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Search Publications by

John E. Bonevich (Fed)

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Displaying 26 - 50 of 88

Superconformal Ni Electrodeposition using 2-Mercaptobenzimidazole

April 4, 2011
Chang H. Lee, John E. Bonevich, Ugo Bertocci, Kristen L. Steffens, Thomas P. Moffat
Ni superconformal filling of sub-micrometer trenches is demonstrated using a Watts bath containing an inhibitor 2-mercaptobenzimidazole (MBI). Hysteretic voltammetry marks the breakdown of the MBI-induced passive-state coincident with the onset of Ni

Three-Dimensionally Structured CdTe Thin Film Photovoltaic Devices with Self-Aligned Back Contacts: Electrodeposition on Interdigitated Electrodes.

June 25, 2009
Daniel Josell, Carlos R. Beauchamp, Suyong S. Jung, Behrang H. Hamadani, Abhishek Motayed, Lee J. Richter, Maureen E. Williams, John E. Bonevich, Alexander J. Shapiro, Nikolai B. Zhitenev, Thomas P. Moffat
Cadmium-telluride photovoltaic cells were deposited on substrates patterned with two interdigitated electrodes. Deposition involved application of different potentials to the two electrodes in order to obtain a 3-d gradient of film properties within the

A Method for Fabricating Conductometric Gas Sensors of Metal Oxide Nanotubes Formed in Porous Aluminum Oxide Membranes

February 2, 2009
Reit Artzi-Gerlitz, Kurt D. Benkstein, David L. Lahr, Joshua L. Hertz, Christopher B. Montgomery, John E. Bonevich, Stephen Semancik, Michael J. Tarlov
We describe a general, simple strategy for fabricating conductometric gas sensors from metal oxide nanotubes formed in nanoporous aluminum oxide membranes. In this approach, the aluminum oxide membrane serves as both a template for growth of the sensing

400-Fold Reduction in Saturation Field by Interlayering

January 13, 2009
William F. Egelhoff Jr., John E. Bonevich, Philip Pong, John Unguris, Robert D. McMichael, Gery R. Stafford, Carlos R. Beauchamp
The buildup of stress with increasing thickness of magnetic thin films is a common phenomenon that often induces undesirable saturation fields that can convert an otherwise magnetically soft film into a magnetically hard one. We have found that by

Development of Ultra-Low Magnetic Field Sensors With Magnetic Tunnel Junctions

October 31, 2007
Philip Pong, John E. Bonevich, William F. Egelhoff Jr.
The discovery of tunneling magnetoresistance (TMR) has enhanced the magnetoresistance (MR) ratio from the giant magnetoresistance (GMR) regime of around 10% to over 400% at room temperature. A combination of magnetic tunnel junctions with high

Compositional Control in Electrodeposited Ni (subscript x) Pt (subscript 1-x) Films

October 29, 2007
J Mallett, Erik B. Svedberg, John E. Bonevich, Alexander J. Shapiro, William F. Egelhoff Jr., Thomas P. Moffat
Electrochemical co-deposition of a series of fcc Ni(subscript x)PT(subscript 1-x) alloys is demonstrated. The alloy composition is a monotonic function of potential. The Pt-rich Ni(subscript x)PT(subscript 1-x) alloys are formed at potentials positive to

Electrodeposition of Ni in Sub-Micrometer Trenches

July 2, 2007
S D. Kim, John E. Bonevich, Daniel Josell, Thomas P. Moffat
A survey of the effect of cationic, anionic and non-ionic surfactants on the rate and morphological evolution of nickel electrodeposition from a Watts-type bath is presented. Particular attention is given to the prospect for void free filling of sub

Precise Manipulation and Alignment of Single Nanowire

March 2, 2007
Qiliang Li, Sang-Mo Koo, Curt A. Richter, Monica D. Edelstein, John E. Bonevich, Joseph Kopanski, John S. Suehle, Eric M. Vogel
Nanowires and nanotubes are being intensively investigated for nanoelectronic transport applications. The integration of such nanostructures into circuitry requires a simple, high-efficiency and low-cost strategy. Here we develop a single nanowire

Precise Alignment of single Nanowires and Fabrication of Nanoelectromechanical Switch and Other Test Structures

March 1, 2007
Qiliang Li, Sang-Mo Koo, Curt A. Richter, Monica D. Edelstein, John E. Bonevich, Joseph Kopanski, John S. Suehle, Eric M. Vogel
The integration of nanowires and nanotubes into electrical test structures to investigate their nanoelectronic transport properties is a significant challenge. Here we present a single nanowire manipulating system to precisely manipulate and align

Underpotential Co-Deposition of Cu_subscript(1-x)Pt_subscript(x) Alloys

September 30, 2006
J Mallett, Ugo Bertocci, Erik B. Svedberg, John E. Bonevich, Alexander J. Shapiro, William F. Egelhoff Jr., Thomas P. Moffat
The electrodeposition of Cu_subscript (1-x)Pt_subscript(x) alloys by underpotential co-deposition of Cu with Pt is demonstrated using an H_subscript(2)SO_subscript(4)-CuSO_subscript(4-)PtCl_subscript(4)_superscript(2-) electrolyte. The composition and

Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing

December 2, 2005
Thomas P. Moffat, Marlon L. Walker, P J. Chen, John E. Bonevich, William F. Egelhoff Jr., Lee J. Richter, Daniel Josell, C A. Witt, T Aaltonen, M Ritala, M Leskela
Superfilling of sub-micrometer trenches by direct copper electrodeposition onto PVD and ALD Ru barriers is demonstrated. The Cu nucleation and growth mode is found to be sensitive to the oxidation state of the Ru surface as well as the copper deposition

Fabrication and Measurement of Tall Stacked Arrays of SNS Josephson Junctions

June 1, 2005
Nicolas Hadacek, Paul Dresselhaus, Yonuk Chong, Samuel Benz, John E. Bonevich
We have made tall, uniform stacked Josephson junction arrays by developing an etch process using an inductively coupled plasma etcher. This process produces vertical profiles in thin-film multilayers of alternating superconducting and normal metals. Such a