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NanoFab Tool: Suss MicroTec MA/BA6 Gen4 Mask Aligner
The SUSS MicroTec MA/BA6 contact aligner allows users to align patterns on the front or back of a substrate and to print feature sizes down to 1 µm. The tool offers a variety of exposure methods with overlay accuracy better than 500 nm. It can accommodate substrates ranging from 150 mm diameter wafers down to small pieces.
Specifications/Capabilities
- Exposure Wavelengths:
- g-line (436 nm).
- h-line (405 nm).
- i-line (365 nm).
- UV Broadband (350 nm to 450 nm).
- Illumination area: 150 mm diameter.
- Resolution: 1 µm.
- Frontside and Backside Alignment.
- Top Side Overlay accuracy: 500 nm.
- Backside Overlay accuracy: 1000 nm.
Usage Information
Supported Sample Sizes
- Maximum wafer diameter: 150 mm (6in.).
- Small pieces supported: Yes.
- Mask sizes supported:
- 127 mm x 127 mm. (5 in.).
- 178 mm x 178 mm. (7 in.).
- Substrate sizes:
- 150 mm (6 in.).
- 100 mm (4 in.).
- 75 mm (3 in.).
- Small pieces supported.
Typical Applications
- Medical devices.
- Biofluidic devices.
- Microelectromechanical systems.
- Thermal sensors.
- Printing micrometer size and larger features.
Created May 15, 2024