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Displaying 44276 - 44300 of 143797

Phase-Sensitive Specular Neutron Reflectometry for Imaging the Nanometer Scale Compositional Depth profile of Thin-Film Materials

November 20, 2011
Author(s)
Brian Kirby, Paul A. Kienzle, Brian B. Maranville, Norman F. Berk, J. Krycka, Frank Heinrich, Charles Majkrzak
Neutron reflectometry is a powerful method for probing the molecular scale structure of both hard and soft condensed matter films. Moreover, the phase-sensitive methods which have been developed make it possible for specular neutron reflectometry to be

Evaluation of Proposed Test Artifacts for Five-Axis Machine Tools

November 18, 2011
Author(s)
Shawn P. Moylan, David Blumenfeld, Michael L. McGlauflin, Ronnie R. Fesperman Jr., M A. Donmez
Machining of a test artifact is an attractive method of evaluating the performance of a machine tool because the tests are often quick and do not require special instrumentation. An appropriate artifact should be complex enough to assess a machine's

Giant piezoelectricity on Si for hyperactive MEMS

November 18, 2011
Author(s)
S. H. Baek, J. Park, D. M. Kim, Vladimir Aksyuk, R. R. Das, S. D. Bu, D. A. Felker, J. Lettieri, V Vaithyanathan, S. Bharadwaja, N. Bassiri-Gharb, Y. B. Chen, H. P. Sun, C. M. Folkman, H. W. Jang, D. J. Kreft, S K. Streiffer, R. Ramesh, X Q. Pan, S Trolier-McKinstry, Darrell G. Schlom, M. S. Rzchowski, R. Blick, C. B. Eom
Smart materials that can sense, manipulate, and position are crucial to the functionality of micro- and nano-machines [1-2]. Integration of single crystal piezoelectric films on silicon offers the opportunity of high performance piezoelectric

Origin of Electrical Signals for Plasma Etching Endpoint Detection

November 18, 2011
Author(s)
Mark A. Sobolewski
Electrical signals are used for endpoint detection in plasma etching, but the origin of the electrical changes observed at endpoint is not known. They may be caused by changes in the gas-phase densities of etch products and reactants or by changes in

TSOM Method for Nanoelectronics Dimensional Metrology

November 18, 2011
Author(s)
Ravikiran Attota
Through-focus scanning optical microscopy (TSOM) is a relatively new method that transforms conventional optical microscopes into truly three-dimensional metrology tools for nanoscale to microscale dimensional analysis. TSOM achieves this by acquiring and

DEMONSTRATION OF AN INTEGRATED MICRO CRYOGENIC COOLER AND MINIATURE COMPRESSOR FOR COOLING TO 200 K

November 17, 2011
Author(s)
Ryan J. Lewis, Mu Hong Lin, Yunda Wang, Jill Cooper, Peter E. Bradley, Ray Radebaugh, Marcia L. Huber, Yung-Cheng Lee
Joule-Thompson (J-T) based micro cryogenic coolers (MCCs) are attractive because they can provide the cryogenic temperatures needed for small electronic devices while having a low cost and small volumetric footprint. A compressor is a major part of a

High-resolution single-mode fiber-optic distributed Raman sensor for absolute temperature measurement using superconducting nanowire single-photon detectors

November 17, 2011
Author(s)
Michael G. Tanner, Shellee D. Dyer, Burm Baek, Robert Hadfield, Sae Woo Nam
We demonstrate a distributed fiber Raman sensor for absolute temperature measurement with spatial resolution on the order of 1 cm at 1550 nm wavelength in single mode fiber using superconducting nanowire single photon detectors. Rapid measurements are

Minimizing damage during FIB-TEM sample preparation of soft materials

November 17, 2011
Author(s)
Nabil Bassim, Bradley De Gregorio, A. D. Kilcoyne, Keana Scott, Tsngming Chou, S. Wirick, George Cody, Rhonda Stroud
Although focused ion beam (FIB) microscopy has been used successfully for milling patterns and creating ultra-thin transmission electron microscopy (TEM) sections of polymers and other soft materials, little has been documented regarding FIB-induced damage
Displaying 44276 - 44300 of 143797
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