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Search Publications by: Nathan Nakamura (Assoc)

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Displaying 1 - 4 of 4

A tabletop x-ray tomography instrument for nanometer-scale imaging: demonstration of the 1,000-element transition-edge sensor subarray

August 1, 2023
Author(s)
Paul Szypryt, Nathan J. Nakamura, Dan Becker, Douglas Bennett, Amber L. Dagel, W.Bertrand (Randy) Doriese, Joseph Fowler, Johnathon Gard, J. Zachariah Harris, Gene C. Hilton, Jozsef Imrek, Edward S. Jimenez, Kurt W. Larson, Zachary H. Levine, John Mates, Daniel McArthur, Luis Miaja Avila, Kelsey Morgan, Galen O'Neil, Nathan Ortiz, Christine G. Pappas, Dan Schmidt, Kyle R. Thompson, Joel Ullom, Leila R. Vale, Michael Vissers, Christopher Walker, Joel Weber, Abigail Wessels, Jason W. Wheeler, Daniel Swetz
We report on the 1,000-element transition-edge sensor (TES) x-ray spectrometer implementation of the TOMographic Circuit Analysis Tool (TOMCAT). TOMCAT combines a high spatial resolution scanning electron microscope (SEM) with a highly efficient and

A Tabletop X-Ray Tomography Instrument for Nanometer-Scale Imaging: Reconstructions

April 14, 2023
Author(s)
Zachary H. Levine, Bradley Alpert, Amber Dagel, Joseph Fowler, Edward Jiminez, Nathan J. Nakamura, Daniel Swetz, Paul Szypryt, Kyle Thompson, Joel Ullom
We show three-dimensional reconstructions of a region of an integrated circuit from a 130 nm copper process. The reconstructions employ x-ray computed tomography, measured with a new and innovative high-magnification x-ray microscope. The instrument uses a

Design of a 3000 pixel transition-edge sensor x-ray spectrometer for microcircuit tomography

August 1, 2021
Author(s)
Paul Szypryt, Douglas Bennett, William J. Boone, Amber L. Dagel, G Dalton, William Doriese, Malcolm Durkin, Joseph Fowler, Edward Garboczi, Jonathon D. Gard, Gene Hilton, Jozsef Imrek, E S. Jimenez, Vincent Y. Kotsubo, K Larson, Zachary H. Levine, John Mates, D McArthur, Kelsey Morgan, Nathan J. Nakamura, Galen O'Neil, Nathan Ortiz, Christine G. Pappas, Carl Reintsema, Dan Schmidt, Daniel Swetz, K R. Thompson, Joel Ullom, C Walker, Joel C. Weber, Abigail Wessels, J W. Wheeler
Feature sizes in integrated circuits have decreased substantially over time, and it has become increasingly difficult to three-dimensionally image these complex circuits after fabrication. This can be important for process development, defect analysis, and