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Displaying 44526 - 44550 of 73960

Spin Excitations in a Fermi Gas of Atoms

January 1, 2002
Author(s)
B. L. DeMarco, Deborah S. Jin
We have experimentally investigated a a spin excitation in a quantum degenerate Fermi gas of atomes. In the hydrodynamic regime the damping time of the collective excitation is used to probe the quantum behavior of the gas. At temperatures below the Fermi

Stability Analysis of 2-DOF End-Milling for a Range of Radial Immersions

January 1, 2002
Author(s)
P V. Bayly, Tony L. Schmitz, D A. Peters, B P. Mann
Low radial immersion end-milling involves intermittent cutting. If the tool is flexible, its motion in both the x- and y-directions affects the chip load and cutting forces, leading to chatter instability under certain conditions. Interrupted cutting

Standardization of PCR Amplification for Fragile X Trinucleotide Repeat Measurements

January 1, 2002
Author(s)
C D. O'Connell, Donald H. Atha, J P. Jakupciak, Kristy L. Richie
To provide the clinical diagnostics community with accurate protocols and measurements for the detection of genetic disorders, we have established a quantitative a quantitative measurement program for trinucleotide repeats associated with human disease. In

Standards of Seismic Safety for Existing Federally Owned and Leased Buildings

January 1, 2002
Author(s)
Stephen A. Cauffman, Hai S. Lew
The seismic safety evaluation and mitigation standards, Standards for Seismic Safety for Existing Federally Owned and Leased Buildings, were developed for use by the Federal Government by the Interagency Committee on Seismic Safety in Construction (ICSSC)

Strain Rate Dependence of Fracture in a Rubber-Toughened Epoxy System

January 1, 2002
Author(s)
D T. Raghavan, J He, Donald L. Hunston, D Hoffman
The toughening mechanisms in rubber-modified epoxies appear to be viscoelastic in nature since the fracture behavior is dependent on loading rate. This behavior has been studied and modeled only for the most common toughened epoxy system. The present work

Structural Characterization of Porous Low-k SiOC Thin Films Using Novel X-Ray Porosimetry

January 1, 2002
Author(s)
H W. Kim, Wen-Li Wu, Barry J. Bauer, Eric K. Lin, J Y. Kim, Y H. Kim, V. J. Lee
A novel x-ray porosimetry measurement is used to characterize the structure and properties of porous low-k dielectric films after varying process conditions. We determine the film thickness, density depth profile, average density, wall density, and
Displaying 44526 - 44550 of 73960
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