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Displaying 44551 - 44575 of 73960

Superconformal Electrodeposition in Vias

January 1, 2002
Author(s)
Daniel Josell, Daniel Wheeler, Thomas P. Moffat
Conditions for which superconformal filling of vias can be expected are predicted using the curvature enhanced accelerator coverage mechanism to model the effect of accelerator accumulation and area change on local copper deposition rate. Superconformal

Suppression Effectiveness of Aerosols: The Effect of Size and Flame Type

January 1, 2002
Author(s)
J W. Fleming, B A. Williams, R S. Sheinson
This paper summarizes efforts to identify properties of aerosols (liquids and solids) leading to effective fire suppression. It is part of the US Department of Defense’s Next Generation Fire Suppression Technology Program (NGP) supported by the DoD
Displaying 44551 - 44575 of 73960
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