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Displaying 38951 - 38975 of 73829

An Operator-Independent Approach to Mass Spectral Peak Identification and Integration

May 1, 2004
Author(s)
William E. Wallace, Anthony J. Kearsley, Charles M. Guttman
A mathematical algorithm is presented that accurately locates and calculates the area beneath mass spectral peaks using only reproducible mathematical operations and a NO user-selected sensitivity parameters. This represents a major refinement of last year

Data Standards for Proteomics: Mitochondrial Two-Dimensional Polyacrylamide Gel Electrophoresis Data as a Model System

May 1, 2004
Author(s)
Veerasamy Ravichandran, G B. Vasquez, S Srivastava, M Verma, E Petricoin, Joshua Lubell, Ram D. Sriram, Peter E. Barker, G L. Gilliland
The advent of human proteomics as a major discipline has led to a reexamination of the need for consensus and a nationally sanctioned set of proteomics technology standards. Such standards for databases and data reporting may be applied to Two-Dimensional

Design and Characterization of a Photometer--Colorimeter Standard

May 1, 2004
Author(s)
George P. Eppeldauer, M Racz
A photometer/tristimulus colorimeter has been developed at the National Institute of Standards and Technology (NIST) to realize a color scale. A novel construction was developed to implement the spectral responsivity based scale with small uncertainty. The

Determination of Optimal Parameters for CD-SEM Measurement of Line Edge Roughness

May 1, 2004
Author(s)
B Bunday, M R. Bishop, D Mccormack, John S. Villarrubia, Andras Vladar, Theodore V. Vorburger, Ndubuisi George Orji, J Allgair
The measurement of line-edge roughness (LER) has recently become a topic of concern in the litho-metrology community and the semiconductor industry as a whole. The Advanced Metrology Advisory Group (AMAG), a council composed of the chief metrologists from

Dimensional Metrology of Resist Lines Using a SEM Model-Based Library Approach

May 1, 2004
Author(s)
John S. Villarrubia, Andras Vladar, B Bunday, M R. Bishop
The widths of 284 lines in a 193 nm resist were measured by two methods and the results compared. One method was scanning electron microscopy (SEM) of cross-sections. The other was a model-based library (MBL) approach in which top-down CD-SEM line scans of

Eliminating Surface Melt Fracture Using PPA: The Role of PPA Domain Size

May 1, 2004
Author(s)
Mathurin G. Meillon, David C. Morgan, D Bigio, S B. Kharchenko, Kalman D. Migler, S Oriani
The investigation of the elimination of sharkskin using polymer processing aids (PPA) requires the consideration of factors such as: PPA domain size, operational shear rate and matrix/PPA viscosity ratio. In this work, the role of PPA droplet size in the

Evaluation of New In-Chip and Arrayed Line Overlay

May 1, 2004
Author(s)
Ravikiran Attota, Richard M. Silver, M R. Bishop, Egon Marx, Jay S. Jun, Michael T. Stocker, M P. Davidson, Robert D. Larrabee
Two types of overlay targets have been designed and evaluated for the study of optical overlay metrology. They are in-chip and arrayed overlay targets. In-chip targets are three-bar two-level targets designed to be placed in or near the active device area

Flat-Panel-Display Measurement Techniques and Concerns

May 1, 2004
Author(s)
Edward F. Kelley
We explore the problems that can be encountered in making common measurements on flat panel displays. Equipment usage techniques are reviewed and coordinated with the VESA FPDM2 as much as possible. Awareness of equipment limitations and stray-light

Fundamentals of Developer-Resist Interactions for Line-Edge Roughness and Critical Dimension Control in Model 248 nm and 157 nm Photoresists

May 1, 2004
Author(s)
Vivek M. Prabhu, M Wang, E Jablonski, B D. Vogt, Eric K. Lin, Wen-Li Wu, D L. Goldfarb, M Angelopoulos, H Ito
Organic polar solvent (1-butanol) versus aqueous base (tetramethylammonium hydroxide, (TMAH)) development quality are distinguished by neutral versus charged polymer (polyelectrolyte) dissolution behavior of photoresist bilayers on silicon substrates
Displaying 38951 - 38975 of 73829
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