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Displaying 1426 - 1450 of 4224

Characterizing Task-Based Human-Robot Collaboration Safety in Manufacturing

February 27, 2015
Author(s)
Jeremy A. Marvel, Joseph A. Falco, Ilari Marstio
A new methodology for describing the safety of human-robot collaborations is presented. Taking a task-based perspective, a risk assessment of a collaborative robot system safety can be evaluated offline during the initial design stages. This risk

Effects of wafer noise on the detection of 20 nm defects using optical volumetric inspection

February 11, 2015
Author(s)
Bryan M. Barnes, Francois R. Goasmat, Martin Y. Sohn, Hui Zhou, Andras Vladar, Richard M. Silver
Patterning imperfections in semiconductor device fabrication may either be noncritical [e.g., line edge roughness (LER)] or critical, such as defects that impact manufacturing yield. As the sizes of the pitches and linewidths decrease in lithography

Thermographic and FE Simulation of the DMLS Process at NIST

February 4, 2015
Author(s)
Brandon M. Lane, Li Ma, Shawn P. Moylan, M A. Donmez, Eric P. Whitenton, Daniel J. Falvey
A major effort of the Measurement Science for Additive Manufacturing Program at NIST is to provide high quality, well-defined temperature measurement of the DMLS process to support and validate multi-physics simulations. However, the dynamic, complex
Displaying 1426 - 1450 of 4224
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