May 1, 2017
Author(s)
Jeffrey M. Shainline, Sonia M. Buckley, Nima Nader, Cale M. Gentry, Kevin C. Cossel, Milos A. Popovic, Nathan R. Newbury, Richard P. Mirin
We present an approach to fabrication and packaging of integrated photonic devices that utilizes waveguide and detector layers deposited at near-ambient temperature. All lithography is performed with a 365 nm i-line stepper, facilitating low cost and high