NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Search Publications

NIST Authors in Bold

Displaying 52076 - 52100 of 73697

Fracture Toughness Data for Brittle Materials

April 1, 1998
Author(s)
R G. Munro, Stephen W. Freiman, T L. Baker
Fracture toughness data, as represented by the critical stress intensity factor, K Ic, and the fracture energy, γ, have been compiled from publicly accessible sources for a wide range of brittle materials with an emphasis on structural ceramics and closely

Friend or Foe? Communication Gateways

April 1, 1998
Author(s)
Steven T. Bushby
Gateways play an important role in integrating building automation system components made by different manufacturers. This article explores the role gateways play in this application and describes benefits and limitations that need to be considered by

H-Out-Diffusion and Device Performance In n-i-p Solar Cells Utilizing High Temperature Hot Wire a si: H i-Layers

April 1, 1998
Author(s)
A. H. Mahan, R C. Reedy, E Iwaniczko, Q Wang, B P. Nelson, Y Xu, Alan Gallagher, H M. Branz, J Crandall, J Yang, S Guha
Hydrogen out-diffusion from the n/i interface region plays a major role in controlling the fill factor (FF) and resultant efficiency of n-i-p a-Si: H devices, with the i-layer deposited at high substrate temperatures by the hot wire technique. Modeling

Measurement of the He Ground State Lamb Shift Via the Two-Photon 1 1 S - 2 1 S transition

April 1, 1998
Author(s)
S Bergeson, A Balakrishnan, K G. Baldwin, Thomas B. Lucatorto, J P. Marangos, T J. McIlrath, Thomas R. O'Brian, S L. Rolston, J Wen, N Westbrook, C H. Cheng, E E. Eyler, Craig J. Sansonetti
We have extended two-photon Doppler-free spectroscopy to the vacuum ultraviolet spectral region to accurately measure the He 1 1S - 2 1S transition at 120 nm. Our result is 4 984 872 315[48] MHz. This yields a ground state Lamb shift of 41104[48] MHz, in

Molecular Dynamics Simulation of Tethered Chains

April 1, 1998
Author(s)
Raymond D. Mountain, Joseph B. Hubbard
A description is provided for a molecular dynamics code that simulates the dynamics of long chain molecules tethered to a smooth surface. The operation of the code is discussed from the point of view of the user. The structure of the input files is

NIST Calibration Service for Capacitance Standards at Low Frequencies

April 1, 1998
Author(s)
Yui-May Chang, Summerfield B. Tillett
This document describes the capacitance calibration service provided by NIST, including measurement procedures and systems used to calibrate capacitance standards of nominal values in the range of 0.001 pF to 1 F, at frequencies up to 10 kHz. Discussed are

Preparation and Characterization of Polymer/Dendrimer Blends Progress Report 3/31/98

April 1, 1998
Author(s)
Eric J. Amis, Barry J. Bauer, A Topp, T J. Prosa, Da-Wei Liu, C L. Jackson, Alamgir Karim, B D. Ermi, K A. Barnes, A Nakatani, G Nisato, R Ivkov
Dendrimer and dendrigraft solutions, blends, and interpenetrating polymer networks are characterized by small angle neutron and x-ray scattering, reflectivity, and transmission electron microscopy.

RTP Calibration Wafer Using Thin-Film Thermocouples

April 1, 1998
Author(s)
Kenneth G. Kreider, D P. DeWitt, Benjamin K. Tsai, Francis J. Lovas, David W. Allen
Rapid thermal processing (RTP) is a key technology for the cluster tool, single wafer manufacturing approach that is used to produce integrated circuits at lower cost with reduced line widths and thermal budgets. However, various problems associated with
Displaying 52076 - 52100 of 73697
Was this page helpful?