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Displaying 126 - 150 of 160

Abstracts for the MSEL Assessment Panel, March 2001

January 26, 2001
Author(s)
Leslie E. Smith, Alamgir Karim, Leonid A. Bendersky, C Lu, J J. Scott, Ichiro Takeuchi, Kathleen M. Flynn, Vinod K. Tewary, Davor Balzar, G A. Alers, Stephen E. Russek, Charles C. Han, Haonan Wang, William E. Wallace, Daniel A. Fischer, K Efimenko, Wen-Li Wu, Jan Genzer, Joseph C. Woicik, Thomas H. Gnaeupel-Herold, Henry J. Prask, Charles F. Majkrzak, Norman F. Berk, John G. Barker, Charles J. Glinka, Eric K. Lin, Ward L. Johnson, Paul R. Heyliger, David T. Read, R R. Keller, J Blendell, Grady S. White, Lin-Sien H. Lum, Eric J. Cockayne, Igor Levin, C E. Johnson, Maureen E. Williams, Gery R. Stafford, William J. Boettinger, Kil-Won Moon, Daniel Josell, Daniel Wheeler, Thomas P. Moffat, W H. Huber, Lee J. Richter, Clayton S. Yang, Robert D. Shull, R A. Fry, Robert D. McMichael, William F. Egelhoff Jr., Ursula R. Kattner, James A. Warren, Jonathan E. Guyer, Steven P. Mates, Stephen D. Ridder, Frank S. Biancaniello, D Basak, Jon C. Geist, Kalman D. Migler
Abstracts relating to research and development in the NIST Materials Science and Engineering Laboratory (MSEL) are presented for a poster session to be presented to the 2001 MSEL Assessment Panel.

The Effect of Pb Contamination on the Solidification Behavior of Sn-Bi Solders

January 1, 2001
Author(s)
Kil-Won Moon, William J. Boettinger, Ursula R. Kattner, C A. Handwerker, D J. Lee
This paper presents experimental results and theoretical calculations to evaluate the effects of Pb contamination on the solidification behavior of Sn-x mass Bi alloys (x = 5, 10, and 58 mass %). The pasty (mushy) range, the type of solidification path

Alpha Case Thickness Modeling in Investment Castings

December 1, 2000
Author(s)
William J. Boettinger, Maureen E. Williams, Sam R. Coriell, Ursula R. Kattner, B A. Mueller
The alpha case thickness at the surface of a Ti-6Al-4V step wedge investment casting has been measured and successfully predicted. The prediction uses temperature-time results obtained from a heat flow simulation of the casting that was performed with a

Transient Liquid-Phase Bonding in the Ni-Al-B System

November 1, 2000
Author(s)
Carelyn E. Campbell, William J. Boettinger
Transient liquid phase (TLP) bonding experiments were performed using a Ni-10.3 at. % Al alloy and a Ni-10 at. %B filler material and the results were compared to simulations performed using the finite-difference diffusion code, DICTRA. For the simulations

Experimental and Thermodynamic Assessment of Sn-Ag-Cu Solder Alloys

October 1, 2000
Author(s)
Kil-Won Moon, William J. Boettinger, Ursula R. Kattner, Frank S. Biancaniello, C A. Handwerker
Sn-rich alloys in the Sn-Ag-Cu system are being studied for their potential as Pb-free solders. Thus, the location of the ternary eutectic involving L, (Sn), Ag 3)Sn and Cu( 6)Sn( 5) phases is of critical interest. Phase diagram data in the Sn-rich corner

The Ternary Eutectic of Sn-Ag-Cu Solder Alloys

September 1, 2000
Author(s)
Kil-Won Moon, William J. Boettinger, Ursula R. Kattner, Frank S. Biancaniello, C A. Handwerker
New measurements using precision thermal analysis and existing experimental data for the Sn-Ag-Cu system are summarized. For Sn-Ag-Cu alloys, the location of the ternary eutectic involving L, Sn, Ag3Sn, and Cu6Sn5 phases in the Sn-rich corner is of

On the Properties of Alpha/Alpha + Beta Diffusion Couples

January 1, 2000
Author(s)
William J. Boettinger, Sam R. Coriell, Carelyn E. Campbell, Geoffrey B. McFadden
The properties of diffusion couples in a ternary system are examined theoretically when one end member is composed of single-phase material (alpha) and the other end member is composed of two-phase material (α + Β). Using the model of Morral and co-workers

Solidification Microstructures: Recent Developments, Future Directions

January 1, 2000
Author(s)
William J. Boettinger, Sam R. Coriell, A L. Greer, A N. Karma, W Kurz, M Rappaz, R Trivedi
This review is intended to critically evaluate the latest status of solidification science and to discuss and propose future directions of research in this technologically important area. It is an updated version of the outcome of the 1998 Zermatt Workshop

Modeling the Fillet Lifting Defect

September 11, 1999
Author(s)
Clare Bailey, William J. Boettinger
A multi-physics simulation tool is described which has the ability to simulate fluid flow, heat transfer including solidification, and stress evolution in a integrated manner. This modelling framework is used to predict the behavior of two solder materials

Rapid Melting of Nb - 47 Mass % Ti: Effect of Heating Rate and Grain Size

September 8, 1999
Author(s)
William J. Boettinger, Daniel Josell, Sam R. Coriell, D Basak
The effect of heating rate and grain size on the melting behavior of Nb - 47 mass % Ti is measured. The experimental method uses rapid resistive self-heating of wire specimens at rates between 10(2 superscript) and 104 superscript) K/s and simultaneous