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Ioannis Karageorgos, Elyssia S. Gallagher, Connor Galvin, David Travis Gallagher, Jeffrey W. Hudgens
Monoclonal antibody (mAb) pharmaceuticals are the fastest-growing class of therapeutics with a wide range of clinical applications. To assure their safety, these protein drugs must demonstrate highly consistent purity and stability. Key to these objectives
Pengfei Niu, Brian J. Nablo, Kiran Bhadriraju, Darwin Reyes-Hernandez
Here we describe the exact processes occurring between two metallic electrodes when measuring volumetric flow rate by electrical impedance in polydimethylsiloxane (PDMS) microchannel. A considerable fraction of the change in impedance, due to change of
Gurdaman Khaira, Manolis Doxastakis, Alec Bowen, Jiaxing Ren, Hyo S. Suh, Tamar Segal-Peretz, Xuanxuan Chen, Chun Zhou, Adam F. Hannon, Nicola Ferrier, Daniel Sunday, Roel Gronheid, Regis J. Kline, Paul Nealey, Juan J. DePablo
Vipin N. Tondare, John S. Villarrubia, Andras Vladar
Three-dimensional (3D) reconstruction of a sample surface from scanning electron microscope (SEM) images taken at two perspectives has been known for decades. However, this method has not been widely used in the semiconductor industry for 3D measurements
The Coulter particle counting method has been in use for more than five decades. It records a change in resistance when a particle flows from a large reservoir through a narrow orifice to another reservoir, where the flow direction is aligned with an
Christopher E. Sunday, Papa Amoah, Karl Montgomery, Yaw S. Obeng
In this paper, we discuss the use of broadband microwaves (MW) to characterize the thermal stability of organic and hybrid silicon-organic thin films meant for insulation applications in micro- and nanoelectronic devices. We take ad-vantage of MW
William A. Osborn, Lawrence H. Friedman, Mark D. Vaudin
We present a new methodology to accurately measure strain magnitudes from 3D nanodevices using Electron Backscatter Diffraction (EBSD). Because the dimensions of features on these devices are smaller than the interaction volume for backscattered electrons
Christina A. Hacker, Robert C. Bruce, Sujitra J. Pookpanratana
Innovation in the electronics industry is tied to interface engineering as devices increasingly incorporate new materials and shrink. Molecular layers offer a versatile means of tuning interfacial electronic, chemical, physical, and magnetic properties
Albert Davydov, Terrance P. O'Regan, Andrew A. Herzing, Dimitry Ruzmetov, Robert A. Burke, Kehao Zhang, A. Glen Birdwell, DeCarlos Taylor, E Byrd, Joshua A. Robinson, Tony G. Ivanov, M R. Neupane, S D. Walck
Integrating two-dimensional (2D) and three-dimensional (3D) semiconductors to realize vertical heterojunctions with novel electronic and optoelectronic properties is gaining interest from the device community. In this study, we utilize an approach that
Sarkar Anwar, William Vandenberghe, Gennadi Bersuker, Dmitry Veksler, Giovanni Verzellesi, Rohit Galatage, Creighton Buie, Adam Barton, Eric Vogel, Christopher Hinkle
Capacitance-voltage (C-V) measurement and analysis is highly useful for determining important information about metal-oxide-semiconductor (MOS) gate stacks. Parameters such as the equivalent oxide thickness (EOT), substrate doping density, flatband voltage