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Search Publications by: William E. Wallace (Fed)

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Displaying 101 - 110 of 110

Thermally Induced Stress Relaxation and Densification of Spin-on-Glass Thin Films

January 1, 2000
Author(s)
C. K. Chiang, William E. Wallace, G W. Lynn, D Feiler, W. Xia
The stress-temperature relationship of silica spin-on-glass thin films on silicon wafers was studied. Upon heating the stress-temperature curves showed a dramatically increasing slope when the temperature of the film was greater than 340 C. At 450 C, a

Comparison of Classical and MALDI-TOF-MS Analysis of a Polystyrene Interlaboratory Sample

January 1, 1999
Author(s)
William R. Blair, B M. Fanconi, R J. Goldschmidt, Charles M. Guttman, William E. Wallace, S Wetzel, David L. VanderHart
Over the past several years, the use of MALDI-TOF-MS for analysis of synthetic polymers has increased significantly. As the number of polymer analyses by MALDI has increased, scrutiny of the MALDI results in comparison to classically derived values for Mw

Characterization of Planarity of Polymer Thin Films on Rough Surfaces

July 1, 1998
Author(s)
Wen-Li Wu, William E. Wallace
Angle-dependent total reflection x-ray fluorescence (TRXF) is used to characterize the surface roughness or the extent of planarization of a thin polymer coating on a stainless steel surface with significant roughness. The objective of this work is to