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NanoFab Tool: Suss MicroTec MA/BA6 Gen4 Mask Aligner

Suss MicroTec MA/BA6 Gen4 Mask Aligner

The SUSS MicroTec MA/BA6 contact aligner allows users to align patterns on the front or back of a substrate and to print feature sizes down to 1 µm. The tool offers a variety of exposure methods with overlay accuracy better than 500 nm. It can accommodate substrates ranging from 150 mm diameter wafers down to small pieces.

Specifications/Capabilities

  • Exposure Wavelengths:
    • g-line (436 nm).
    • h-line (405 nm).
    • i-line (365 nm).
    • UV Broadband (350 nm to 450 nm).
  • Illumination area: 150 mm diameter.
  • Resolution: 1 µm.
  • Frontside and Backside Alignment.
    • Top Side Overlay accuracy: 500 nm.
    • Backside Overlay accuracy: 1000 nm.

Usage Information

Supported Sample Sizes

  • Maximum wafer diameter: 150 mm (6in.).
  • Small pieces supported: Yes.
  • Mask sizes supported:
    • 127 mm x 127 mm. (5 in.).
    • 178 mm x 178 mm. (7 in.).
  • Substrate sizes: 
    • 150 mm (6 in.).
    • 100 mm (4 in.).
    • 75 mm (3 in.).
    • Small pieces supported.

Typical Applications

  • Medical devices.
  • Biofluidic devices.
  • Microelectromechanical systems.
  • Thermal sensors.
  • Printing micrometer size and larger features.
Created May 15, 2024, Updated March 3, 2025
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