Multi-planar amorphous silicon photonics with compact interplanar couplers, cross talk mitigation, and low crossing loss

Published: October 11, 2017

Author(s)

Jeffrey T. Chiles, Sonia M. Buckley, Nima Nader, Sae Woo Nam, Richard P. Mirin, Jeffrey M. Shainline

Abstract

We propose and experimentally demonstrate a photonic routing architecture that can efficiently utilize the space of multi-plane (3D) photonic integration. A wafer with three planes of amorphous silicon waveguides was fabricated and characterized, demonstrating <3 x 104 dB loss per out-of-plane waveguide crossing, 0.05 {+or-}0.02 dB per interplane coupler, and microring resonators on three planes with a quality factors up to 8.2 x 104. We also explore a phase velocity mapping strategy to mitigate the cross talk between co-propagating waveguides on different planes. These results expand the utility of 3D photonic integration for applications such as optical interconnects, neuromorphic computing and optical phased arrays.
Citation: Applied Physics Letters
Volume: 2
Pub Type: Journals

Keywords

integrated photonics, 3D integration, amorphous silicon, optical interconnects
Created October 11, 2017, Updated November 10, 2018