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Thermal Expansion Coefficients of Low-K Dielectric Films From Fourier Analysis of X-Ray Reflectivity

Published

Author(s)

Charles E. Bouldin, William E. Wallace, G W. Lynn, S C. Roth, Wen-Li Wu

Abstract

We determine the thermal expansion coefficient of a fluorinated poly (arylene ether) low-k dielectric film using Fourier analysis of x-ray reflectivity data. The approach is similar to that used in Fourier analysis of x-ray absorption fine structure. The analysis compares two similar samples, or the same sample as an external parameter is varied, and determines the change in film thickness. The analysis process is very accurate, and depends on no assumed model. We determine a thermal expansion coefficient of 55 9 x 10-6 K-1 using this approach.
Citation
Journal of Applied Physics
Volume
88
Issue
No. 2

Keywords

dielectric thin films, Fourier analysis, thermal expansion, x-ray reflectivity

Citation

Bouldin, C. , Wallace, W. , Lynn, G. , Roth, S. and Wu, W. (2000), Thermal Expansion Coefficients of Low-K Dielectric Films From Fourier Analysis of X-Ray Reflectivity, Journal of Applied Physics, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=850326 (Accessed May 21, 2024)

Issues

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Created June 30, 2000, Updated October 12, 2021