TY  - CONF
AU  - Richard Allen
AU  - Winthrop Baylies
AU  - Paul Langer
AU  - Ralph Danzl
AU  - Frank DelRio
AU  - Gavin Horn
AU  - Roy Knechtel
AU  - Michael Mattes
AU  - David Read
AU  - Sumant Sood
AU  - Kevin Turner
C2  - Procedings of the Conference on Wafer Bonding for Microsystems and Wafer Level Integration, Grenoble, -1
DA  - 2009-12-07
LA  - en
PB  - Procedings of the Conference on Wafer Bonding for Microsystems and Wafer Level Integration, Grenoble, -1
PY  - 2009
TI  - A ROUND ROBIN EXPERIMENT TO PROVIDE PRECISION AND BIAS FOR SEMI MS5: TEST METHOD FOR WAFER BOND STRENGTH MEASUREMENTS USING MICRO-CHEVRON TEST STRUCTURES
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=904232
ER  -