Nanoscale Spectroscopy Group
----Advanced Electronics Group
---Physical Measurement Laboratory Office
----Boulder Microfabrication Facility
----Physical Measurement Laboratory- HQ
----PML Information Office
----Office of Weights and Measures
-Innovation & Industry Services
--Office of Advanced Manufacturing
---Microelectronics Manufacturing Division
----Microelectronics Manufacturing – HQ
----Microelectronics Strategy and Enterprise Group
----Semiconductor Coordination Group
----Semiconductor Operations Group
----Workforce and Equity Development Group
---Office of Advanced Manufacturing
----Office of Advanced Manufacturing - HQ
---Partnerships and Outreach Division
----Communications and Marketing Group
----Education and Workforce Development Group
----Partnership Engagement Group
----Partnerships and Outreach – HQ
----Technology Hubs Development Group
---Program Operations Division
----Competitions Group
----Institute and Program Management Group
----Performance Management Group
----Program Operations - HQ
---Strategy and Planning Division
----Analysis and Benchmarking Group
----Strategic Planning Group
----Strategy and Planning – HQ
--Baldrige Performance Excellence Program
---Baldrige Performance Excellence Program Office
----Award Process Group
----Director's Office, Baldrige Performance Excellence Program
----Administrative Support/Electronic Information Group
----Outreach and Communications Group
----Publications Management Group
----Workforce Development Group
--Innovation & Industry Services
---Associate Director for Innovation & Industry Services
----Associate Director for Innovation & Industry Services - HQ
---Technology Partnerships Office
----Technology Partnerships Office - HQ
--Hollings Manufacturing Extension Partnership Program
---National Platforms Division
----National Platforms – HQ
----Network Knowledge Management Group
----Supply Chain Group
---National Programs Division
----National Programs- HQ
---Outreach and External Affairs Division
----Outreach and External Affairs – HQ
---Performance Evaluation and Economic Impacts Division
----Performance Evaluation and Economic Impacts - HQ
----Performance Metrics and Evaluation Group
---Network Agreements Management Division
----Network Agreements Management - HQ
----Node B Group
----Node A Group
---Internal Operations Division
----Internal Operations – HQ
---Hollings Manufacturing Extension Partnership Program Office
----Hollings Manufacturing Extension Partnership Program - HQ
-Director's Office
--Director's Office
---Ombuds Office
----Ombuds Office - HQ
---Public Affairs Office
----Media Liaison Group
----Video and Digital Media Production Group
----Public Affairs Office - HQ
----Internal Communications and Inquiries Group
----Conference Program and Audiovisual Services Group
----Boulder Meetings Support and Services Group
----Web Content Development Group
---Program Coordination Office
----Program Coordination Office - HQ
---Director's Office
----Director's Office - HQ
---Congressional and Legislative Affairs Office
----Congressional and Legislative Affairs Office - HQ
---Management and Organization Office
----Management and Organization Office- HQ
---International and Academic Affairs Office
----International and Academic Affairs Office - HQ