Skip to main content

NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Thermally Induced Stress Relaxation and Densification of Spin-on-Glass Thin Films

Published

Author(s)

C. K. Chiang, William E. Wallace, G W. Lynn, D Feiler, W. Xia

Abstract

The stress-temperature relationship of silica spin-on-glass thin films on silicon wafers was studied. Upon heating the stress-temperature curves showed a dramatically increasing slope when the temperature of the film was greater than 340 C. At 450 C, a significant, irreversible change in the stress of the film was observed. This change in stress was correlated with an increase in film electron density and a decrease in film thickness. This observed thermally activated stress-relaxation behavior was interpreted in terms of reflow of the glassy hydrogen-silsequioxane-based material.
Citation
Applied Physics Letters
Volume
76
Issue
No. 4

Keywords

hydrogen-silsesquioxane, low-K dielectric, spin-on-glass, stress, thin-film

Citation

Chiang, C. , Wallace, W. , Lynn, G. , Feiler, D. and Xia, W. (2000), Thermally Induced Stress Relaxation and Densification of Spin-on-Glass Thin Films, Applied Physics Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=851605 (Accessed October 14, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created December 31, 1999, Updated October 12, 2021
Was this page helpful?