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NIST Authors in Bold

Displaying 1901 - 1925 of 2724

The Study of Silicon Stepped Surfaces as Atomic Force Microscope Calib Standards With a Calibrated AFM at NIST

September 29, 2005
Author(s)
V W. Tsai, Theodore V. Vorburger, Ronald G. Dixson, Joseph Fu, R Koning, Richard M. Silver, Edwin R. Williams
Due to the limitations of modern manufacturing technology, there is no commercial height artifact at the sub-nanometer scale currently available. The single-atom steps on a cleaned silicon (111) surface with a height of 0.314 nm, derived from the lattice

Nanometer Resolution Metrology with the NIST Molecular Measuring Machine

September 23, 2005
Author(s)
John A. Kramar
Nanometre accuracy and resolution metrology over technically relevant areas is becoming a necessity for the progress of nanomanufacturing. At the National Institute of Standards and Technology, we are developing the Molecular Measuring Machine, a scanned

A Modular System Architecture for Agile Assembly of Nanocomponents using Optical Tweezers

September 10, 2005
Author(s)
Arvind K. Balijepalli, Thomas W. LeBrun, Cedric V. Gagnon, Yong-Gu Lee, Nicholas G. Dagalakis
In order to realize the flexibility optical trapping offers as a nanoassembly tool, we need to develop natural and intuitiveinterfaces to assemble large quantities of nanocomponents quickly and cheaply. We propose a system to create such aninterface that

Issues in Line Edge and Linewidth Roughness Metrology

September 9, 2005
Author(s)
John S. Villarrubia
In semiconductor electronics applications, line edge and linewidth roughness are generally measured using a root mean square (RMS) metric. The true value of RMS roughness depends upon the length of edge or line that is measured and the chosen sampling

Characterization of Optical Traps Using On-Line Estimation Methods

August 26, 2005
Author(s)
Jason J. Gorman, Thomas W. LeBrun, et al
System identification methods are presented for the estimation of the characteristic frequency of an optically trapped particle. These methods are more amenable to automated on-line measurements and are believed to be less prone to erroneous results

A Fiber Probe for CMM Measurements of Small Features

August 1, 2005
Author(s)
Jack A. Stone Jr., Balasubramanian Muralikrishnan, John R. Stoup
We report on performance of a new form of fiber probe, which can be used in conjunction with a coordinate measuring machine (CMM) for microfeature measurement. The probe stylus is a glass fiber with a small ball (?75 ?m diameter) glued to the end. When the

Consumer Package Labeling Guide: Labeling by Weight

August 1, 2005
Author(s)
K M. Dresser
[Withdrawn (February 13, 2018)] Guide is intended to provide manufacturers, packers, distributors, and retailers of packaged products with information about the labeling requirements for commodities that are sold by weight in the consumer marketplace. The

Consumer Packaging Labeling Guide: Selling by Volume

August 1, 2005
Author(s)
K M. Dresser
[Withdrawn (February 13, 2018)] Guide is intended to provide manufacturers, packers, distributors, and retailers of packaged products with information about the labeling requirements for commodities that are sold by volume in the consumer marketplace. The

A Simulation Study of Repeatability and Bias in the CD-SEM

July 1, 2005
Author(s)
John S. Villarrubia, Andras Vladar, Michael T. Postek
Abstract: The ability of a critical dimension scanning electron microscope (CD-SEM) to resolve differences in the widths of two lines depends on the instrument?s measurement repeatability and any sample dependent biases. The dependence of repeatability and

Development of Multiple Beam Optical Tweezers

June 1, 2005
Author(s)
Dongjin Lee, Thomas W. LeBrun, Arvind Balijepalli, Jason J. Gorman, Cedric V. Gagnon, Daehie Hong, Esther H. Chang
This paper presents the design of a multiple beam optical tweezers instrument used for manipulating micro/nano-sized components. The basic equations used in designing the optical tweezers are derived and the stable and time-sharing multiple beam optical

High-resolution Optical Metrology

May 1, 2005
Author(s)
Richard M. Silver, Ravikiran Attota, Michael T. Stocker, M R. Bishop, Lowell P. Howard, Thomas A. Germer, Egon Marx, M P. Davidson, Robert D. Larrabee
Recent advances in optical imaging techniques have unveiled new possibilities for optical metrology and optical-based process control measurements of features in the 65 nm node and beyond. In this paper we discuss methods and applications that combine

Measuring Internal Geometry of Fiber Ferrules

May 1, 2005
Author(s)
Balasubramanian Muralikrishnan, Jack A. Stone Jr., John R. Stoup
The focus of this paper is on the metrology of microstructures. Traditional Coordinate Measuring Machines (CMM) are limited to measuring holes of 300 m diameter. Smaller features and holes require thinner styli & novel probing technologies that can

Micro-Feature Metrology

May 1, 2005
Author(s)
Bala Muralikrishnan, Jack A. Stone Jr., John R. Stoup
This presentation focuses on three aspects of micro-feature metrology novel applications that drive research and commercialization, capabilities and limitations of existing sensors and techniques, and finally a summary of recent research including ongoing

Unbiased Estimation of Linewidth Roughness

May 1, 2005
Author(s)
John S. Villarrubia, B Bunday
Line width roughness (LWR) is usually estimated simply as three standard deviations of the line width. The effect of image noise upon this metric includes a positive nonrandom component. The metric is therefore subject to a bias or ?systematic error? that

Photomask Feature Metrology

April 7, 2005
Author(s)
James E. Potzick
This chapter discusses some general issues with regard to measurement of the size and placement of the features on a photomask.
Since all linewidth and placement measurements derive from the location of a feature's edges, the Chapter starts with a

Comparison of SEM and HRTEM CD-Measurements Extracted From Monocrystalline Tes-Structures Having Feature Linewidths From 40 nm to 240 nm

April 4, 2005
Author(s)
W Tan, Robert Allen, Michael W. Cresswell, Christine E. Murabito, B C. Park, Ronald G. Dixson, William F. Guthrie
CD measurements have been extracted from SEM and HRTEM images of the same set of monocrystalline silicon features having linewidths between 40 and 200 nm. The silicon features are incorporated into a new test structure which has been designed to facilitate

Magnetic Method to Characterize the Current Densities in a Breaker Arc

April 1, 2005
Author(s)
Nadia Machkour-Deshayes
The purpose of this research was to use magnetic induction measurements from a low voltage electric arc, to reconstruct the arc''s current density. The measurements were made using Hall effect sensors, which were placed close to, but outside the breaking
Displaying 1901 - 1925 of 2724
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