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Broadband Dielectric Spectroscopic Characterization of Thermal Stability of Low-k Die-lectric Thin Films for Micro- and Nanoelectronic Applications



Christopher E. Sunday, Papa K. Amoah, Karl R. Montgomery, Yaw S. Obeng


In this paper, we discuss the use of broadband microwaves (MW) to characterize the thermal stability of organic and hybrid silicon-organic thin films meant for insulation applications in micro- and nanoelectronic devices. We take ad-vantage of MW propagation characteristics to extract and examine the relationships between electrical properties and the chemistry of prototypical low-k materials. The impact of thermal anneal at modest temperatures is examined to shed light on the thermal-induced performance and reliability changes with-in the dielectric films. These changes are then correlated with the chemical changes in the films. These insights provide basis for rational selection of organic dielectrics for integrated devices.
ECS Journal of Solid State Science and Technology


low-k dielectric, broadband, microwave, thermal stability, decomposition, FTIR, attenuation constant
Created August 29, 2017, Updated November 10, 2018