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Displaying 14226 - 14250 of 73925

Bonded Wafers for Three-Dimensional Integration

March 2, 2017
Author(s)
Richard A. Allen
Three-dimensional (3D) integration is a key enabling technology for compact, high-performance, and/or low-power electronics. This technology enables the fabrication of circuits with functions that commonly cannot be fabricated on a single substrate in a

Guideline for Automatic Guided Vehicle Calibration

March 2, 2017
Author(s)
Steven Legowik, Roger V. Bostelman, Tsai H. Hong, Elena R. Messina
This report documents the steps followed to calibrate an all-wheel steer Automatic Guided Vehicle (AGV) for optimal performance. Proper calibration of the steering and drive parameters of an AGV are critical for accurate dead-reckoning navigation, and

A comment on the PCAST report: Skip the "match"/"non-match" stage

March 1, 2017
Author(s)
Geoffrey S. Morrison, David H. Kaye, David J. Balding, Duncan Taylor, Phillip Dawid, Colin Aitken, Simone N. Gittelson, Grzegorz Zadora, Bernard Robertson, Sheila Willis, Susan Pope, Martin Neil, Kristy A. Martire, Amanda Hepler, Richard Gill, Allan Jamieson, Jacob de Zoete, R. B. Ostrum, Amke Caliebe
This letter comments on the report "Forensic science in criminal courts: Ensuring scientific validity of feature-comparison methods" recently released by the President's Council of Advisors on Science and Technology (PCAST). The report advocates a

A Multireflect-Thru Method of Vector-Network-Analyzer Calibration

March 1, 2017
Author(s)
Arkadiusz Lewandowski, Wojciech Wiatr, Nate Orloff, James Booth
We present a new method for two-port vector-network-analyzer calibration which uses multiple offset-reflect standards and a flush thru connection. Offset-reflect standards consist of sections of the same uniform transmission-line with different lengths

Acceptance Angle Control for Improved Transmission Imaging in an SEM

March 1, 2017
Author(s)
Jason D. Holm, Robert R. Keller
This contribution presents a simple, cost-effective modular aperture system enabling comprehensive acceptance angle control for STEM-in-SEM imaging. The system is briefly described, and different ways to use it are explained. To demonstrate the utility of

Comparison of 2-D and 3-D shape analysis of concrete aggregate fines from VSI crushing

March 1, 2017
Author(s)
Edward J. Garboczi, Kenneth A. Snyder, Rolands Cepuritis, Stefan Jacobsen
The shape of concrete aggregate fines, with particle sizes between 3 µm and 250 µm, produced by high-speed vertical shaft impact (VSI) crushing of 10 different rock types from quarries in Norway, has been studied by both dynamic image analysis (DIA), which

Coupled Bilayer Photonic Crystal Slab Electro-Optic Spatial Light Modulators

March 1, 2017
Author(s)
Yichen Shuai, Deyin Zhao, Corey A. Stambaugh, John R. Lawall, Weidong Zhou, Yonghao Liu
We demonstrate here a surface-normal ultracompact Fano resonance electrooptic spatial light modulator employing a stacked photonic crystal membrane capacitor-like structure. Vertically coupled optical resonance near 1.5 μm was observed, and both blue and

FDA Approves First Genetically-Modified Cell Therapy to Treat Leukemia

March 1, 2017
Author(s)
Carl Simon Jr.
The FDA approved the first genetically-modified cell therapy for the treatment of leukemia on August 30, 2017 [1-2]. The treatment (tisagenlecleucel) is an "autologous genetically modified immunocellular therapy indicated for the treatment of pediatric and

Lateral Magnetically Modulated Multilayers by Combining Ion Implantation and Lithography

March 1, 2017
Author(s)
Enric Menendez, Hiwa Modarresi, Claire Petermann, Josep Nogues, Neus Domingo, Haoliang Liu, Brian Kirby, Amir Syed Mohd, Zahir Salhi, Earl Babcock, Stefan Mattauch, Chris Van Haesendonck, Andre Vantomme, Kristiaan Temst
The combination of lithography and ion implantation is demonstrated to be a suitable method to prepare lateral multilayers. A laterally, compositionally and magnetically, modulated microscale patter consisting of alternating C (1.6υm-wide) and Co-CoO (2
Displaying 14226 - 14250 of 73925
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