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Search Publications by: Thomas P. Moffat (Fed)

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Displaying 201 - 225 of 333

Compositional Control in Electrodeposited Ni (subscript x) Pt (subscript 1-x) Films

October 29, 2007
Author(s)
J Mallett, Erik B. Svedberg, John E. Bonevich, Alexander J. Shapiro, William F. Egelhoff Jr., Thomas P. Moffat
Electrochemical co-deposition of a series of fcc Ni(subscript x)PT(subscript 1-x) alloys is demonstrated. The alloy composition is a monotonic function of potential. The Pt-rich Ni(subscript x)PT(subscript 1-x) alloys are formed at potentials positive to

Electrodeposition of Ni in Sub-Micrometer Trenches

July 2, 2007
Author(s)
S D. Kim, John E. Bonevich, Daniel Josell, Thomas P. Moffat
A survey of the effect of cationic, anionic and non-ionic surfactants on the rate and morphological evolution of nickel electrodeposition from a Watts-type bath is presented. Particular attention is given to the prospect for void free filling of sub

Superfilling When Adsorbed Accelerators Are Mobile

February 6, 2007
Author(s)
Daniel Josell, Thomas P. Moffat, Daniel Wheeler
Bottom-up superfill during electrodeposition that is used for industrial processing of damascene copper interconnects has also been demonstrated during electrodeposition of silver and gold. The Curvature Enhanced Accelerator Coverage (CEAC) mechanism has

Cationic Surfactants for the Control of Overfill Bumps in Cu Superfilling

October 10, 2006
Author(s)
Soo K. Kim, Daniel Josell, Thomas P. Moffat
Electroanalytical measurements and feature filling experiments have been conducted to study the effect of dodecyltrimethylammonium chloride (DTAC), a quaternary ammonium cationic surfactant, on Cu deposition in the presence of various combinations of

Underpotential Co-Deposition of Cu_subscript(1-x)Pt_subscript(x) Alloys

September 30, 2006
Author(s)
J Mallett, Ugo Bertocci, Erik B. Svedberg, John E. Bonevich, Alexander J. Shapiro, William F. Egelhoff Jr., Thomas P. Moffat
The electrodeposition of Cu_subscript (1-x)Pt_subscript(x) alloys by underpotential co-deposition of Cu with Pt is demonstrated using an H_subscript(2)SO_subscript(4)-CuSO_subscript(4-)PtCl_subscript(4)_superscript(2-) electrolyte. The composition and