An international round robin was organized to update SEMI Standard MS5: Test Method for Wafer Bond Strength Measurements using Micro-Chevron Test Structures. Results from the round robin allowed for inclusion of a Precision and Bias statement. The new version of MS5 shows that between-laboratory reproducibility was 152%, while the within laboratory repeatability was 111%. Since no Reference Materials exist for this method, no bias statement can be made at this time. In addition to including precision and bias, the test procedure was re-written for clarity and the analysis procedure was updated to allow for a wider range of geometry.
Conference Dates: December 6-8, 2009
Conference Location: Grenoble, -1
Conference Title: Procedings of the Conference on Wafer Bonding for Microsystems and Wafer Level Integration
Pub Type: Conferences
Microelectromechanical Systems, MEMS, Wafer Bond, Metrology